Nice — you can do a clean pulse + latch using a single quad Schmitt-NAND chip: 74HC132 (or 74LVC132 for 3.3 V systems). The HC132 contains four 2-input NAND gates with Schmitt inputs so you can both clean a noisy SYN480R DATA line and build an SR latch (NAND SR is active-LOW) inside one package. Only a few passives and a driver transistor are needed. Below is a ready-to-build recipe (parts, wiring, explanation, tuning tips, and an ASCII schematic) — no extra logic ICs required. Parts (per latch) 1 × 74HC132 (quad 2-input NAND with Schmitt inputs). If your system is 3.3 V use 74LVC132 / 74HC132 rated for 3.3 V. Rin = 47 kΩ (input series) Cfilter = 10 nF (input RC to ground) — tweak for debounce/clean time Rpulldown = 100 kΩ (pull-down at input node, optional) Rpullup = 100 kΩ (pull-up for active-LOW R input so reset is idle HIGH) Rbase = 10 kΩ, Q = 2N2222 (NPN) or small N-MOSFET (2N7002) to drive your load Diode for relay flyback (1N4001) if you drive a coil Optional small cap 0.1 µF decoupling at VCC of IC Concept / how it works (short) Use Gate1 (G1) of 74HC132 as a Schmitt inverter by tying its two inputs together and feeding a small RC filter from SYN480R.DATA. This removes HF noise and provides a clean logic transition. Because it's a NAND with tied inputs its function becomes an inverter with Schmitt behavior. Use G2 & G3 as the cross-coupled NAND pair forming an SR latch (active-LOW inputs S̄ and R̄). A low on S̄ sets Q = HIGH. A low on R̄ resets Q = LOW. Wire the cleaned/inverted output of G1 to S̄. A valid received pulse (DATA high) produces a clean LOW on S̄ (because G1 inverts), setting the latch reliably even if the pulse is brief. R̄ is your reset input (pushbutton, HT12D VT, MCU line, etc.) — idle pulled HIGH. Q drives an NPN/MOSFET to switch your load (relay, LED, etc.). Recommended wiring (pin mapping, assume one chip; use datasheet pin numbers) I’ll refer to the 4 gates as G1, G2, G3, G4. Use G4 optionally for additional conditioning or to build a toggler later. SYN480R.DATA --- Rin (47k) ---+--- Node A ---||--- Cfilter (10nF) --- GND | Rpulldown (100k) --- GND (optional, keeps node low) Node A -> both inputs of G1 (tie inputs A and B of Gate1 together) G1 output -> S̄ (S_bar) (input1 of Gate2) Gate2 (G2): inputs = S̄ and Q̄ -> output = Q Gate3 (G3): inputs = R̄ and Q -> output = Q̄ R̄ --- Rpullup (100k) --- VCC (reset is idle HIGH; pull low to reset) (optional) R̄ can be wired to a reset pushbutton to GND or to an MCU pin Q -> Rbase (10k) -> base of 2N2222 (emitter GND; collector to one side of relay coil) Other side of relay coil -> +V (appropriate coil voltage) Diode across coil If you prefer MOSFET low side switching: Q -> gate resistor 100Ω -> gate of 2N7002 2N7002 source -> GND ; drain -> relay coil low side

The 2N7002DW from iSion is a high-speed N-channel enhancement mode field-effect transistor (FET) designed for pulse amplifier and drive applications. Manufactured using the N-Channel DMOS process, this component offers robust performance with a maximum drain-source voltage (VDSS) of 60V and a gate-source voltage (VGSS) of +20V. It features a continuous drain current (ID) of 300mA and a pulsed drain current (IDM) of 800mA, making it suitable for demanding switching tasks. The 2N7002DW is compliant with ESD MIL-STD 833, providing +2.5KV contact discharge protection. Available in a compact SOT-363 package, the device also adheres to full RoHS standards, ensuring environmentally friendly compliance. Key electrical characteristics include a gate threshold voltage (VGS(th)) range of 1.0V to 2.5V, a static drain-source on-resistance (RDS(ON)) of up to 3.0Ω at VGS of 10V, and dynamic switching times with a turn-on delay (td(on)) of 6ns and a turn-off delay (td(off)) of 25ns. This transistor is ideal for engineers seeking reliable performance in high-speed pulse applications.

The 2N7002E is a small signal MOSFET produced by ON Semiconductor, designed for applications requiring a low RDS(on) and high efficiency in a compact SOT-23 package. This N-Channel MOSFET can handle a maximum drain-to-source voltage (VDSS) of 60 V and a continuous drain current (ID) of up to 310 mA at 25°C. It features trench technology for enhanced performance and is AEC-Q101 qualified, making it suitable for automotive and other high-reliability applications. The device is Pb-free, Halogen-free, and RoHS compliant. Typical applications include low side load switches, level shift circuits, DC-DC converters, and various portable devices such as digital still cameras (DSC), PDAs, and cell phones. The MOSFET's thermal characteristics include a junction-to-ambient thermal resistance of 417°C/W in steady state and 300°C/W for short durations (t ≤ 5 s). The 2N7002E is available in tape and reel packaging, with part numbers 2N7002ET1G and 2N7002ET7G for standard applications, and S2N7002ET1G and S2N7002ET7G for automotive-grade requirements.

The 2N7002H, manufactured by iSion, is an N-channel enhancement mode field-effect transistor (FET) designed for high-speed pulse amplifier and drive applications. Utilizing the N-Channel DMOS process, this component features robust ESD protection compliant with MIL-STD 833, +2.5KV contact discharge. The 2N7002H is available in a SOT-23 package, ensuring full RoHS compliance and superior solderability as per MIL-STD-202, Method 208. Key specifications include a drain-source voltage (VDSS) of 60V, a gate-source voltage (VGSS) of +20V, and a maximum continuous drain current (ID) of 300mA. The device boasts a low static drain-source on resistance (RDS(ON)) of 2.0Ω at VGS of 10V and ID of 300mA, and dynamic characteristics such as a turn-on delay time (td(on)) of 6ns and a turn-off delay time (td(off)) of 25ns. The component operates within a junction temperature range of -55°C to +150°C and offers thermal resistances of 357°C/W junction-to-ambient and 90°C/W junction-to-case.

The 2N7002DW, manufactured by iSion, is an N-channel enhancement mode field-effect transistor (FET) designed for high-speed pulse amplifier and drive applications. It is fabricated using the N-channel DMOS process and comes in a compact SOT-363 package. The component offers robust ESD protection compliant with MIL-STD 833, +2.5KV contact discharge. Key features include a drain-source voltage (VDSS) of 60V, a gate-source voltage (VGSS) of +20V, and a continuous drain current (ID) of 300mA, with a pulsed drain current (IDM) of 800mA. The device has a maximum power dissipation (PD) of 350mW and operates within a junction temperature range of -55°C to +150°C. Additionally, it exhibits a low static drain-source on-resistance (RDS(ON)) of 2.0Ω at VGS = 10V and ID = 300mA, making it suitable for efficient switching applications. The thermal resistance from junction to ambient (RθJA) is rated at 500°C/W, ensuring reliable performance in various thermal conditions.