2 resistencias de 1K 2 resistencias de 1,8K 1 resistencia de 3,3K 1 resistencia de 10K 2 resistencias de 47K 2 preset de 100K (ver texto) 2 capacitores de 10nF 4 capacitores de 100nF 3 capacitores de 100uF 25V 1 diodo 1N4007 2 diodos 1N4148 1 led amarillo 3mm 1 led rojo 3mm 2 circuitos integrados 555 1 relé de 12V 2 conectores con bornes de dos vías 1 conector con bornes de 3 vías 1 circuito impreso

Hiro Relay Hub 1.0 1. 2N2222 Triode - 32pcs 2. Aqy410s Relay - 32pcs 3. 1k resistor - 32pcs 4. s2b 2pin - 32pcs

Hiro Relay Hub 1.0 1. 2N2222 Triode - 32pcs 2. Aqy410s Relay - 32pcs 3. 1k resistor - 32pcs 4. s2b 2pin - 32pcs

Convertidor de resistencia a amperaje con potencimetro de 1K y salida de 4 a 20 mA 5Vcc

Resonate Pendant golden reference design. Board is a 39 mm x 63 mm portrait rectangle with 5 mm corner radii, 2-layer FR4, 0.8 mm thickness, 1 oz copper on both layers, matte black top solder mask, no bottom solder mask, ENEPIG finish, and no silkscreen on either side. Allowed components only: U1 STM32L052C8T6, U2 CH340E, U3 BQ24210DQCT, C1 10uF, C2 4.7uF, C3-C7 100nF, R1 24k, R2 1k, R3 10k, D1 green 0402 LED, MAG1-MAG4 magnetic pads, J1 solar solder pads, J2 battery solder pads, TP1-TP4 test pads. Required top artwork: golden-ratio grid lines and gold circles on F.Cu with mask openings, decorative only, 0.8-1.0 mm width, at least 0.5 mm from active traces. Required bottom artwork: exposed ENEPIG bottom copper split into FREQ_OUT 61.8 percent and GND 38.2 percent with an exact 0.20 mm S-curve isolation gap, no vias through bottom except one PA4-to-FREQ_OUT via at the extreme edge. Functional requirements: MAG1 and J1 VIN feed U3 IN, U3 OUT feeds J2 battery pad and system VBAT, MAG2 to U2 UD+, MAG3 to U2 UD-, MAG4 to common ground, U2 TX to U1 PA10, U2 RX to U1 PA9, U1 PA4 to bottom FREQ_OUT, U1 PA5 to R2 then D1 to GND, U3 ISET to R1 to GND, U3 TS to R3 to GND, decoupling exactly as specified. Prohibited items: external crystal, JST connectors, wireless module, antenna, separate regulator IC, ESD protection IC, USB-C connector, through-hole parts, bottom solder mask, silkscreen, more than three ICs, or any unapproved substitutions.