The FDB1D7N10CL7 is an N-Channel Shielded Gate POWERTRENCH® MOSFET manufactured by ON Semiconductor. This advanced MOSFET leverages ON Semiconductor's POWERTRENCH process, incorporating Shielded Gate technology to deliver minimized on-state resistance and superior switching performance with a high-quality soft body diode. The component features a maximum drain-to-source voltage (VDS) of 100 V and can handle continuous drain currents up to 268 A at 25°C. It boasts a low RDS(on) value of 1.7 mΩ at a gate-to-source voltage (VGS) of 12 V and drain current (ID) of 100 A, making it highly efficient for power management applications. Key applications include industrial motor drives, power supplies, automation, battery-operated tools, solar inverters, and energy storage systems. The FDB1D7N10CL7 is housed in a robust D2PAK7 (TO-263 7 LD) package and is designed to withstand a wide range of operating temperatures from -55°C to +175°C.

The ON Semiconductor® FDMC86102LZ is an advanced N-Channel Shielded Gate PowerTrench MOSFET designed for high-efficiency DC-DC switching applications. Featuring Shielded Gate Technology, this MOSFET boasts a maximum drain-to-source voltage (VDS) of 100 V and a continuous drain current (ID) capability of up to 22 A at 25°C. The device exhibits low on-state resistance with a maximum rDS(on) of 24 mΩ at VGS = 10 V and ID = 6.5 A, and 35 mΩ at VGS = 4.5 V and ID = 5.5 A. It includes a gate-to-source zener diode for enhanced ESD protection, with a typical HBM ESD protection level greater than 6 kV. The FDMC86102LZ is RoHS compliant, 100% UIL tested, and offers superior switching performance due to its optimized PowerTrench® process. The component is packaged in a compact MLP 3.3×3.3 format, making it ideal for space-constrained designs. Its thermal characteristics include a junction-to-case thermal resistance (RθJC) of 3°C/W and a junction-to-ambient thermal resistance (RθJA) of 53°C/W when mounted on a 1 in² pad of 2 oz copper.