LGA-16_3x3mm_P0.5mm
LGA-16 is a small surface-mount package commonly used for electronic components. It has a body size of approximately 3 mm x 3 mm (L x W) with 16 pins. The lead pitch between the pins is typically 0.5 mm. The package is also known as Land Grid Array 16 or LGA-16. #part #template... show more5 Uses
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MSOP-12-1EP_3x4mm_P0.65mm_EP1.65x2.85mm
MSOP-12-1EP is a small surface-mount package commonly used for integrated circuits. It has a body size of approximately 3 mm x 4 mm (L x W) with 12 pins. The lead pitch between the pins is typically 0.65 mm. The package features an exposed pad (EP) with dimensions of approximately 1.65 mm x 2.85 mm (L x W). The EP is used for thermal management and should be connected to a heat sink or PCB pad for optimal heat dissipation. The package is also known as Mini Small Outline Package 12-1EP or MSOP-12EP. #part #template... show more5 Uses
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TO-263-7 TabPin8
TO-263-7 TabPin8 is a surface-mount package commonly used for electronic components. It has a body size of approximately 10.2 mm x 12.2 mm x 3.2 mm (L x W x H) with 7 pins and a tab pin configuration. Pin 1 is typically located in the lower left corner when viewed from the flat side, while the tab pin, labeled as Pin 8, is connected to the tab or heat sink of the package. The lead pitch between the other pins is typically 2.54 mm. The package is also known as D2PAK-7, DPAK-7, or DDPAK-7. #part #template... show more2 Uses
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SOT-543
SOT-543 is a small surface-mount package commonly used for electronic components. It has a body size of approximately 1.6 mm x 1.2 mm x 0.55 mm (L x W x H) with 4 pins and a lead pitch of 0.5 mm. Pin 1 is located in the lower left corner when viewed from the flat side. The package is also known as SC-75, SMD75, or EMD3. #part #template... show more2 Uses
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SOT-553
SOT-553 is a small surface-mount package commonly used for electronic components. It has a body size of approximately 1.6 mm x 1.6 mm x 0.6 mm (L x W x H) with 5 pins and a lead pitch of 0.65 mm. Pin 1 is located in the lower left corner when viewed from the flat side. The package is also known as SC-89-5, SMD89-5, or EMD4. #part #template... show more2 Uses
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SOT-723
SOT-723 is a small surface-mount package commonly used for electronic components. It has a body size of approximately 1.1 mm x 0.8 mm x 0.4 mm (L x W x H) with 3 pins and a lead pitch of 0.65 mm. Pin 1 is located in the lower left corner when viewed from the flat side. The package is also known as SC-101, SMD101, or EMD6. #part #template... show more3 Uses
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LFCSP-16-1EP_3x3mm_P0.5mm_EP1.7x1.7mm
LFCSP-16-1EP is a small surface-mount package commonly used for electronic components. It has a body size of approximately 3 mm x 3 mm (L x W) with 16 pins. The lead pitch between the pins is typically 0.5 mm. The package features an exposed pad (EP) with a size of approximately 1.7 mm x 1.7 mm. #part #template... show more0 Uses
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MSOP-10-1EP_3x3mm_P0.5mm_EP1.68x1.88mm
MSOP-10-1EP is a small surface-mount package commonly used for integrated circuits. It has a body size of approximately 3 mm x 3 mm (L x W) with 10 pins. The lead pitch between the pins is typically 0.5 mm. The package features an exposed pad (EP) with dimensions of approximately 1.68 mm x 1.88 mm (L x W). The EP is used for thermal management and should be connected to a heat sink or PCB pad for optimal heat dissipation. The package is also known as Mini Small Outline Package 10-1EP or MSOP-10EP. #part #template... show more0 Uses
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HTSSOP-14-1EP_4.4x5mm_P0.65mm_EP3.4x5mm_Mask3x3.1mm
HTSSOP-14-1EP is a small surface-mount package commonly used for electronic components. It has a body size of approximately 4.4 mm x 5 mm (L x W) with 14 pins. The lead pitch between the pins is typically 0.65 mm. The package features an exposed pad (EP) with a size of 3.4 mm x 5 mm. The solder mask opening on the EP is approximately 3 mm x 3.1 mm. #part #template... show more1 Use
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TO-263-3 TabPin4
TO-263-3 TabPin4 is a surface-mount package commonly used for electronic components. It has a body size of approximately 10.4mm x 9.6mm x 4.6mm (L x W x H) with 3 pins and a tab pin configuration. Pin 1 is typically located in the lower left corner when viewed from the flat side, while the tab pin, labeled as Pin 4, is connected to the tab or heat sink of the package. The package is also known as D2PAK-3, DPAK-3, or DDPAK-3. #part #template... show more4 Uses
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SOT-666
SOT-666 is a small surface-mount package commonly used for electronic components. It has a body size of approximately 1.2mm x 0.8mm x 0.4mm (L x W x H) with N pins and a lead pitch of 0.5mm. Pin 1 is located in the lower left corner when viewed from the flat side. #part #template... show more0 Uses
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TSOT-23-8
TSOT-23-8 is a small surface-mount package commonly used for electronic components. It has a body size of approximately 2.8 mm x 2.8 mm x 0.9 mm (L x W x H) with 8 pins. The lead pitch between the pins is typically 0.95 mm. The package is also known as Thin Small Outline Transistor 23-8 or TSOT-23-8. #part #template... show more0 Uses
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DFN-8-1EP_3x3mm_P0.65mm_EP1.7x2.05mm
DFN-8-1EP is a small surface-mount package commonly used for integrated circuits. It has a body size of approximately 3 mm x 3 mm (L x W) with 8 pins. The lead pitch between the pins is typically 0.65 mm. The package features an exposed pad (EP) with dimensions of approximately 1.7 mm x 2.05 mm (L x W). The EP is used for thermal management and should be connected to a heat sink or PCB pad for optimal heat dissipation. The package is also known as Dual Flat No-leads 8-1EP or DFN-8EP. #part #template... show more1 Use
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WSON-6-1EP_2x2mm_P0.65mm_EP1x1.6mm
WSON-6-1EP is a small surface-mount package commonly used for integrated circuits. It has a body size of approximately 2 mm x 2 mm (L x W) with 6 pins. The lead pitch between the pins is typically 0.65 mm. The package features an exposed pad (EP) with dimensions of approximately 1 mm x 1.6 mm (L x W). The EP is used for thermal management and should be connected to a heat sink or PCB pad for optimal heat dissipation. The package is also known as WSON-6EP. #part #template... show more1 Use
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SO-6_4.4x3.6mm_P1.27mm
SO-6 is a small surface-mount package commonly used for integrated circuits. It has a body size of approximately 4.4 mm x 3.6 mm (L x W) with 6 pins. The lead pitch between the pins is typically 1.27 mm. The package is also known as Small Outline 6 or SOIC-6. #part #template... show more1 Use
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SOT-665
SOT-665 is a small surface-mount package commonly used for electronic components. It has a body size of approximately 2.3 mm x 2 mm x 1 mm (L x W x H) with N pins and a lead pitch of P mm. Pin 1 is located in the lower left corner when viewed from the flat side. #part #template... show more1 Use
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MSOP-16-1EP_3x4mm_P0.5mm_EP1.65x2.85mm
MSOP-16-1EP is a small surface-mount package commonly used for integrated circuits. It has a body size of approximately 3 mm x 4 mm (L x W) with 16 pins. The lead pitch between the pins is typically 0.5 mm. The package features an exposed pad (EP) with dimensions of approximately 1.65 mm x 2.85 mm (L x W). The EP is used for thermal management and should be connected to a heat sink or PCB pad for optimal heat dissipation. The package is also known as Mini Small Outline Package 16-1EP or MSOP-16EP. #part #template... show more0 Uses
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LGA-12_2x2mm_P0.5mm
LGA-12 is a small surface-mount package commonly used for electronic components. It has a body size of approximately 2 mm x 2 mm (L x W) with 12 pins. The lead pitch between the pins is typically 0.5 mm. The package is also known as Land Grid Array 12 or LGA-12. #part #template... show more0 Uses
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MSOP-16_3x4mm_P0.5mm
MSOP-16 is a small surface-mount package commonly used for integrated circuits. It has a body size of approximately 3 mm x 4 mm (L x W) with 16 pins. The lead pitch between the pins is typically 0.5 mm. The package is also known as Mini Small Outline Package 16 or MSOP-16. #part #template... show more0 Uses
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LFCSP-8_2x2mm_P0.5mm
LFCSP-8 is a small surface-mount package commonly used for integrated circuits. It has a body size of approximately 2 mm x 2 mm (L x W) with 8 pins. The lead pitch between the pins is typically 0.5 mm. The package is also known as Lead Frame Chip Scale Package 8 or LFCSP-8. #part #template... show more0 Uses
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