• SOT-89-3 6da9

    SOT-89-3 6da9

    SOT-89-3 is a small surface-mount package commonly used for electronic components. It has a body size of approximately 4.5 mm x 4.5 mm x 1.6 mm (L x W x H) with 3 pins. The lead pitch between the pins is typically 1.27 mm. The package is also known as Small Outline Transistor 89-3 or SOT-89-3. #part #template

    kevy

    2 years ago

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  • Precision Burst Timer - SMD

    Precision Burst Timer - SMD

    Compact surface-mount production variant of the fixed-function, crystal-referenced low-power burst timer. Electrically equivalent to the through-hole version where practical, with selectable interval, duration, carrier frequency, AUTO/TEST mode, ENABLE output, and gated OSC_OUT; no MCU, firmware, PLL, VCO, or programmable logic.

    12 days ago

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  • Camera Gimbal Motherboard

    Camera Gimbal Motherboard

    Motherboard for a camera gimbal system using off-the-shelf modules where practical, including Wiznet Pico W5500, UART-to-RS232, power supply modules, and BaseCam SimpleBGC 32-bit Extended. Design preference is mostly through-hole modules/connectors with surface-mount support components as needed.

    2 months ago

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  • LED Glasses

    LED Glasses

    LED sunglasses that use PCBs as the frame, with cross-hatched cutouts for visibility. The sunglasses will have surface-mounted RGB LEDs and be powered by an external battery pack. The frame should be lightweight, futuristic, and visually striking with custom LED light patterns that can be programmed and controlled via a microcontroller.

    2 years ago

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  • Microbit 40 Pin Connecto

    Microbit 40 Pin Connecto

    This surface-mount edge connector is designed specifically for the micro:bit. It's very slim and fully SMT. It also only has contacts on one side, just like the 'bit. This version is a Straight style where the micro:bit plugs-in perpendicular to the PCB.

    2 years ago

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  • IRFS3806

    IRFS3806

    N-Channel IRFS3806 V_DS (Drain-Source Voltage): 60V I_D (Continuous Drain Current): 43A R_DS(on) (On-Resistance): Very low, around 0.0045Ω Package: D2PAK (Surface-mount)

    2 years ago

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  • SOT-89-3 gDMA

    SOT-89-3 gDMA

    SOT-89-3 is a small surface-mount package commonly used for electronic components. It has a body size of approximately 4.5 mm x 4.5 mm x 1.6 mm (L x W x H) with 3 pins. The lead pitch between the pins is typically 1.27 mm. The package is also known as Small Outline Transistor 89-3 or SOT-89-3. #part #template

    2 years ago

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  • SOIC-16_3.9x9.9mm_P1.27mm

    SOIC-16_3.9x9.9mm_P1.27mm

    SOIC-16 (Small Outline Integrated Circuit 16) is a surface-mount integrated circuit (IC) package with 16 pins arranged in two rows, with a rectangular body size of 3.9 mm x 9.9 mm and a standard 1.27 mm lead pitch. It is commonly used for a variety of low to medium power applications, including microcontrollers, amplifiers, and voltage regulators. 16-SOIC #part #template

    2 years ago

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  • TCPBL18336MTBA0055 7f0b

    TCPBL18336MTBA0055 7f0b

    The Samsung Electro-Mechanics Polymer Tantalum Capacitor, part number TCPBL18336MTBA0055, meets RoHS and Halogen compliance specifications, offering a high-performance solution for a wide range of electronic applications. This surface-mount component is characterized by a capacitance of 33uF with a tolerance of +20%, an 18V rated voltage, and maximum ESR of 55mΩ. Packaged in a compact 3528 footprint with dimensions of 3.5 x 2.8 x 1.2mm, its design is optimized for robust performance in a variety of circuit environments. The capacitor features advanced reliability under conditions such as soldering heat, moisture resistance, and temperature cycling, ensuring stable operation within a temperature range from -55℃ to +105℃. Additional specifications include a maximum leakage current of 59.4uA and notable surge voltage capabilities of up to 23.4V. Ideal for electrical engineers seeking components that provide reliable, long-term performance while adhering to stringent environmental standards, its recommended soldering method is reflow, highlighting its ease of integration into existing manufacturing processes.

    2 years ago

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