SOT-89-3 is a small surface-mount package commonly used for electronic components. It has a body size of approximately 4.5 mm x 4.5 mm x 1.6 mm (L x W x H) with 3 pins. The lead pitch between the pins is typically 1.27 mm. The package is also known as Small Outline Transistor 89-3 or SOT-89-3. #part #template

LED sunglasses that use PCBs as the frame, with cross-hatched cutouts for visibility. The sunglasses will have surface-mounted RGB LEDs and be powered by an external battery pack. The frame should be lightweight, futuristic, and visually striking with custom LED light patterns that can be programmed and controlled via a microcontroller.

This surface-mount edge connector is designed specifically for the micro:bit. It's very slim and fully SMT. It also only has contacts on one side, just like the 'bit. This version is a Straight style where the micro:bit plugs-in perpendicular to the PCB.

The OPAx863 series from Texas Instruments includes the OPA863, OPA2863, and OPA4863, which are low-power, rail-to-rail input/output, voltage-feedback operational amplifiers designed for high-performance applications. These amplifiers feature a unity-gain bandwidth of 110 MHz, a gain-bandwidth product of 50 MHz, and a low quiescent current of 700 µA per channel. The devices operate across a wide supply voltage range of 2.7 V to 12.6 V, making them suitable for both portable and battery-powered systems. With a slew rate of 105 V/µs, 5.9 nV/√Hz input voltage noise, and exceptional harmonic distortion performance (-129 dBc HD2, -138 dBc HD3 at 20 kHz for 2 Vpp output), the OPAx863 is adept for driving SAR and ΔΣ ADCs, acting as ADC reference buffers, low-side current sensing, photodiode TIA interfaces, and other high-precision tasks. Additional features include overload power limiting, output short-circuit protection, and a power-down mode with minimal quiescent current, making the OPAx863 series a versatile and robust choice for applications requiring low power and high-precision analog performance. The series includes single, dual, and quad-channel configurations available in various surface-mount packages to fit different design requirements.

N-Channel IRFS3806 V_DS (Drain-Source Voltage): 60V I_D (Continuous Drain Current): 43A R_DS(on) (On-Resistance): Very low, around 0.0045Ω Package: D2PAK (Surface-mount)

SOT-89-3 is a small surface-mount package commonly used for electronic components. It has a body size of approximately 4.5 mm x 4.5 mm x 1.6 mm (L x W x H) with 3 pins. The lead pitch between the pins is typically 1.27 mm. The package is also known as Small Outline Transistor 89-3 or SOT-89-3. #part #template

SOIC-16 (Small Outline Integrated Circuit 16) is a surface-mount integrated circuit (IC) package with 16 pins arranged in two rows, with a rectangular body size of 3.9 mm x 9.9 mm and a standard 1.27 mm lead pitch. It is commonly used for a variety of low to medium power applications, including microcontrollers, amplifiers, and voltage regulators. 16-SOIC #part #template

The Samsung Electro-Mechanics Polymer Tantalum Capacitor, part number TCPBL18336MTBA0055, meets RoHS and Halogen compliance specifications, offering a high-performance solution for a wide range of electronic applications. This surface-mount component is characterized by a capacitance of 33uF with a tolerance of +20%, an 18V rated voltage, and maximum ESR of 55mΩ. Packaged in a compact 3528 footprint with dimensions of 3.5 x 2.8 x 1.2mm, its design is optimized for robust performance in a variety of circuit environments. The capacitor features advanced reliability under conditions such as soldering heat, moisture resistance, and temperature cycling, ensuring stable operation within a temperature range from -55℃ to +105℃. Additional specifications include a maximum leakage current of 59.4uA and notable surge voltage capabilities of up to 23.4V. Ideal for electrical engineers seeking components that provide reliable, long-term performance while adhering to stringent environmental standards, its recommended soldering method is reflow, highlighting its ease of integration into existing manufacturing processes.