GH CSSRM4.24-V7V9-1-1-700-R33 LED-SMD_3P-L3.0-W3.0-P1.10-RD-1 LCSC Part Number: C2899079 JLCPCB Part Class: Extended Part Manufactured by OSRAM(欧司朗)

Connector Header Surface Mount, Right Angle 10 position 0.049\" (1.25mm) #CommonPartsLibrary #Connector #Header #GH

Connector Header Surface Mount, Right Angle 3 position 0.049" (1.25mm) JST GH 1.25mm Pitch

Connector Header Surface Mount, Right Angle 2 position 0.049" (1.25mm) JST GH 1.25mm Pitch

Connector Header Surface Mount, Right Angle 9 position 0.049" (1.25mm) JST GH 1.25mm Pitch

1x4P 4P GH Tin 4 -25℃~+85℃ 1A 1 1.25mm Phosphor Bronze Standing paste SMD,P=1.25mm Wire To Board / Wire To Wire Connector ROHS BM04B-GHS-TBT(LF)(SN) CONN-SMD_4P-P1.25_BM04B-GHS-TBT-LF-SN LCSC Part Number: C161692 JLCPCB Part Class: Extended Part Manufactured by JST

1x2P 2P GH Tin 2 -25℃~+85℃ 1A 1 1.25mm Phosphor Bronze Horizontal attachment SMD,P=1.25mm,Surface Mount，Right Angle Wire To Board Connector ROHS / Wire To Wire Connector SM02B-GHS-TB(LF)(SN) CONN-SMD_SM02B-GHS-TB-LF-SN LCSC Part Number: C189893 JLCPCB Part Class: Extended Part Manufactured by JST

1x3P 3P GH Tin 3 -25℃~+85℃ 1A 1 1.25mm Phosphor Bronze Horizontal attachment SMD,P=1.25mm,Surface Mount，Right Angle Wire To Board Connector ROHS SM03B-GHS-TB(LF)(SN) CONN-TH_SM03B-GHS-TB-LF-SN LCSC Part Number: C514175 JLCPCB Part Class: Extended Part Manufactured by JST

1x3P 3P GH Tin 3 -25℃~+85℃ 1A 1 1.25mm Phosphor Bronze Standing paste SMD,P=1.25mm Wire To Board Connector ROHS BM03B-GHS-TBT(LF)(SN) CONN-TH_BM03B-GHS-TBT-LF-SN LCSC Part Number: C161691 JLCPCB Part Class: Extended Part Manufactured by JST

Current Sensors GHS10-SME SOIC-8_L4.9-W3.9-P1.27-LS6.0-BL LCSC Part Number: C454786 JLCPCB Part Class: Extended Part Manufactured by LEM(莱姆)

Wire To Board / Wire To Wire Connector GH-7PWT CONN-SMD_GH-7PWT LCSC Part Number: C2763653 JLCPCB Part Class: Extended Part Manufactured by FG(富港)

The PCB antenna presented in this document performs well for all frequencies in the 2.4-GHz ISM band. Except for two narrow dips, the antenna has an omni directional radiation pattern in the plane of the PCB. These properties will ensure stable performance regardless of operating frequency and positioning of the antenna.

Bluetooth, WiFi 802.11b/g/n, Bluetooth v5.0 Transceiver Module 2.4GHz PCB Trace Surface Mount The ESP32-S3-WROOM-1-N16R8 is a high-performance Wi-Fi + Bluetooth Low Energy (BLE) module developed by Espressif Systems. It is built around the ESP32-S3 SoC, featuring a dual-core Xtensa LX7 32-bit processor running up to 240 MHz. This module integrates 16 MB Flash memory and 8 MB PSRAM, making it suitable for memory-intensive applications such as AI, image processing, and advanced IoT systems. It also includes an onboard PCB trace antenna, RF circuitry, crystal oscillator, and power management components—allowing designers to quickly integrate wireless connectivity into compact embedded designs. Key Features Processing & Memory Dual-core Xtensa LX7 CPU, up to 240 MHz 384 KB ROM, 512 KB SRAM + 16 KB RTC SRAM 16 MB Flash (Quad SPI) 8 MB PSRAM (Octal/Quad SPI) Connectivity 2.4 GHz Wi-Fi (802.11 b/g/n) Bluetooth 5 (LE) + Mesh support Integrated PCB antenna Peripherals & Interfaces Up to 36 GPIOs Interfaces: UART, SPI, I2C, I2S, PWM, ADC, USB OTG Built-in USB Serial/JTAG support Supports touch sensors, timers, watchdogs, CAN (TWAI) Electrical Characteristics Supply voltage: 3.0 V – 3.6 V TX power: up to ~20.5 dBm RX sensitivity: ~-103.5 dBm Operating temp: −40 °C to +65 °C (typical) Advanced Capabilities Optimized for AI acceleration (vector instructions) Suitable for voice recognition, image processing, and edge AI Low-power modes for battery-operated devices| Typical Applications IoT devices and sensor hubs Smart home & home automation AIoT (voice/image recognition) Industrial automation & monitoring Wearables and health devices USB-connected embedded systems #Module #RF-Transceiver #ESP32-S3

Bluetooth, WiFi 802.11b/g/n, Bluetooth v5.0 Transceiver Module 2.4GHz PCB Trace Surface Mount The ESP32-S3-WROOM-2-N32R16V is a powerful dual-core microcontroller module that integrates wireless connectivity, large memory, and hardware acceleration for AI and signal processing tasks. It is particularly suited for applications requiring edge AI, voice recognition, and high-speed data processing, while still maintaining low power consumption. Dual-core Xtensa LX7 CPU Up to 240 MHz Includes vector instructions for AI and DSP workloads Wi-Fi 2.4 GHz (802.11 b/g/n) Bluetooth 5 (LE) N32 → 32 MB external Flash R16 → 16 MB PSRAM Built for memory-intensive applications #commonpartslibrary #transceiver #wireless #rf