Low-Power, Two-Port, High-Speed, USB2.0 (480Mbps) or UART Switch, MSOP-10 USB 2.0 UART High Speed Switch MSOP*3x3mm*P0.5mm*

Buck Switching Regulator IC 0.5V~1.5V 1 Output 7A WLCSP-20 The RK860-2 is a low-dropout (LDO) linear voltage regulator IC designed to provide a stable, low-noise output voltage from a higher input supply. It is commonly used in small electronic modules, microcontroller power rails, and low-power analog/digital circuits where clean voltage regulation is important. Type: Low Dropout Linear Regulator (LDO) Input voltage: Typically up to ~6V (varies by variant) Output voltage: Fixed or adjustable (depends on suffix version) Dropout voltage: Low (suitable for battery-powered systems) Output current: ~300 mA to 600 mA class (package dependent) #CommonPartsLibrary #IntegratedCircuit #PowerManagement #RK860

GPS01-TD module is a quad-mode Mini GPS module that supports BDS/GPS/GLONASS/Galileo/QZSS/SBAS and fully supports BeiDou B3, which can provide users with high quality, strong anti-jamming and low-power positioning and navigation solutions.

8-Bit to 12-Bit Low-Power Angle Sensor with Integrated Wake-Up Angle Detection #ultralibrarian

The AP22916 is a small, low leakage, single P-channel power MOSFET designed for low-power consumption and load-switching applications. LOAD SWITCH X1-WLB0808-4 T&R 3K Power Switch/Driver 1:1 P-Channel 2A X1-WLB0808-4

Low-Power Rail-To-Rail Output 12-Bit Serial Input DAC SOT-23-8

The CH32V203 is an industrial-grade enhanced low-power general-purpose MCU based on 32-bit RISC-V core. RISC-V WCH MCU TSSOP*4.4x6.5mm*P0.65mm*

Humidity, Temperature 0 ~ 100% RH I2C ±1.8% RH 4 s Surface Mount The SHT41-AD1B-R3 is a high-precision digital humidity and temperature sensor developed by Sensirion. It integrates calibrated sensing elements, analog signal processing, and a digital communication interface within a compact surface-mount package optimized for space-constrained embedded applications. The device is designed for accurate environmental monitoring across industrial, consumer, HVAC, portable electronics, and IoT systems. The sensor utilizes Sensirion CMOSens® technology to provide stable long-term performance, fast response time, and excellent repeatability under varying environmental conditions. Factory calibration enables direct digital output without the need for external calibration circuitry. The integrated I²C interface simplifies system integration with microcontrollers and embedded processors. The SHT41-AD1B-R3 is engineered for low-power operation, making it suitable for battery-powered and energy-efficient designs. Its compact DFN package supports automated assembly processes and high-density PCB layouts. The device also incorporates advanced internal diagnostics and checksum protection to improve communication reliability and data integrity. Features High-accuracy relative humidity sensing High-accuracy temperature measurement Fully calibrated and linearized digital output I²C digital communication interface Low power consumption optimized for portable systems Fast response and measurement conversion time Excellent long-term stability and repeatability Integrated heater functionality for condensation mitigation Wide operating voltage range Compact surface-mount DFN package Factory-trimmed and tested performance High immunity to environmental stress and contamination Low drift over product lifetime Suitable for reflow soldering processes Electrical Characteristics Supply voltage supports low-voltage embedded systems Digital communication compatible with standard I²C hosts Low standby current consumption Optimized active measurement current Integrated CRC data protection for communication integrity Environmental Characteristics Wide operating temperature range Wide relative humidity operating range Designed for high reliability in industrial and consumer environments Resistant to moisture-induced performance degradation Supports long operational lifetime with stable calibration Package Information Compact DFN surface-mount package Moisture-sensitive device suitable for automated assembly RoHS compliant and halogen-free construction Tape-and-reel packaging configuration for production assembly Applications Environmental monitoring systems HVAC and climate control equipment Smart home and IoT devices Portable electronics Industrial automation systems Data loggers and instrumentation Weather monitoring equipment Indoor air quality monitoring Battery-powered sensor nodes Consumer electronic products #commonpartslibrary #sensor #temperature #humidity #environmentalsensor #i2c #embedded #industrial #iot #sensirion

1 MHz, Low-Power Op Amp 8-SOIC #CommonPartLibrary #IntegratedCircuits #Amplifiers #Instrumentation #OPAmp #BufferAmps #Linear #MCP6002

Female Header 38 Position 2.54mm Pitch Dual Row Through Hole -40℃~+105℃ X6521FV-2x19-C85D32 is a 2.54 mm pitch, dual-row female header connector manufactured by XKB Connection. It is designed for through-hole PCB mounting and provides a reliable board-to-board or wire-to-board interconnection solution in industrial, consumer, and embedded electronic applications. The connector features 38 positions (2×19) arranged in two rows and supports moderate power and signal transmission requirements. Key Features Connector Type: Female Header / Receptacle Number of Positions: 38 contacts (2×19 configuration) Pitch: 2.54 mm (0.1 inch) Row Spacing: 2.54 mm Mounting Type: Through-Hole (THT) Orientation: Top-entry Rated Current: 3 A per contact Rated Voltage: 250 V Contact Material: Brass Contact Plating: Gold-plated contacts for improved conductivity and corrosion resistance Insulator Height: 8.5 mm Operating Temperature Range: -40°C to +105°C Hole Type: Square socket contacts RoHS Compliant Typical Applications Microcontroller and development boards Industrial control systems Embedded electronics Board-to-board interconnections Prototyping and evaluation hardware Signal and low-power distribution connections #CommonPartsLibrary #Connector

High Performance and Low-power Processor for Digital Media Application #CommonPartsLibrary #IntegratedCircuits #Processor

BGA-565(15.5x14.4) Microcontrollers, Quad-core ARM Cortex-A55 processor The RK3566 is a high-performance, low-power 64-bit application processor developed by Rockchip for AIoT, industrial control, smart displays, tablets, embedded systems, and single-board computers. It integrates a quad-core ARM Cortex-A55 CPU, Mali-G52 GPU, AI acceleration engine (NPU), advanced multimedia processing, and a rich set of connectivity interfaces, making it suitable for Linux- and Android-based applications requiring efficient performance and multimedia capabilities. Key Features Quad-core 64-bit ARM Cortex-A55 processor operating up to 2.0 GHz. ARM Mali-G52 2EE GPU with support for OpenGL ES 3.2, OpenCL 2.0, and Vulkan 1.1. Integrated NPU delivering up to 1 TOPS AI computing performance. Supports DDR3, DDR3L, DDR4, LPDDR3, LPDDR4, and LPDDR4X memory. Hardware video decoding up to 4K@60fps for H.264, H.265, and VP9 formats. Hardware video encoding up to 1080p@60fps for H.264 and H.265. Built-in 8MP ISP with HDR image processing support. Multiple display interfaces including HDMI 2.0, eDP, MIPI-DSI, LVDS, RGB, and E-Ink. High-speed connectivity with USB 3.0, USB 2.0, PCIe, SATA, Gigabit Ethernet, SDIO, and eMMC 5.1. Rich peripheral support including UART, SPI, I²C, PWM, ADC, I²S, PDM, and GPIO. Optimized for Android, Linux, industrial HMI, smart home, edge computing, and AIoT applications. Manufactured using a 22 nm process for improved power efficiency. #RK3566 #Rockchip #ARMCortexA55 #MaliG52 #AIoT #EmbeddedSystems #SingleBoardComputer #Linux #Android #IndustrialControl #SmartDisplay #EdgeComputing #SoC #Processor #NPU #4KVideo #IoT #Electronics #HardwareDesign #PCBDesign

802.15.4, Bluetooth, WiFi 802.11a/b/g/n/ac/ax, Bluetooth v5.3, Zigbee® Transceiver Module 2.4GHz, 5GHz Antenna Not Included, U.FL/MHF, PCB Trace Surface Mount The LBES5PL2EL-923 is a compact, low-power Bluetooth® Low Energy (BLE) module developed by Murata. It integrates a Nordic Semiconductor SoC (nRF52 series) with an onboard antenna, providing a complete RF solution for wireless connectivity in embedded systems. The module is designed for IoT, wearable, and low-power wireless applications, offering reliable communication, small footprint, and minimal external component requirements. Key Features Integrated Bluetooth® Low Energy (BLE) 5.x compliant module Based on Nordic Semiconductor nRF52 series SoC Built-in chip antenna (no external antenna required) Ultra-low power consumption suitable for battery-powered devices Integrated RF matching and shielding Supports multiple BLE roles (Central, Peripheral, Broadcaster, Observer) Compact surface-mount package Pre-certified RF module (reduces certification effort) Electrical Characteristics Supply Voltage Operating Voltage: 1.7 V to 3.6 V Current Consumption TX Mode: ~5–10 mA (depending on output power) RX Mode: ~5 mA Sleep Mode: < 2 µA RF Characteristics Frequency Band: 2.4 GHz ISM (2400–2483.5 MHz) Output Power: up to +4 dBm Sensitivity: approx. -96 dBm Interfaces UART SPI I²C (TWI) GPIO (multiplexed) ADC inputs PWM Mechanical Specifications Package Type: Surface Mount Module (SMD) Dimensions: ~10 mm × 7 mm × 1.4 mm (approx.) Integrated antenna and shielding Environmental Ratings Operating Temperature: -40°C to +85°C Storage Temperature: -40°C to +125°C Compliance & Certifications Bluetooth SIG qualified FCC / IC / CE (module-level certification, varies by variant) RoHS compliant Applications IoT devices Wearables Smart home products Wireless sensors Industrial monitoring systems Pin Configuration (Summary) Power: VDD, GND Communication: UART, SPI, I²C GPIOs: Configurable digital I/O RF: Integrated antenna (no RF pin required) Design Considerations Follow recommended PCB layout for antenna clearance Avoid copper under antenna region Provide stable power supply with proper decoupling capacitors Ensure proper grounding for RF performance #commonpartslibrary #integratedcircuit #transceiver #wireless #rf

SDRAM - Mobile LPDDR4 Memory IC 48Gbit 2.133 GHz MT53E1536M32D4DT-046 WT:A is a high-density 48Gb (6GB) LPDDR4/LPDDR4X SDRAM memory device from Micron Technology. It is designed for high-performance, low-power applications requiring fast memory bandwidth and efficient power management. The device features a 32-bit data bus, supports data rates up to 4266 MT/s, and is packaged in a compact 200-ball FBGA, making it suitable for embedded computing, industrial systems, networking equipment, AI edge devices, automotive electronics, and mobile platforms. Key Features 48Gb (6GB) LPDDR4/LPDDR4X SDRAM Organized as 1.5G × 32 bits Data transfer rates up to 4266 MT/s Maximum clock frequency of 2133 MHz Low-power operation with 1.1V core supply 32-bit memory interface 200-ball FBGA package JEDEC LPDDR4-compliant architecture Per-bank refresh support Temperature-compensated refresh Self-refresh and deep power-down modes Partial-array self-refresh capability High bandwidth with reduced power consumption Optimized for compact embedded designs Operating temperature range: –30°C to +85°C Typical Applications Embedded Linux computers Single-board computers (SBCs) AI and edge computing platforms Industrial automation systems Networking and telecommunications equipment Automotive infotainment and control systems Tablets and mobile devices FPGA and SoC-based designs #commonpartslibrary #integratedcircuit #memory #dram #sdram #lpddr4 #lpddr4x #mobiledram #micron #embeddedsystems #embeddedcomputing #industrialelectronics #automotiveelectronics #edgecomputing #artificialintelligence #networking #telecommunications #highspeedmemory #lowpowerdesign #computerhardware #electroniccomponents #semiconductor #datasheet #fbga #memorychip #electronicsdesign #pcbdesign #hardwareengineering #electronicengineering #systemonchip #fpga #iot #internetofthings #computermemory #digitalelectronics #surfaceMount #smt #bga #storage #highperformancecomputing #hpc #mobiledevices #industrialautomation #electronicdesign #componentlibrary #fluxlibrary #parametricpart #eda #schematic #pcb #electronicdesignautomation #chipdesign #embeddedhardware #memorymodule #lowpowerelectronics #highbandwidthmemory #electronics #hardwaredevelopment #engineering #electricalengineering