# Charles Sauer
**Handle:** @sauerc
## Stats
- **Projects:** 3
- **Components:** 0
- **Followers:** 0
- **Following:** 0
## More
- [Starred Projects](https://www.flux.ai/sauerc/starred.md)
## Projects (Page 1 of 1, 1 total)
- [[4-layer] OSHPARK Constraints](https://www.flux.ai/sauerc/4-layer-oshpark-constraints.md) - Use this template if you're planning to get your board manufactured in OSHPARK. It has the via min/max and trace width constraints already baked as global rules. #project-template #template #manufacturer-design-rules
OSHpark 4-layer stackup specs:
Top overlay or silkscreen: 1 mil thick
Top solder mask or solder resist: 1 mil thick
Top copper: 1.7 mil thick on 1 oz copper
Dielectric: 7.96 mil thick FR408HG 2113
Mid layer 1: 0.68 mil thick on 0.5 oz copper
Dielectric core: 39 mil thick FR408HR
Mid layer 2: 0.68 mil thick on 0.5 oz copper
Dielectric: 7.96 mil thick FR408HG 2113
Bottom copper: 1.7 mil thick on 1 oz copper
Bottom solder mask or solder resist: 1 mil thick
Bottom overlay or silkscreen: 1 mil thick
## Pages
- Pages: **1**
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