Storage Options for ESP32


Is there storage in this?
Yes.
  • Removable storage: A microSD card socket U4 is on the schematic (Molex 0472192001). It’s wired to the ESP32 via SDIO (CLK/CMD/DAT0–3), so you can use a microSD card for files/logs.
  • On‑module storage: The ESP32 module U1 is ESP32-S3-WROOM-1-N8R8; per its datasheet this variant includes 8 MB Quad SPI flash (plus 8 MB PSRAM), which can store firmware and limited data.
Do you plan to log primarily to microSD, or also use internal flash for smaller datasets?
instead of using Microsd, Could you suggest how I can Add, SPI NAND FLASH 8GB?
Great idea—yes, you can replace the microSD socket U4 with an external SPI NAND device for solid-state storage.
First, a quick clarification
  • Do you mean 8 GB (gigabytes) or 8 Gb (gigabits = 1 GB)? SPI NAND commonly tops out in the multi‑Gb range per die; true 8 GB is typically done with eMMC.
Two practical paths
  1. SPI NAND (data storage, 3.3V preferred)
  • Interface: Use CS#, CLK, IO0–IO3 (QSPI). Avoid ESP32 boot-strap pins.
  • Power: Run from 3.3V to avoid level shifting. If the part is 1.8V-only, add a 1.8V LDO and level translators.
  • Termination: Add series termination resistors of 22Ω–33Ω (at minimum on CLK; also consider D0–D3 if edges are too fast).
  • Decoupling: 0.1 µF at each VCC pin plus a local 4.7–10 µF bulk nearby.
  • Pins to tie: WP#/HOLD# (if present) per the datasheet (pull-ups or tie-offs). Terminate all unused pins per their datasheet.
  • Layout: Keep CLK and D0–D3 short and length-matched, solid ground reference, minimize vias.
  • Firmware: Plan for NAND specifics (bad blocks, ECC, wear leveling). Use a driver/FTL that handles these.
  1. If you truly need 8 GB managed storage
  • Use eMMC instead of SPI NAND. It reuses the SDMMC host you wired to [U4], provides on-die ECC/FTL/wear leveling, and is much simpler in firmware. Requires a fine‑pitch BGA footprint and typically supports 1.8V signaling.
Suggested next step
  • Confirm capacity: 8 GB vs 8 Gb.
  • Confirm voltage domain: stick with 3.3V only, or is a new 1.8V rail acceptable?
Once you confirm, I’ll propose specific, in-library parts (SPI NAND or eMMC) and show exactly how to rewire the nets formerly used by [U4].

MK2
J1
MK1
U1
How many 12s channels does the U1 have. Can it support 2 I2s microphones?

4
How would I connect MK1 to the I2S0 bus on U1?

7
Connect the Thermistor connector to U3.

9
Connect BATT CONN to U3.

15
https://www.youtube.com/watch?v=1jUmu3DQEYM

23
what is the reason for R3 in the U2 reference design?

16
connect MK2 to I2S1 bus on U1.

8
Are there any missing peripheral components in U3? Perform a check comparing to ...

19
What is the quiecent current of this buck boost converter.

5
based on the datasheet of U3 what peripheral components are needed to have U3 op...

10
confirm that pins 18 and 19 are USB D+ and USB D- on U1

20
Perform a design review check of Iset if the max charging current is supposed to...

21
In U1 list out the GPIOs that can be used for I2S

1
Perform a design review check on the inductor for U2 if the desired output is 3....

18
Using SDIO connect the SD card (U4) to U1

17
what peripheral components are needed to have U2 opperate as a buck boost conver...

11
I want to configure U2 to output a constant 3.3V. What are the recommended value...

12
In order for U3 to function what peripheral components am I missing

14
C7
Capacitance
10uF
C13
Capacitance
22uF
U2
Manufacturer Part Number
LM2623AMM/NOPB
D1
R8
Resistance
1kΩ
R11
Resistance
10kΩ
C2
Capacitance
10uF
C14
Capacitance
22uF
R3
Resistance
5.1kΩ
R6
Resistance
100kΩ
C10
Capacitance
22uF
C8
Capacitance
10uF
C9
Capacitance
10uF
R5
Resistance
150kΩ
R2
Resistance
5.1kΩ
C12
Capacitance
22uF
C15
Capacitance
10uF
C5
Capacitance
10uF
R10
Resistance
1kΩ
R1
Resistance
10kΩ
C1
Capacitance
10uF
R9
Resistance
1kΩ
C4
Capacitance
0.1uF
SW1
LED1
C16
Capacitance
0.1uF
C6
Capacitance
0.1uF
C11
Capacitance
4.7pF
C3
Capacitance
0.1uF
U4
U3
L1
Inductance
4.7uH
R7
Resistance
165kΩ
 

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