The "Redundant Traces" review flagged a warning on Smart Via, Trace auto.
Reports traces and vias that no connection needs: copper that can be removed without disconnecting any pad, custom trace, fill, or polygon. This includes dangling stubs, floating trace islands, and loops.
Name: Smart Via, Trace auto; Net: BATTERY
Context: Reports traces and vias that no connection needs: copper that can be removed without disconnecting any pad, custom trace, fill, or polygon. This includes dangling stubs, floating trace islands, and loops.
I can fix this by locating the Smart Via / Trace auto copper on BATTERY, removing only the redundant stub/loop and rerunning the DRC to confirm connectivity remains intact. The warning isn’t currently reproduced by the read-only review, so I need Agent mode to inspect and edit the live PCB geometry.
This batch is not the completion of the overall request. Silk-only edits were applied and checked read-only, but a strictly geometry-preserving exploded image and clean overall placement validation were not achieved.
Table
Requested item
Status
Evidence / blocker
1. Inspect both sides
Completed
Inspected native scene tree, top/bottom 2D images, exact SVG coordinates, and current top/bottom/oblique 3D renders.
2. Restore/clean text and association
Completed edits; full overlap sign-off not achieved
Preserved all 19 intended strings, enlarged/repositioned them, corrected side assignments. Existing suppression of all duplicate/imported footprint reference/value strings remains active. Native 2D read-back separates the curated text; no dedicated PCB text-overlap or glyph-clearance check was available, and side-filtered images still show opposite-side standalone text. Do not interpret this as a fabrication sign-off.
3. Manufacturable text
Failed full verification
Most text is 0.8 mm; branding is 0.9 mm. Six constrained references are 0.55–0.65 mm, explicitly listed below. All are 0°/90°. The tool's strokeWidth rule supports lines/circles/rectangles, not text; minimum text stroke >=0.15 mm has NOT been verified.
4. Preserve electrical/layout geometry
Completed
All nine layout mutation commits affect text-node rules or text-only selector rulesets. No component/footprint/pad/via/trace/outline/schematic/netlist mutation was made.
5. PCB checks remain clean
Failed due to pre-existing errors
Baseline and post-edit checks both report Board Density Error and Q1 Components Outside Board Error. They were deliberately not repaired because geometry edits are prohibited. Post-edit routing read-back: zero airwires and zero redundant traces. No additional reported design/placement finding appeared.
6. Exact exploded view and durable final asset
Failed exact geometry criterion
Two generation attempts used fresh actual CAD renders. Brightness and contrast improved, but image generation changed/omitted component details/count/positions. The second image is retained as a clearly named DRAFT, not an approved final assembly view.
No requested item was silently skipped; the final-image and fabrication-readability limitations remain open.
Exact text edits
No string content was changed in this batch: the intended strings had already been restored in an earlier pass, but were only 0.15 mm high (polarity 0.18 mm), scattered and in several cases under/away from their components. All component-owned footprint text was already suppressed by existing ruleset c0809919-96d8-4e72-828b-4b5051e28d5c (element text, active=false); this suppression remains unchanged. It includes duplicate REF/VALUE strings, S**, the long photosensor part name, and undefined MCU designator strings.
The 19 curated standalone labels had unsupported layer strings Top Silkscreen / Bottom Silkscreen; these were corrected to valid Top / Bottom values according to get_layout_rule_config. This is text layer assignment only, not a component side change.
Coordinates below are layout-local mm, as used by the standalone text nodes and native 2D SVG. The layout origin is world (-0.4, +3.0) mm. Do not apply these as component world coordinates.
Table
Text
Side
Old X,Y
New X,Y
Old → new font height mm
New rotation
RoysRockets.com
Top
-5.25,4.8
-4.9,3.6
0.15 → 0.9
90°
J2
Top
5.25,-8.7
5.2,-7.0
0.15 → 0.8
90°
+
Top
-1.0,-3.35
-1.5,-3.65
0.18 → 0.8
0°
−
Top
1.0,-3.35
1.0,-3.65
0.18 → 0.8
0°
SW1
Top
-4.35,-0.2
-3.55,0.2
0.15 → 0.8
90°
R1
Top
5.25,4.25
2.1,4.0
0.15 → 0.8
0°
D1
Top
5.25,5.85
3.9,6.9
0.15 → 0.8
0°
BZ1
Bottom
0,7.3
0,7.3
0.15 → 0.8
0°
U1
Bottom
-4.0,-7.35
-5.4,-10.6
0.15 → 0.65
90°
Q1
Bottom
-5.45,-4.45
-5.05,-4.6
0.15 → 0.8
0°
C4
Bottom
-3.2,-4.7
-2.65,-4.9
0.15 → 0.8
0°
TP1
Bottom
-0.75,-7.35
-0.8,-4.75
0.15 → 0.8
0°
R4
Bottom
1.0,-5.15
0.95,-5.1
0.15 → 0.8
90°
C5
Bottom
2.1,-5.15
2.0,-5.7
0.15 → 0.55
0°
R5
Bottom
2.95,-4.45
2.95,-5.48
0.15 → 0.55
90°
R6
Bottom
4.2,-4.45
5.4,-6.3
0.15 → 0.6
90°
C3
Bottom
3.0,-5.55
4.3,-3.85
0.15 → 0.8
0°
D2
Bottom
5.5,-8.75
5.4,-7.68
0.15 → 0.6
90°
Q2
Bottom
4.0,-10.0
5.3,-13.0
0.15 → 0.65
90°
The six small-label exceptions are U1, C5, R5, R6, D2, Q2. They need manufacturer/glyph-level review. Their fixed surrounding component/pad/via positions severely limit available space. Covered traces are not exposed solderable copper; a claim that text avoids every copper polygon, including covered copper pours, is not made.
J2 positive remains associated with pin 1 BATTERY and negative with pin 2 GND, as identified by the existing connector role and current pad/net inspection. The historical U1 label still identifies the ATtiny202 location, but its schematic designator is currently missing (the summary identifies that component by UUID a5551617-1f5d-4ccd-9b74-f12c4c3bc164). History shows the user renamed U1 to j2 and then changed/cleared it. Restoring the schematic designator was intentionally not done because the request forbids schematic edits.
get_change_diff for all nine commits confirmed only the named text-node/ruleset paths; there are no component position, pad, routing, outline, or schematic paths.
Current actual board: 11.7 × 27.5 mm, two copper layers, 16 electrical components, 15 component model nodes. This conflicts with old 30.5/36.5 mm context, so actual board geometry was used and left unchanged.
Original scene counts included 89 routeSegment, 14 via, 9 smartVia, 46 pad nodes; no edit targeted any of them.
Post-edit checks at 2026-09-21T01:51:06.632Z repeat the same two baseline errors: Board Density and Q1 outside board. Severity is Error, not a harmless warning.
Routing-state read-back: zero airwires and zero redundant trace groups.
The 3D export/render omits all silk/copper texture despite active correctly assigned text. Therefore it cannot verify assembled silk visibility or minimum printed stroke. The 2D layer-filter images also show opposite-side standalone text, so do not mistake cross-side superposition for same-side label overlap.
Not a geometry-accurate final view. Do not use it for assembly or manufacture. It has bright neutral lighting, green mask, readable branding, and separated top/bottom groups, but the image model failed the exact geometry/count requirement. The first attempt duplicated the top LED/resistor on the board; the second removed those duplicates but omitted bottom parts and still misrepresented the SOIC/other geometry. Only the second was stored, labelled as a draft.
A deterministic exploded render of the current CAD model is needed next: translate each of the four actual top component model hierarchies along +board normal and each of the eleven actual bottom model hierarchies along -board normal, without changing XY/orientation/scale or adding meshes. TP1 stays with the PCB as copper, not a floating component. Native get_3d_view has no explosion control, and generative relighting is not adequate evidence of mesh identity. Restore native PCB silk textures in that render rather than inventing pad/text geometry.