High-Level Block Diagram Creation


Create a high level mermaid block diagram of this project. Include key component's manufacturer part number in each block whenever possible.
I’ll inspect the project structure and BOM, then create a concise high-level Mermaid block diagram document with MPNs where available.
I found the major blocks: RP2350 MCU, power tree, M40 interface, XY2/encoder DB25, laser safety, I2C expanders, isolated digital I/O, and analog ADS8688-LZM8688 interface. I’m saving the diagram as a project document now.
Created the high-level Mermaid block diagram and saved it in High Level Block Diagram. It includes the main functional blocks and key MPNs from the schematic/BOM, with caveats for connector-only or ambiguous regulator entries.
Review diagram and ERC
Run schematic ERC
Fix ambiguous MPNs
Create power tree
Check BOM risk
Explain block diagram

U1
Q1
U4
U8
U6
ERC报告 — 补Sheet 1电源外围与Sheet 2 MCU后
本轮完成
  • Sheet 1 / Sheet 9电源:补U_ENC、U_DCDC_5V、U_DCDC_3V3的BOOT、SW、电感、反馈分压、EN上拉关键外围网络。
  • Sheet 2 MCU:补RP2350B到W25Q64 QSPI Flash连接。
  • Sheet 2占位/处理:为M40相关GPIO建立M40_PIN/IRQ/WE网络;对USB、SWD、晶振、部分未用GPIO和LZM RST/DAISY做临时No-Connect处理。
ERC现状
ERC警告从上一轮约230项降到约166项,主要仍为Floating Pin。
仍需后续补齐
  • Sheet 3 M40:J_M40_A/B仍有大量Pin未连接,需要按M40手册逐针连接或No-Connect。
  • Sheet 1输入防反接:Q1/F1/LM74700详细输入保护网络还未完整闭合。
  • Sheet 2 RP2350B:DVDD、IOVDD、VREG、ADC_AVDD等电源支持网络仍需按RP2350B参考设计补齐。
  • U_ISO VCC2:隔离输出侧电源仍需确认接PWR_3V3还是隔离电源域。
  • U3未用GPA/GPB/INT:按附录A.7需要上拉或No-Connect/软件配置说明。
  • U_DCDC_5V/U_DCDC_3V3的PG/VCC:需按数据手册决定接法或No-Connect。
附录B预期项
  • Interlock外部回路相关单端/外部接线项仍按External wired by customer分类。
  • DNP/未用接口需继续添加No-Connect标志。
结论
电源外围和MCU Flash主干已补齐,ERC数量下降;下一步建议集中处理Sheet 3 M40和RP2350B电源支持网络。
  • 本轮完成

  • ERC现状

  • 仍需后续补齐

  • 附录B预期项

  • 结论