修正PCB短路与浮铜

已按“模块接口”完成输出级原理图骨架,没有放入任何错误的三脚 MOSFET 替代件。
已添加并连接:
  • CELL_DC_P / CELL_DC_N:输出单元直流母线接口
  • CELL_OUT:半桥/多电平单元输出节点
  • HS_GATE / HS_KS:高边未来 CI90N120SM4 的 Gate / Kelvin Source 接口
  • LS_GATE / LS_KS:低边未来 CI90N120SM4 的 Gate / Kelvin Source 接口
  • HS_GATE_DRV / LS_GATE_DRV:栅极驱动输入接口
  • RGH_CELL / RGL_CELL = 2.5Ω:门极串联电阻占位
  • RGH_PD / RGL_PD = 10kΩ:Gate-Kelvin Source 下拉
  • CDCELL_HF = 100nF / 1200V:输出单元高频母线旁路占位
检查结果:原理图接口网络已建立;当前报错主要是 PCB 尚未为新增模块接口放置/布线产生的 airwires,以及已有布局中的一个 overlapping copper。下一步应导入/创建 CI90N120SM4 四引脚器件 后,把这些接口替换为真实 MOSFET 符号并继续完善栅极驱动和保护。
备选方案 Microchip MSC025SMA120B4N怎么样
我会把 Microchip MSC025SMA120B4N 作为非国产备选来评估:重点核对耐压、电流、RDS(on)、Qg、Kelvin 源极、驱动电压和开关损耗,再判断是否适合作为临时原理图器件或最终备选。
Working for 2 days 17 hrs...
Thought for 6 sec
Reading MSC025SMA120B4N datasheet for absolute maximum ratings VDS VGS continu.
Reading MSC025SMA120B4N datasheet for electrical characteristics RDS on gate t.
Reading MSC025SMA120B4N datasheet for switching characteristics turn on energy.
Reading MSC025SMA120B4N datasheet for pin configuration package TO-247-4 Kelvi...
与外界的联系只有供电输入,信号输入输出

Pulling up the datasheet...

ROC_HYS P1 - ROC_PULLUP P2
COC_REF P1 - ROC_REF_BOT P1
CLOAD P2 - J5 P2
R1 P1 - RFB1 P2
J_QL_SK P2 - RGL_PD P2
DVN1 K - T1 SEC_2_2.5V_@1.1A_2
J4 P1 - RG1 P1
J_QH_DG P2 - RGH_CELL P2
BR1 + - CBUS1 P1
COC_REF P1 - ROC_REF_BOT P1
CLOAD P1 - J5 P1
F1 P1 - J1 P1
J_QH_SK P2 - RGH_PD P2
BR1 + - CBUS1 P1
J_CELL_PWR P2 - J_QL_SK P1
CLOAD P2 - J5 P2
CLOAD P1 - J5 P1
CLOAD P1 - J5 P1
T1 SEC_2_2.5V_@1.1A_1 - UOC1 2
J4 P2 - R7 P1
J_QL_DG P2 - RGL_CELL P2
CLOAD P2 - J5 P2
J_CELL_PWR P1 - J_QH_DG P1
BR1 - - CBUS1 P2
CHVN1 P2 - CHVP1 P2
CHVN1 P2 - CHVP1 P2
R3 P2 - RFB5 P1
COC_IN P1 - ROC_HYS P2
T1 SEC_2_2.5V_@1.1A_1 - UOC1 2
CHVN1 P2 - CHVP1 P2
J_GATE_DRV P1 - RGH_CELL P1
CHVP1 P1 - CHV_POS P1
COC_REF P1 - ROC_REF_BOT P1
ROC_HYS P1 - ROC_PULLUP P2
R1 P2 - R2 P1
BR1 AC - CX1 P2
BR1 AC - CX1 P1
BR1 + - CBUS1 P1
COC_DEC P1 - ROC_PULLUP P1
CHVN1 P2 - CHVP1 P2
BR1 + - CBUS1 P1
RFB10 P2 - RFB5 P2
CLOAD P1 - J5 P1
J_CELL_OUT P1 - J_QH_SK P1
R1 P2 - R2 P1
CHVN1 P1 - CHV_NEG P1
COC_IN P1 - ROC_HYS P2
R4 P2 - R5 P1
J_GATE_DRV P1 - RGH_CELL P1
J_CELL_OUT P1 - J_QH_SK P1
R4 P1 - RFB6 P2
R1 P1 - RFB1 P2
F1 P1 - J1 P1
CHVN1 P2 - CHVP1 P2
CHVN1 P2 - CHVP1 P2
R2 P2 - R3 P1
R5 P2 - R6 P1
J_QH_DG P2 - RGH_CELL P2
DVN1 K - T1 SEC_2_2.5V_@1.1A_2
J_GATE_DRV P2 - RGL_CELL P1
CHVN1 P2 - CHVP1 P2
CHVN1 P2 - CHVP1 P2
R4 P2 - R5 P1
CHVN1 P1 - CHV_NEG P1
R5 P2 - R6 P1
R6 P2 - RFB10 P1
CLOAD P2 - J5 P2
J_QL_DG P2 - RGL_CELL P2
DVP1 A - T1 SEC_1_2.5V_@1.1A_1
BR1 - - CBUS1 P2
CHVP1 P1 - CHV_POS P1
CHVP1 P1 - CHV_POS P1
J_CELL_PWR P1 - J_QH_DG P1
COC_IN P1 - ROC_HYS P2
J4 P2 - R7 P1
BR1 AC - CX1 P2
COC_REF P1 - ROC_REF_BOT P1
CHVP1 P1 - CHV_POS P1
CHVP1 P1 - CHV_POS P1
CHVN1 P1 - CHV_NEG P1
CHVP1 P1 - CHV_POS P1
CHVN1 P1 - CHV_NEG P1
CHVN1 P2 - CHVP1 P2
CHVN1 P2 - CHVP1 P2
BR1 AC - CX1 P2
BR1 AC - CX1 P1
CHVN1 P1 - CHV_NEG P1
J_GATE_DRV P2 - RGL_CELL P1
ROC_HYS P1 - ROC_PULLUP P2
R6 P2 - RFB10 P1
J_CELL_PWR P1 - J_QH_DG P1
R4 P1 - RFB6 P2
DVP1 A - T1 SEC_1_2.5V_@1.1A_1
R3 P2 - RFB5 P1
BR1 - - CBUS1 P2
J_QL_SK P2 - RGL_PD P2
BR1 + - CBUS1 P1
J_CELL_PWR P2 - J_QL_SK P1
J_CELL_PWR P2 - J_QL_SK P1
J_QH_SK P2 - RGH_PD P2
COC_DEC P1 - ROC_PULLUP P1
J_QH_DG P2 - RGH_CELL P2
CHVN1 P2 - CHVP1 P2
COC_DEC P1 - ROC_PULLUP P1
CHVN1 P2 - CHVP1 P2
J4 P1 - RG1 P1
CHVN1 P2 - CHVP1 P2
BR1 AC - CX1 P1
RFB10 P2 - RFB5 P2
R2 P2 - R3 P1
BR1 AC - CX1 P1
BR1 AC - CX1 P2
BR1 - - CBUS1 P2
COC_DEC P1 - ROC_PULLUP P1
BR1 + - CBUS1 P1
BR1 - - CBUS1 P2
BR1 AC - CX1 P1
COC_IN P1 - ROC_HYS P2
J_QL_DG P2 - RGL_CELL P2
J_CELL_PWR P2 - J_QL_SK P1
CLOAD P2 - J5 P2
J_CELL_OUT P1 - J_QH_SK P1
CHVN1 P1 - CHV_NEG P1
BR1 AC - CX1 P2
CLOAD P2 - J5 P2
CHVN1 P2 - CHVP1 P2
UOC1
RHVN_DIS
Resistance
10MΩ
T1
RFB6
Resistance
2.49MΩ
R3
Resistance
2.49MΩ
RBUS2
Resistance
330kΩ
RFB1
Resistance
2.49MΩ
ROC_PULLUP
Resistance
4.7kΩ
RHV_IN_NEG
Resistance
10Ω
R7
Resistance
1kΩ
RBUS1
Resistance
330kΩ
RHVP_DIS
Resistance
10MΩ
RHV_IN_POS
Resistance
10Ω
RGH_CELL
Resistance
2.5Ω
RGL_CELL
Resistance
2.5Ω
RHV_BLEED_POS
Resistance
20MΩ
RSH1
Resistance
0.1Ω
ROC_IN
Resistance
100Ω
ROC_REF_TOP
Resistance
15.6kΩ
R1
Resistance
2.49MΩ
ROC_HYS
Resistance
1MΩ
R6
Resistance
2.49MΩ
RCX1
Resistance
1MΩ
RFB5
Resistance
100kΩ
R4
Resistance
2.49MΩ
RG1
Resistance
1kΩ
R5
Resistance
2.49MΩ
ROC_REF_BOT
Resistance
1kΩ
RFB10
Resistance
100kΩ
RHV_BLEED_NEG
Resistance
20MΩ
RGH_PD
Resistance
10kΩ
RGL_PD
Resistance
10kΩ
R2
Resistance
2.49MΩ
J_GATE_DRV
CBUS1
Capacitance
220µF
RV1
BR1
CHV_POS
Capacitance
1nF
J_QL_DG
CX1
Capacitance
100nF
J_CELL_OUT
CBUS2
Capacitance
220µF
CHVN1
Capacitance
4.7nF
CHV_NEG
Capacitance
1nF
J4
CDCELL_HF
Capacitance
100nF
F1
DVP2
DVN2
J_QH_DG
DVN1
J1
CHVP1
Capacitance
4.7nF
J_QL_SK
DVP1
COC_DEC
Capacitance
100nF
J_CELL_PWR
J5
COC_IN
Capacitance
100pF
CLOAD
Capacitance
1nF
J_QH_SK
COC_REF
Capacitance
10nF

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Preliminary Component Selection
Selection Rule
Use China-made / China-supply-chain parts when they satisfy electrical, thermal, safety, and reliability requirements. For high-voltage and safety-critical parts, datasheet ratings and safety certification override sourcing preference.
Library Search Findings
Output Power Switches
Initial Flux library searches did not find an exact 1200 V Tokmas CI90N120SM4 / LCSC C5364637 part. The exact part must be imported/created before final schematic capture. A non-China fallback with a ready Flux footprint exists, Microchip MSC025SMA120B4N, but it does not meet the China-made preference and is therefore not selected as the primary device.
Selected Tokmas / LCSC 1200 V SiC MOSFET
Primary Selected Device: Tokmas CI90N120SM4

Table


ParameterValue
ManufacturerTokmas / 托克马斯
MPNCI90N120SM4
LCSC Part NumberC5364637
PackageTO-247-4L
Device typeN-channel SiC MOSFET
VDS max1200 V
Continuous drain current90 A at TC=25°C, 60 A at TC=100°C
Pulsed drain current250 A
RDS(on)27 mΩ typ, 38 mΩ max at VGS=20 V, ID=50 A
Recommended VGS-5 V / +20 V
Absolute VGS max-10 V / +25 V
VGS(th)2.0 V min, 2.5 V typ, 4.0 V max
Total gate charge Qg185 nC at VDS=800 V, VGS=-5/+20 V, ID=50 A
Ciss / Coss / Crss4700 pF / 220 pF or 231 pF / 42.8 pF
Switching energyEON 2.2 mJ, EOFF 0.5 mJ at VDS=800 V, ID=50 A, RG=2.5 Ω
Thermal resistanceRθJC 0.24°C/W typ, 0.27°C/W max
Junction temperature-55°C to +150°C
PinoutPin 1 Drain, Pin 2 Source, Pin 3 Kelvin Source, Pin 4 Gate
LCSC stock observedLow stock: 2 units reported at time of lookup
Why CI90N120SM4 is preferred over CI90N120SM
CI90N120SM is the TO-247-3 version and had better observed stock, but CI90N120SM4 has a Kelvin source terminal. For a high-slew-rate, 500 kHz-class multilevel output stage, the Kelvin source is important because it separates gate-drive return from the high-current power source lead, reducing common-source inductance, gate ringing, false turn-on, and switching loss sensitivity.
Backup Device: Tokmas CI90N120SM

Table


ParameterValue
MPNCI90N120SM
LCSC Part NumberC5364636
PackageTO-247-3
VDS max1200 V
Continuous drain current90 A at TC=25°C, 60 A at TC=100°C
RDS(on)27 mΩ typ, 38 mΩ max
Qg185 nC
PinoutPin 1 Gate, Pin 2 Drain, Pin 3 Source, tab/drain pin 4 Drain
LCSC stock observed125 units reported at time of lookup
Use CI90N120SM only if CI90N120SM4 is unavailable or cannot be imported with a correct 4-lead footprint.
Suitability Check Against Project Requirement
The device voltage and current ratings exceed the amplifier target of ±1000 V peak and ≥10 A peak output current when used in an appropriately derated multilevel topology. However, the switching-loss data shows that hard-switching this device at hundreds of kHz with large voltage/current overlap is not acceptable: the datasheet switching-energy test at 800 V and 50 A gives EON+EOFF ≈ 2.7 mJ. At 500 kHz this would imply extreme loss if operated as a hard-switched single-stage bridge.
Therefore the selected device is suitable only if the output stage uses one or more of the following:
  1. Multilevel/cascaded cells to reduce per-device voltage swing.
  2. Soft-switching or resonant/transition-assisted modulation where possible.
  3. Carefully limited dv/dt and current as already specified.
  4. Very low-inductance gate and power layout using the Kelvin source pin.
  5. Thermal design based on actual switching waveform and duty cycle, not only DC current rating.
Isolated Gate Driver Candidates
Flux library candidates:

Table


CandidateNotesStatus
STGAP2SCMGalvanically isolated 4 A single gate driver with Miller clamp, SOIC-8; LCSC availability shown in Flux resultCandidate for per-switch isolated drive
2ED1324S12P1200 V half-bridge gate driver with active Miller clamp/OCP/SCC/bootstrap diodeStrong function match, but not China-made and no LCSC availability shown
STGAP1ASIsolated 5 A advanced gate driver with DESAT/UVLO/OVLO/SPIFeature-rich candidate, availability not shown
For CI90N120SM4, the selected gate driver must support -5 V / +20 V gate drive or an equivalent safe bias strategy, local isolated supply, Miller clamp or negative turn-off, and very short gate loop routing to the Kelvin source pin.
Waveform / Control Candidates
Flux library candidates:

Table


CandidateNotesStatus
DAC80501ZDGSR16-bit single-channel DAC, LCSC/Mouser availability shownCandidate for low-voltage reference / waveform path
DAC43401DSGRQ1Compact DAC, LCSC part shownCandidate for control/reference generation
AD7606BSTZ8-channel 16-bit ADC, 200 kS/s, LCSC availability shownUseful for monitoring, too slow for direct 500 kHz waveform feedback if sampled full-band
A dedicated high-speed ADC/FPGA/DSP selection is still required for closed-loop arbitrary waveform control at 500 kHz.
Mains Input / Protection Candidates
Flux library candidates:

Table


CandidateNotesStatus
V275LA10P275 VAC MOV, LCSC listedCandidate surge protection for 220 VAC mains
CM3440Z171R-1020 A common-mode choke/filter, 170 ohm @ 100 MHzCandidate EMI common-mode filter, safety ratings must be verified
GBP310(70MIL)Bridge rectifier candidateCurrent rating likely below final need; exact 600 V / 10 A bridge not found in returned results
Updated Design Decision
Select Tokmas CI90N120SM4 as the primary 1200 V SiC MOSFET for the multilevel output-cell design because it is China-supply-chain, LCSC-listed, has a TO-247-4 Kelvin-source package, and has sufficient voltage/current margin. Do not finalize the power-cell schematic until the exact part is imported/created in Flux with correct pinout and TO-247-4L footprint.
Required Before Final Schematic
  1. Import/create Tokmas CI90N120SM4 with 4 terminals: D, S, KS, G.
  2. Verify or create TO-247-4L footprint with correct pin order: Pin 1 Drain, Pin 2 Source, Pin 3 Kelvin Source, Pin 4 Gate.
  3. Confirm available stock or procure samples; observed LCSC stock was very low.
  4. Verify isolated gate-driver supply design for -5 V / +20 V gate drive.
  5. Define number of output cells and per-cell bus voltage to keep switching losses practical.
  6. Simulate representative multilevel switching waveforms with 2.5 nF load before PCB layout.
  • Selection Rule

  • Library Search Findings

  • Output Power Switches

  • Selected Tokmas / LCSC 1200 V SiC MOSFET

  • Primary Selected Device: Tokmas CI90N120SM4

  • Why CI90N120SM4 is preferred over CI90N120SM

  • Backup Device: Tokmas CI90N120SM

  • Suitability Check Against Project Requirement

  • Isolated Gate Driver Candidates

  • Waveform / Control Candidates

  • Mains Input / Protection Candidates

  • Updated Design Decision

  • Required Before Final Schematic

HV Arbitrary Waveform Amplifier thumbnail
220VAC-powered high-voltage arbitrary waveform amplifier targeting ±1000Vpeak into 2.5nF, 0–500kHz, ≥10A peak with ≤4000V/µs slew-rate limit; component selection prioritizes China-made / China-supply-chain parts where safe and technically suitable.

Properties

Properties describe core aspects of the project.

Pricing & Availability

Distributor

Qty 1

Arrow

$1.10–$2.50

Digi-Key

$1.02

HQonline

$0.30

LCSC

$1.95–$2.17

Mouser

$8.88–$10.22

TME

$2.23

Verical

$1.70–$4.32

Controls