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U1
Manufacturer Part Number
ATMEGA328PB-AU
5V
12V
5V
12V
5V
12V
12V
C22
Capacitance
10nF
C20
Capacitance
10µF
C14
Capacitance
10µF
C29
Capacitance
100µF
R16
C13
Capacitance
100nF
C16
Capacitance
10nF
C2
Capacitance
100µF
C6
Capacitance
100nF
C25
Capacitance
10µF
C15
Capacitance
100nF
C23
Capacitance
10nF
C7
Capacitance
22pF
C8
Capacitance
22pF
C17
Capacitance
100nF
C5
Capacitance
100µF
C4
Capacitance
10µF
C12
Capacitance
10µF
C26
Capacitance
100nF
C19
Capacitance
100nF
C18
Capacitance
10µF
U4
Manufacturer Part Number
TC4427AEOA
U2
Manufacturer Part Number
TPS54360BDDA
U5
Manufacturer Part Number
Q2
L2
Manufacturer Part Number
HZ0805E601R-10
R18
J4
Q3
Q1
Y1
F1
D4
Manufacturer Part Number
SMBJ30CA/TR13
R6
Resistance
22 Ω
L1
Inductance
10µH
R11
Resistance
100 Ω
R7
Resistance
10kΩ
R8
Resistance
10 Ω
L3
J3
R17
Resistance
10kΩ
C11
Capacitance
0.1uF
R9
Resistance
220 Ω
J1
R1
Resistance
10kΩ
J2
R12
Resistance
10kΩ
R10
Resistance
10kΩ
MCU XTAL 1 (7)
C3
Capacitance
220uF
C1
Capacitance
470uF
J5
MCU RESET (29)
D1
C10
D5
Capacitance
Capacitance
D7
Capacitance
Capacitance
MCU RESET (29)
MCU RX (30)
MCU RESET (29)
J7
MCU XTAL 1 (7)
D6
Capacitance
Capacitance
MCU TX (31)
MCU RX (30)
MCU TX (31)
C31
Capacitance
22uF
J6
R19
C21
Capacitance
1000pF
R13
D3
Manufacturer Part Number
DSK34
R4
R2
C27
Not Recommended for New Designs
R3
D2
R14
Resistance
1kΩ
R15
Resistance
1kΩ
U3
Manufacturer Part Number
-3.3
R5
Resistance
4.7kΩ
C28
C9
Capacitance
100pF
Validation and Manufacturing Readiness — Ozone Generator Control Board
Snapshot
Generated on 2026-05-16 from the current schematic, PCB layout, BOM, and design review.
Current design state

Table


AreaStatusNotes
SchematicPopulated152 schematic items, 48 nets
BOMPopulated42 unique BOM parts, 70 BOM instances with MPNs present in summary
PCB boardSized and placed90 mm x 90 mm, 2-layer rectangular board, all BOM components on top side
RoutingNot completeReview reports 101 airwires
Project filesCreatedSpecification, design notes, power budget, firmware starter, validation/manufacturing readiness
ERCNot cleanOne missing-power warning/error for U1:VCC on Net 47
DRCNot cleanAirwires must be routed before manufacturing
VIN requirementPartially definedVIN is 12 V or 24 V DC; about 3.5 A at 12 V or 1.8 A at 24 V; J1/J2/J3 devices are matched to VIN
Active review issues
Blocking issues before fabrication

Table


CategoryCountIssueRequired action
DRC Airwires101Missing routed PCB tracesRoute the PCB, then re-run review
ERC Missing Power1U1:VCC on Net 47 is not recognized as drivenMark Net 47 as a power rail / fix power-source modeling from U3 output
Power path sizing1Existing F1 appears undersized for 12 V / 3.5 A inputReplace or re-rate F1 before manufacturing; size input path for at least 5.25 A continuous-equivalent margin
Documentation issue
The previous “project has no documentation” review issue should be resolved by the new project files created in this pass. Re-run review after the platform refreshes document indexing.
Manufacturing readiness gate
This board is not ready for manufacturing export yet.
Do not order PCBs or assembly until all of the following are true:
  1. All airwires are routed.
  2. ERC missing-power issue is resolved or explicitly justified.
  3. Actual current split across J2/J3/J4 is confirmed; total envelope is now known as 3.5 A at 12 V or 1.8 A at 24 V.
  4. Q1/Q2/Q3 thermal dissipation is checked against real load currents.
  5. F1, D2, connectors, and VIN/load trace widths are verified for 3.5 A nominal and at least 5.25 A margin where full-current paths are possible.
  6. If J4 load is inductive, a flyback/clamp protection path is added or documented as external.
  7. J7 ICSP pinout is confirmed against the intended programming cable.
  8. Sensor thresholds and firmware interlocks are calibrated and documented.
  9. Final review shows no unresolved DRC/ERC errors.
  10. Gerber, BOM, pick-and-place, and assembly notes are generated from the final reviewed revision.
1. Clean up net names
Rename auto-numbered critical nets to explicit names before final review:

Table


Current netSuggested nameReason
Net 3VIN_PROTECTEDMain protected input rail
Net 425V_BUCKBuck output / LDO input
Net 473V3Logic and sensor rail
Net 17AVCCFiltered MCU analog supply
Net 29LOAD1_SWJ2/Q1 switched node
Net 14LOAD2_SWJ3/Q2 switched node
Net 34LOAD3_SWJ4/Q3 switched node
Net 13PRESSURE_A_ADCU7 channel A to MCU ADC
Net 46PRESSURE_B_ADCU7 channel B to MCU ADC
2. Resolve ERC power-source issue
Net 47 is generated by U3 AMS1117-3.3 output and powers U1 VCC, sensors, amplifier, and headers. The review reports U1:VCC as not driven. This is likely a modeling/annotation issue, not necessarily a wiring issue. Fix by ensuring the 3.3 V regulator output pin is treated as a power source and/or annotating Net 47 as a power net.
3. Route the board
The board has 101 airwires. After routing:
  • Re-run DRC.
  • Check high-current paths on VIN, J2, J3, and J4.
  • Verify ground return continuity and avoid thin return bottlenecks.
  • Keep analog sensor/amplifier traces away from switching-node and load-current traces.
4. Validate power and thermal margins
Before manufacturing, use the updated Power Budget file as the sizing basis:
  • VIN is 12 V / 3.5 A or 24 V / 1.8 A.
  • J1/J2/J3 field devices are voltage-matched to the selected VIN.
  • Input path target is at least 5.25 A continuous-equivalent margin using 1.5x sizing.
  • Actual current split between J2/J3/J4 still needs confirmation.
  • 3.3 V load current from J6 if external hardware is powered.
  • Ambient temperature and enclosure airflow.
  • Copper weight.
Immediate power-path concern: F1 SMD1812B075TF/33 appears to be a 0.75 A-class resettable fuse and is not compatible with the clarified 3.5 A input envelope. D2 and Q1/Q2/Q3 also require thermal verification at the real branch currents.
5. Firmware bring-up validation
Use the Firmware Starter file as a bring-up scaffold:
  • First verify ADC readings with known pressure/flow conditions.
  • Keep Q1/J2 disabled until thresholds and safety interlocks are finalized.
  • Add watchdog, fault latch, and user command protocol before field use.
Pre-manufacturing checklist

Table


CheckStatus
Schematic completeNeeds final review after load/function labels are confirmed
Datasheet-recommended circuits verifiedNot fully verified in this documentation pass
Power budget completeUpdated with 12 V/3.5 A and 24 V/1.8 A envelope; still needs branch current split and thermal verification
PCB placement completePlaced, but routing congestion near U1/U7/J7/J6 should be reviewed
PCB routing completeNo, 101 airwires remain
ERC cleanNo, U1:VCC missing-power issue remains
DRC cleanNo, airwires remain
BOM readyPreliminary; verify availability and MPNs before purchase
Manufacturing files readyNo; wait until routing and reviews are clean
Final readiness conclusion
The project now has updated baseline documentation for the 12 V/24 V operating envelope, but the hardware is not manufacturing-ready. The next blocking work is to replace or re-rate F1, verify D2 and MOSFET thermals for the 3.5 A current case, resolve the U1:VCC ERC power-source issue, route the PCB, and re-run review until no unresolved critical issues remain.
  • Snapshot

  • Current design state

  • Active review issues

  • Blocking issues before fabrication

  • Documentation issue

  • Manufacturing readiness gate

  • Recommended next engineering actions

  • 1. Clean up net names

  • 2. Resolve ERC power-source issue

  • 3. Route the board

  • 4. Validate power and thermal margins

  • 5. Firmware bring-up validation

  • Pre-manufacturing checklist

  • Final readiness conclusion