J1 Power Connector


@file Explain J1, including its purpose, key functions, and common applications.
Describe how it operates within a circuit and any notable characteristics.
Also, explain the family or series this component belongs to, highlighting its variations, key differences, and typical use cases compared to other models in the series.
I guess not
You’re right—the uploaded image is too dark to interpret. I checked J1 directly in the schematic instead:
J1 is a Molex 26013115 four-position, dual-row, 4.20 mm-pitch male power connector. It is the controller’s 12 V DC power input.
  • Pins 1–2: +12V_IN
  • Pins 3–4: GND
  • Duplicated contacts share the supply current and reduce contact resistance.
  • The input feeds the board’s protection and local power-conversion circuitry.
  • It belongs to Molex’s 5566-style 4.2 mm wire-to-board power connector family, with variants differing in position count, row arrangement, orientation, mounting style, and mating housing.
  • Typical applications include appliances, industrial controllers, power supplies, and other medium-current wire-harness connections.
Compared with smaller-pitch signal connectors, this family is intended for power delivery and offers larger contacts and stronger polarization. The project currently marks the +12V_IN net for up to 7 A, so both parallel power and ground contacts—and suitable mating terminals and wire gauge—are important.

INTERCEDE A1 Handoff Audit
Audit date: 2026-08-20
Audited source: FLUX_HANDOFF_SPEC.md, Document Rev A
Purpose: Determine whether schematic capture can begin without inventing connectivity, component data, or safety-critical constraints.
Executive conclusion
The handoff specification provides a strong architecture, requirements framework, named critical parts, power intent, grounding rules, mechanical envelope, and acceptance goals. It is not yet a self-contained schematic handoff package, because it delegates authoritative schematic details to referenced files that were not supplied with the attachment.
Schematic capture must not begin from this file alone. Doing so would require reconstructing a 53-part BOM, hundreds of pin-level connections, locked component values, PoE circuitry, and footprint decisions from incomplete summaries. That would violate the document's own conflict and authority rules.
Required source files missing from the supplied package

Table


FileWhy it is requiredClassification
INTERCEDE_A1_SCHEMATIC_BUILD_PROMPT.mdDeclared primary authority for locked parts, locked values, and build order; supersedes datasheet-typical defaultsBlocking before schematic
INTERCEDE_A1_POE_POWER_SPEC.mdDeclared primary authority for PoE architecture and power requirements; needed to resolve PD/PSE and isolated conversion topologyBlocking before schematic
INTERCEDE_SCHEMATIC_LESSONS_LEARNED.mdDeclared primary authority for ground-domain rules and schematic conventionsBlocking before schematic
INTERCEDE_A1_BOM_v4_vetted.xlsxFull 53-part approved BOM, sourcing data, and unresolved vet notesBlocking before schematic
INTERCEDE.kicad_sym and any .pretty footprint libraryDeclared authority for symbol/footprint geometry and contains prior verification workBlocking before schematic unless every exact part is independently recreated and verified
SMIB/docs/verification/VERIFICATION_LEDGER.mdContains footprint and datasheet verification evidence and identified correctionsBlocking before footprint approval; strongly preferred before schematic
Existing KiCad project and six sheet filesContains the already reconciled U2 power cluster and existing design state; prevents duplicate or contradictory reconstructionBlocking before schematic migration/reconstruction
Datasheet PDFs or complete datasheet URL listNeeded for pinout, unused-pin treatment, support circuitry, package, and layout constraintsBlocking before schematic for all active/critical parts
Gap classification
Blocking before schematic

Table


IDGapResolution needed
SCH-001Authoritative source package is incompleteSupply the files listed above, preferably as one ZIP archive
SCH-002Full pin-level connectivity is absentSupply the locked build prompt and existing KiCad schematic; derive and verify the final netlist from those sources
SCH-003U3 3.3 V buck values are unreconciledUse the locked build prompt plus LMR33630 datasheet equations and operating requirements; record final inductor, capacitors, divider, ratings, and compensation/support values
SCH-004Ground domains are not implementedCreate distinct GND, ISO_GND, and CHASSIS nets before isolated-side wiring; define every intentional coupling element explicitly
SCH-005PoE PD/PSE and isolated conversion topology is not fully availableSupply the PoE power specification and controller selections; independently verify limits before capture
SCH-006Thirteen BOM reference groups are marked “not OK”Inspect the actual vet notes and resolve symbol, footprint, rating, availability, or MPN issues before using the affected parts
Blocking before PCB layout

Table


IDGapResolution needed
LAY-001H1102NL footprint has an approximately 0.5 mm row-span mismatchBuild or source a Pulse-drawing-verified footprint before placement
LAY-002Board outline and coordinate origin are undefinedDefine the board outline, datum, and exact mounting-hole positions within the 99.5 × 99.5 mm envelope
LAY-003Connector pinout/mechanical table is incompleteVerify all connector pin numbers, orientations, mating parts, board-edge datums, and insertion envelopes
LAY-004Placement, keepout, and height constraints are not compiledExtract all component-specific requirements from datasheets and mechanical drawings into enforceable layout constraints
LAY-005Board-size feasibility is unprovenPerform a placement-density study including the isolation barrier and edge-mounted connectors
LAY-006Test/programming access requirements are undefinedDefine production programming, debug, test-point, fixture, and service-access requirements
Blocking before manufacturing release

Table


IDGapResolution needed
REL-001Board house and production stackup are not selectedSelect a fabricator or obtain a confirmed four-layer stackup before impedance calculations and final DRC
REL-002PCB thickness is an assumptionConfirm 1.6 mm or revise based on connector/mechanical and impedance requirements
REL-003RoHS, REACH, and lead-free requirements are not approvedRecord product compliance requirements and verify BOM/material declarations
REL-004Environmental requirements are undefinedDefine operating/storage temperature, humidity, vibration, contamination, and service-life requirements
REL-005Mexico gaming-jurisdiction requirements are unevaluatedDetermine whether product approval, traceability, tamper, EMC, or safety requirements apply
REL-006802.3bt claims are not independently verifiedVerify PD/PSE classification, available power, isolation, current, cable, and protection requirements against accessible authoritative standards/controller documentation
Non-blocking for schematic capture

Table


ItemTreatment
True functional block-diagram artworkArchitecture is sufficiently described for capture; diagram can be completed during documentation
Detailed operating-mode current tableAggregate budget is sufficient to start once exact load data and power source files are supplied; refine before power-path release
Enclosure STEPEnclosure is intentionally built around the finished board; connector mating geometry still remains mandatory
Exact routing widths, vias, impedance geometryMust be derived after stackup selection; not required for initial schematic capture
Silkscreen detailsDefer to layout phase
Resolution of the six principal design gaps
  1. U3 reconciliation: straightforward once the locked build prompt is supplied. Resolve from the specified output voltage/current, input range, switching frequency, ripple target, and LMR33630 datasheet equations. Do not copy U2 blindly.
  2. Three-domain grounding: straightforward schematic correction. Use GND, ISO_GND, and CHASSIS as distinct nets; add only documented isolation/coupling components.
  3. H1102NL footprint: straightforward but mandatory mechanical verification. Create or import a footprint directly from the Pulse mechanical drawing and verify pad pitch, row span, body, pin 1, and courtyard.
  4. 802.3bt verification: independently verify using the selected PD/PSE controller datasheets and accessible IEEE-aligned application guidance. Any requirement that depends on restricted standard text must remain explicitly flagged until verified.
  5. Board house/stackup: may wait until layout setup, but must be selected before impedance-controlled routing and manufacturing release.
  6. Mechanical origin/outline: the maximum envelope is known; exact outline, datum, and hole coordinates can be established before placement after a density study.
Mandatory schematic acceptance criteria
  • Exact approved MPNs and values match the authoritative build prompt and BOM.
  • Every active part pin number is checked against a manufacturer datasheet.
  • All power pins, exposed pads, grounds, enable/strap pins, resets, clocks, and unused pins have documented treatment.
  • GND, ISO_GND, and CHASSIS remain distinct, with zero unintended cross-domain nets.
  • Serial mux is hardware-interlocked so only one isolation path can be active without relying on firmware.
  • All source-fed rails have appropriate source indication and power integrity support.
  • Decoupling and support components are associated with specific IC pins/rails.
  • Connector pinouts and external directions are explicit.
  • PoE PD/PSE, isolated conversion, protection, and power budgets are verified against selected parts.
  • ERC and schematic-legibility checks pass or each exception has a documented waiver.
Required next upload
Upload one ZIP containing the authoritative package, preserving filenames and folders. At minimum it must contain:

Text


INTERCEDE_A1_SCHEMATIC_BUILD_PROMPT.md
INTERCEDE_A1_POE_POWER_SPEC.md
INTERCEDE_SCHEMATIC_LESSONS_LEARNED.md
INTERCEDE_A1_BOM_v4_vetted.xlsx
INTERCEDE.kicad_sym
A1_Controller/*.kicad_pro
A1_Controller/*.kicad_sch
A1_Controller/*.kicad_pcb
A1_Controller/*.pretty/**
SMIB/docs/verification/VERIFICATION_LEDGER.md
all locally stored critical-part datasheet PDFs
If the existing KiCad project is intended to be imported rather than rebuilt, include the complete project directory and all project-local libraries in the ZIP.
Authoritative ZIP access attempt — 2026-08-20
Source URL: https://cdn.flux.ai/project/chat/attachments/intercede-hardware-full-47b81d49-db3f-4a73-b30b-055517e2a242.zip
Status by assigned item

Table


Scope itemStatusEvidence / blocker
Inventory and read all authoritative filesFailedThe Flux file reader returned Error while uploading file for archive inventory, authority rules, and build-prompt queries. The code sandbox did not receive the ZIP through fileAttachments and has no usable network access to download it.
Reconcile package conflictsUnattemptedBlocked by inability to read the declared authority hierarchy and source contents. The earlier handoff audit was not substituted for the ZIP.
Resolve schematic-critical BOM issuesUnattemptedThe vetted workbook, its thirteen not OK groups, and verification ledger could not be read.
Build complete schematicUnattemptedCorrectly stopped: exact topology, locked values, designators, pin-level netlist, PoE requirements, and approved MPN decisions remain unavailable from readable authoritative evidence.
Run connectivity/ERC/legibility verificationUnattemptedNo schematic was created, so these checks are not applicable yet.
PCB layoutCompleted (scope compliance)No placement, routing, stackup, or manufacturing export was started.
Evidence that the ZIP exists and contains EDA libraries
The ZIP-aware EDA library importer successfully opened the archive in discovery mode and listed the following unique part names, but it does not expose Markdown, spreadsheet, schematic, netlist, or verification-file contents:
74LVC125AD, ADUM1201ARZ-RL7, AO3400A, AO3401A, ATECC608B-MAHDA-S, ATMEGA1284P-AU, DS3231SN, ESP32-C6-MINI-1U-N8, ESP32-S3-WROOM-1U-N16R8, H1102NL, IRLML0030TRPBF, KH-5224-8P8C, LAN8742AI-CZ-TR, LM74700QDBVRQ1, LMR33630ADDAR, MAX3232EIDR, MB85RS256B, MT48LC16M16A2P-6A, PC817C, PCF8563T, RBE-0505S, SK6812MINI-E, SMBJ13A, SN74AHCT1G125DBVR, STM32H743ZGT6, TPS23751PWP, TPS23861PW, USBLC6-2SC6, W25Q128JVSIQ, W5500, YHY502CTG, CC0603KRX7R9BB104, RASH722BKZ, RASM712PX, LM5155DSSR, and 694106301002.
No components were imported into the controller project. Three archive library files also reported parser failures: SWITCHCRAFT_DC_JACK.kicad_sym.history.json, TPS2373-4RGWR.kicad_sym, and 694106301002.lib.
Exact blocker to resume
Provide the ZIP as a directly uploaded chat file that the file/code tools receive as an attachment, or provide extracted direct URLs for at least the authoritative Markdown files, vetted BOM workbook, KiCad schematic/project files and local libraries, and verification ledger. Once those bytes are readable, the audit can continue without relying on the earlier high-level handoff summary.
Plain-text bundle verification — 2026-08-20
The supplied URL intercede_authoritative_bundle.md-c1223a57-2167-452f-9747-6d30b73928f4.txt was read both semantically and in literal raw mode. Its complete payload is exactly 11 characters: PLACEHOLDER. It contains none of the stated five authoritative files, authority rules, BOM rows, topology, locked values, pin mappings, PoE requirements, or verification evidence.
Result: SCH-001 through SCH-006 remain blocked. No schematic mutation was made because proceeding would require inventing topology-, pinout-, safety-, power-, and approved-MPN-critical facts. Re-upload the actual concatenated Markdown/CSV text or provide direct links whose raw payload contains the documents.
Authoritative bundle v2 gap audit — 2026-08-20
Audited source: intercede_authoritative_bundle_v2.md-b43bc7c5-e6aa-4c17-98ee-488c62f80b93.txt
Raw length: 3,549 characters; read completely.
What the attachment actually contains
  • A header for INTERCEDE_A1_SCHEMATIC_BUILD_PROMPT.md, followed by only its opening project description, board construction line, and an explicit statement that the full prompt/PoE spec/lessons/BOMs were omitted as an abbreviation.
  • A non-pin-level architecture reminder: 12 V input at J1, two W5500 links, ESP32-S3 application gateway, ADuM1201 + MAX3232 serial isolation.
  • A new J8/J9 Stage 11 supplement naming J8 0026604060, J9 0026604080, U19–U26 PC817C, R60–R63 = 1.5 kΩ, R64–R67 = 390 Ω, R68–R71 = 10 kΩ, and connector signal labels.
It does not contain the other four claimed authoritative file bodies, the full build prompt, either BOM table, the PoE specification, lessons-learned rules, or a verification ledger.
Status of SCH-001 through SCH-006

Table


GapStatus after v2Exact missing evidence
SCH-001 authoritative packageOpenFour file bodies are absent and the build prompt is explicitly abbreviated. No authority/conflict hierarchy or complete locked-decision list is present.
SCH-002 pin-level connectivityOpenNo complete component/net/designator list, MCU GPIO map, inter-block netlist, active-part pin numbers, connector pin maps other than partial J8/J9, or unused-pin treatment.
SCH-003 U3 LMR33630OpenU3's exact MPN variant, VIN source, output target/load, switching frequency option, inductor, CIN/COUT, bootstrap capacitor, feedback-divider values, EN/PG treatment, ratings, and approved designators are absent.
SCH-004 ground domainsOpenThe attachment does not define the complete membership of GND, ISO_GND, and CHASSIS, intentional coupling components, shield/chassis terminations, serial-isolator side assignments, or every machine-side return. Only a local statement that J8/J9 machine +5 V/COM must not bridge to board GND is present.
SCH-005 PoE architectureOpenNo PD/PSE controller MPNs, powered pairs/magnetics topology, classification/current/power target, isolated-converter topology, detection/signature values, protection, or remote-panel power budget is supplied.
SCH-006 thirteen BOM groupsOpenNo vetted BOM rows or vet-note resolutions are present, so exact approved MPNs/values/packages and the status of all thirteen formerly-not-OK groups cannot be audited.
Additional Stage 11 gaps that prevent exact J8/J9 capture
  1. J8 Credit and Coin LED return paths are missing. Pins 1 and 2 name the two signals, while pins 4 and 6 are explicitly dedicated to U21 and U22 return legs. The attachment does not say what U19/U20 LED cathodes connect to (shared machine COM, another connector, or another J8 pin).
  2. J8 logic outputs are unnamed. U19–U22 phototransistor collector/emitter orientation, pull-up rail voltage/name, and destination ESP32 GPIO/net names are absent.
  3. J9 does not provide two contact terminals for three claimed dry-contact channels. U23 has only J9 pin 1 assigned, U24 only pin 3, and U26 only pin 7, while pins 2, 4, and 8 are locked NC. Their second phototransistor terminals/shared return topology are not stated. U25 alone has an explicit two-wire pair on pins 5–6.
  4. PC817C is a polarized phototransistor optocoupler, not inherently a polarity-agnostic dry-contact/PhotoMOS relay. Collector/emitter direction and allowable reverse VCE must be defined and datasheet-verified; the phrase “polarity-agnostic dry contact” cannot be implemented literally without clarification or a different part.
  5. J9 logic drive mapping is missing. U23–U26 LED anode/cathode orientation, drive rail, controlling GPIO/net names, and required inactive/reset states are absent.
  6. Electrical envelope is missing. Machine input/output voltage, current, pulse width/rate, common-mode/reverse-polarity expectations, and resistor power ratings are needed to validate 1.5 kΩ/390 Ω and PC817C CTR/speed/current/voltage margins.
  7. Isolation-rating statement needs a cited part/package condition. The stated 75 V continuous / 2500 V spike withstand is not tied to a datasheet parameter, test duration, creepage condition, or system safety requirement.
Other exact facts still required before any complete schematic build
  • Full reference-designator BOM with exact approved MPN, value, tolerance/rating, package/footprint, and quantity for every component.
  • Full power-entry/protection and rail netlist, rail names, load budget, regulator support values, sequencing/enables, and test points.
  • Exact ESP32-S3 module variant and every GPIO/strap/reset/enable/power/debug assignment.
  • Both W5500 blocks: SPI chip-select/interrupt/reset mapping, magnetics/RJ45 parts and pins, termination/bias/filter parts, clock source, LEDs, and PoE center-tap connections.
  • Serial block: exact hardware-interlocked mux topology, enable truth table, isolator side supplies/grounds, MAX3232 charge-pump values, connector pins, and all unused channels/pins.
  • F-RAM, RTC, security device, and any flash/storage MPNs, bus assignments/addresses/chip selects, backup-power circuitry, pull-ups, and decoupling.
  • Programming/debug connector MPN/pinout, reset/boot controls, and production test-access list.
  • Complete connector table for J1 and all external interfaces, including direction, mating orientation, shield/chassis handling, and NC pins.
  • Complete decoupling/support-component allocation per active-part supply pin and explicit NC/reserved-pin treatment.
Manufacturer PDFs need not be embedded if exact MPNs are supplied and current manufacturer datasheets can be independently retrieved. The current blocker is that the MPN/BOM/netlist source facts needed to know which datasheets and pins to verify are absent.
Decision: No schematic components or nets were created. The v2 supplement closes only a small portion of Stage 11 naming; it does not close SCH-001–006 or provide enough unambiguous connectivity to capture J8/J9 safely.
Authoritative bundle v3 audit — 2026-08-20
Audited source: intercede_authoritative_bundle_v3.md-8f6c70a5-7925-4d9b-9c49-e68548bf7c47.txt (17,208 characters, read completely).
Current project state inspected: 9 active components, 0 nets, no no-connect markers.
Issues now resolved
  • J8 U19/U20 LED cathodes and J9 U23/U24/U26 phototransistor emitters are explicitly assigned to MACH_COM.
  • PC817C behavior is explicitly fixed-polarity and locked; no bidirectional-contact behavior is required.
  • U3 divider is now specified as R3 = 19.6 kΩ top and R4 = 8.45 kΩ bottom; with the LMR33630 nominal 1 V reference this targets approximately 3.32 V.
  • The three intended domains are named: logic GND, isolated serial ISO_GND, and RJ45 shield CHASSIS; Stage 11 separately uses machine external common MACH_COM and forbids bridging it to board GND.
  • The previously prohibited/removed parts are absent from the v3 BOM.
Remaining schematic-critical blockers
B1 — Downstream PoE PSE power stage is not defined or present in the approved BOM
The specification requires at least 25.5 W at a Type-2 PSE port, but the board has only a nominal 12 V input and +5 V/+3.3 V bucks. TPS23861 requires a 44–57 V VPWR source. No approved 12 V→48/54 V topology, transformer/inductor, switching MOSFET, rectifier, current sense, feedback/compensation, UVLO, soft-start, output capacitors, ratings, or exact MPNs/values are supplied.
The current project contains provisional U29 LM5155DSSR, but LM5155 and its power-stage BOM are not in the authoritative v3 BOM/build stages. It cannot be treated as approved.
B2 — TPS23861 mandatory external circuitry is absent from the BOM and netlist
TI's datasheet requires, per used port, an external 100 V MOSFET, 0.250/0.255 Ω Kelvin current-sense network, 47 Ω drain resistor, 22.1 Ω SEN resistor, 0.1 µF/100 V port capacitor, fuse, TVS/clamps, and cable terminations; unused-port treatment and I²C/auto-mode strapping must also be defined. None of these parts have references, approved MPNs, values/ratings, or connections in the v3 BOM. The required PSE injection bridge/center-tap wiring to the spare pairs is also not given pin-by-pin.
B3 — Controller-board versus remote-display schematic scope is contradictory
The BOM lists two H1102NL (T1B,T2B) as “both ends” of the controller-to-display link, while the remote display is a separate powered device and the spec refers to remote U101/U102. A transformer at the display end, the display PD controller (TPS23751), isolated 5 V converter, display W5500/ESP32/ATECC, RFID, LEDs, and auth-gating hardware are not otherwise included in the controller BOM. The source must state whether this Flux project is controller-only or must also contain a separate complete display schematic, and assign each connector/magnetic/controller to the correct board.
B4 — Ethernet block conflict and missing second-port circuit
  • Build Stage 6 locks controller LAN T1=H1601CG, J3=KH-RJ45-58-8P8C.
  • PoE SPEC-7 says H1102NL and KH-5224-8P8C on both ends of the display PoE link.
  • BOM adds U7B, T1B,T2B, and JD as “Requires selection,” not locked/retained.
The second W5500's final designator, exact connector/magnetics assignment, PHY termination network, center-tap connections, crystal/clock source, reset/interrupt/CS pins, LEDs, and all W5500 mandatory bias/decoupling parts are not specified. Current project designator U27 does not match BOM U7B.
B5 — No complete MCU/ESP32 signal-allocation table
Fixed peripheral pins can be derived from datasheets, but the arbitrary selections cannot. Missing approved assignments include both W5500 CS/INT/RST signals, ESP32↔ATmega SPI slave/backhaul handshake/chip-select, FRAM CS, optocoupler input/output GPIOs, U17 input/output/OE pins, isolator-supply/FET controls, PSE reset/interrupt/I²C or mode straps, authentication enable hooks, USB service/boot controls, and debug header pins. These choices materially affect firmware and the hardware interlock.
B6 — Hardware-interlocked 1-of-3 serial mux topology is not supplied
The text names U10/U12/U13, U15/U16, Q3/Q4, U17, and two MAX3232 devices but gives no pin-to-pin topology, enable truth table, power-domain allocation, default/reset state, or proof that only one isolator output can reach the shared RX. Two isolated converters and two FETs do not by themselves define independent power selection for three ADuM1201 paths. U17's four channels and OE pins are unmapped.
B7 — Ground-domain instructions conflict on isolated serial connectors
Stages 9/10 say J4/J5/J6 pin 3 = GND, while the primary lessons file says machine-side circuitry after RBE-0505S/ADuM1201 uses ISO_GND and must never be logic GND. The authoritative source must explicitly resolve each J4/J5/J6 pin-3 net and define whether U15 and U16 outputs share one ISO_GND or require distinct isolated returns. MACH_COM must remain separate from both.
B8 — LMR33630 support BOM conflicts with the manufacturer application requirements
Datasheet verification found:
  • A 220 nF/50 V X7R high-frequency capacitor is required directly at each VIN. The bundle labels C3=220 nF as CFF for U2 and provides no 220 nF input bypass for U3.
  • For the datasheet's 400 kHz, 3 A reference design, 5 V uses 8 µH and 4×22 µF output; 3.3 V uses 6.8 µH and 4×22 µF. The locked BOM provides U2 6.8 µH with only 22+10 µF and U3 6.8 µH with only 10 µF. TI's worked transient example requires at least 52 µF effective (72 µF after stated tolerance/bias allowance) for a 2 A step.
  • The reduced capacitor banks might be valid only with a documented lower load/transient requirement and stability/transient analysis. Those rail load profiles and acceptance limits are absent.
Therefore SCH-003 is not closed: the dividers are reconciled, but the input-bypass identity and output-capacitor/inductor operating design are not verified.
B9 — Power budget and input-path ratings are incomplete
The spec estimates ~17 W remote display, ~6 W local controller, and ~2 W isolated loads, but does not reflect PSE/boost losses to the 12 V input or define worst-case simultaneous peak current. J1 contact current, source fuse, Q1 thermal/current margin, inductor saturation currents, buck peak rail loads, and the future 48/54 V converter input current cannot be validated without a full budget.
B10 — Approved BOM is not actually complete for the described circuitry
The CSV omits required or referenced functions/components, including: full PSE power stage and protection; W5500 PHY bias/termination/decoupling networks; I²C pull-ups; ATmega reset/AREF/AVCC support; ESP32 boot/service details; RTC battery isolation/support; ATECC support; USB Q2/D2/L3 purposes and wiring; serial mux/interlock passives; MAX3232 bypass allocation; and PWR_FLAG/test-point references. It also gives no thirteen-group vet-note ledger or explicit resolution table, so SCH-006 cannot be audited as closed.
B11 — Connector and debug mappings remain incomplete
J1 gives two contacts per rail but no pin numbers. J2 USB-C pin mapping and Q2 function are absent. J7 2×10 debug pinout is absent. J3/JD exact pin-to-transformer/PoE-pair/shield mapping is absent. J4/J5/J6 have external signal order but no corresponding MAX3232 channel/pin allocation. These cannot be guessed safely.
Current-project discrepancies
  • U1 is instantiated as LM74700QDBVTQ1, while the locked part is LM74700QDBVRQ1; a substitute property is not the same as instantiating the approved MPN.
  • U27 should be reconciled with the source's unresolved U7B designation.
  • U29 LM5155DSSR is provisional and absent from the authoritative BOM.
  • None of the nine existing components has any net connectivity, so no completed functional block can yet be verified.
Scope status

Table


ItemStatus
Read v3 bundleCompleted
Resolve J8/J9 return ambiguity and PC817 polarityCompleted
SCH-001 complete authoritative packageFailed / still incomplete
SCH-002 complete pin-level connectivityFailed / blocked
SCH-003 U3 regulator reconciliationPartial; divider resolved, power-stage validation blocked
SCH-004 domain separationPartial; Stage 11 resolved, isolated serial conflict remains
SCH-005 PoE architectureFailed / power stage and per-port implementation missing
SCH-006 thirteen BOM groupsFailed / vet-note ledger and complete BOM absent
Complete schematic buildUnattempted due to material blockers
PCB layoutUnattempted as required
Decision: Stop before schematic mutation. Building now would require inventing a high-power 12 V→48/54 V converter, TPS23861 port circuitry, arbitrary GPIO assignments, serial interlock logic, ground-domain connections, and missing approved BOM parts. These facts materially affect topology, safety, power limits, firmware, and approved MPNs.
  • Executive conclusion

  • Required source files missing from the supplied package

  • Gap classification

  • Blocking before schematic

  • Blocking before PCB layout

  • Blocking before manufacturing release

  • Non-blocking for schematic capture

  • Resolution of the six principal design gaps

  • Mandatory schematic acceptance criteria

  • Required next upload

  • Authoritative ZIP access attempt — 2026-08-20

  • Status by assigned item

  • Evidence that the ZIP exists and contains EDA libraries

  • Exact blocker to resume

  • Plain-text bundle verification — 2026-08-20

  • Authoritative bundle v2 gap audit — 2026-08-20

  • What the attachment actually contains

  • Status of SCH-001 through SCH-006

  • Additional Stage 11 gaps that prevent exact J8/J9 capture

  • Other exact facts still required before any complete schematic build

  • Authoritative bundle v3 audit — 2026-08-20

  • Issues now resolved

  • Remaining schematic-critical blockers

  • Current-project discrepancies

  • Scope status