I started the full wiring pass and made real schematic changes, but I’m blocked now because there are no available ACUs, so I can’t continue executing mutations or ERC cleanup.
What was completed:
Added support passives for USB VBUS, eFuse, AP63203 buck, isolated power filtering, LDOs, MCU decoupling, isolated I2C pull-ups, SRC4392 decoupling, clock decoupling, reset, and AES3 termination.
Wired USB-C VBUS/GND, USB D+/D− with ESD, CC1/CC2 to TUSB320, TPS25210 eFuse, AP63203 3.3 V buck, and TUSB320 power/config/I2C.
Datasheet check found an important correction: AP63203 is fixed 3.3 V, so the added FB divider must be removed and FB tied to the 3.3 V output sense.
Datasheet check also confirmed RT1024 needs internal DCDC support: 4.7 µH inductor, 33 µF output cap, and delayed DCDC_PSWITCH assertion.
Open items:
Remove AP63203 FB divider R4/R5 and tie U5 FB to 3V3_MCU.
Change AP63203 inductor L1 from 2.2 µH to 3.9 µH.
Add/wire RT1024 internal DCDC parts and 24 MHz MCU clock source.
Wirelessly connects nets on schematic. Used to organize schematics and separate functional blocks. To wirelessly connect net portals, give them same designator. #portal
General Purpose Thick Film Standard Power
and High-Power Chip Resistor
47 kOhms ±5% 0.125W, 1/8W Chip Resistor 0805 (2012 Metric) Automotive AEC-Q200 Thick Film
Features:
- RMCF – standard power ratings
- RMCP – high power ratings
- Nickel barrier terminations standard
- Power derating from 100% at 70ºC to zero at +155ºC
- RoHS compliant, REACH compliant, and halogen free
- AEC-Q200 compliant