Pulse Induction Metal Detector PCB Design


I've made a plan, and started work on it.
Proceed with final stabilization of the PCB design:
  1. Grounding and validation:
  • Fix all grounding issues and enforce a strict single star-ground topology at the 12V input only
  • Ensure complete separation of analog, digital, and power return paths with no unintended coupling
  • Rerun full ERC and DRC after grounding corrections and resolve all remaining violations
  1. Component placement:
  • Place the Arduino Nano centrally between the analog front-end (TL072 + LM393) and the power driver section (TC4420 + IRF3205 + coil)
  • Maintain clear physical separation between analog and power domains to minimize electromagnetic coupling
  1. Power integrity:
  • Add bulk capacitors for each power domain:
    • Analog domain: 10µF–47µF low-noise capacitor
    • Digital domain: 10µF–47µF capacitor near Arduino Nano
    • Power domain: 100µF–470µF near coil driver input
  • Ensure each bulk capacitor is placed close to its respective power entry point
  1. Final review:
  • Re-check decoupling placement (100nF at every IC power pin)
  • Verify no routing crosses between analog and power zones
  • Confirm coil driver loop remains minimal and isolated
Only proceed to final Gerber, BOM, and Pick-and-Place generation after all checks pass successfully.
I've made a plan, and started work on it.
Fix grounding and checks
Place MCU between domains
Add bulk capacitors
No schematic yet

Talk to Flux to get started.

ERC/DRC Fix Execution Plan
Goal
Resolve all ERC and DRC violations in the Pulse Induction metal detector PCB project, with emphasis on grounding strategy, high-current path robustness, analog/power isolation, placement improvements, and power integrity. Only export manufacturing outputs after validation shows zero critical or high-severity issues.
Priorities
  1. Ground segregation with a single star-ground point at the 12 V input.
  2. Minimum 3 mm trace widths for coil-current and power-switching paths.
  3. Clear analog-to-power clearance and isolation.
  4. Arduino Nano placed centrally as a functional boundary/buffer between analog and power sections.
  5. Verify and place local 100 nF decoupling at active devices plus per-domain bulk capacitors.
  6. Rerun ERC/DRC and do not export until zero critical/high-severity issues remain.
High-Level Execution Phases
1. Baseline review and issue triage
  • Run the full ERC/DRC review and collect all current violations.
  • Group findings by category: connectivity/ERC, placement/layout, routing/clearance, missing decoupling, width/rules, and manufacturability.
  • Rank issues by criticality, fixing blocking electrical and safety/power issues first.
2. Grounding architecture cleanup
  • Identify all analog, digital/control, and power-return current paths.
  • Rework the grounding scheme so analog and switching/high-current grounds remain segregated.
  • Define one intentional star-ground tie point at the 12 V input return.
  • Remove accidental alternate return connections or copper paths that defeat the star-ground strategy.
  • Verify sensitive analog reference/sense paths do not share noisy switching return current loops.
3. High-current path rule enforcement
  • Identify the coil-drive loop and all power-switching nets/components.
  • Apply or tighten layout rules so these paths use a minimum 3 mm trace width wherever physically possible.
  • Inspect bottlenecks at pads, vias, connectors, and neck-down regions.
  • Re-route or reposition parts as needed to preserve current capacity and reduce loop resistance/inductance.
4. Analog vs. power section isolation
  • Define a clear physical and routing boundary between the analog front end and the power-switching section.
  • Increase spacing/clearance between noisy switching nodes and analog nets/components.
  • Keep switching loops compact and away from amplifier, comparator, ADC, and reference circuitry.
  • Review copper pours and return paths so analog areas are not contaminated by switching-current coupling.
5. Functional placement refinement
  • Reposition the Arduino Nano to a central location so it acts as a practical buffer/interface between analog and power sections.
  • Cluster analog components close to the analog signal chain.
  • Cluster high-current/power-switching parts close to the input/power side and coil path.
  • Reposition connectors and support passives as needed to reduce crossing nets and long noisy runs.
6. Decoupling and bulk capacitance verification
  • Check every IC/module for a local 100 nF decoupling capacitor placed close to its supply pins.
  • Add or move missing/local decoupling capacitors as required.
  • Verify each power domain has appropriate bulk capacitance near its entry/load concentration.
  • Distinguish domains such as raw 12 V input, switched power/coil driver supply, Arduino/digital rail, and analog rail.
  • Confirm decoupling and bulk caps have short return paths into the intended ground domain.
7. Rule cleanup and violation closure
  • Resolve remaining ERC items such as floating pins, mislabeled nets, missing power intent, or unconnected passive support parts.
  • Resolve remaining DRC items such as airwires, clearance violations, width violations, overlaps, invalid layer usage, and missing footprints/models if relevant.
  • Re-run checks iteratively after each major correction batch instead of waiting until the end.
8. Final validation gate
  • Run ERC and DRC again after all corrective actions.
  • Confirm there are zero critical or high-severity violations.
  • If any critical/high issues remain, return to corrective steps and do not export.
  • Optionally review medium/low severity items for manufacturability and robustness before release.
9. Release outputs
  • Only after the validation gate passes:
    • Export Gerber
    • Export BOM
    • Export Pick-and-Place
  • Perform a final sanity review of outputs before handoff/fabrication.
Suggested Working Order
  1. Full review snapshot
  2. Ground/star-point restructuring
  3. 3 mm power/coil rule setup and routing fixes
  4. Analog/power separation improvements
  5. Arduino Nano placement refinement
  6. Decoupling and bulk capacitor verification
  7. Remaining ERC/DRC cleanup
  8. Final validation
  9. Manufacturing exports
Success Criteria
  • Single intentional star-ground connection at 12 V input.
  • Coil/power-switching paths meet 3 mm minimum width target.
  • Analog circuitry is physically and electrically isolated from noisy power switching.
  • Arduino Nano is centrally placed to buffer analog and power sections.
  • Local 100 nF decoupling exists at each active device, with per-domain bulk capacitance verified.
  • ERC/DRC report shows zero critical and zero high-severity violations before export.
  • Goal

  • Priorities

  • High-Level Execution Phases

  • 1. Baseline review and issue triage

  • 2. Grounding architecture cleanup

  • 3. High-current path rule enforcement

  • 4. Analog vs. power section isolation

  • 5. Functional placement refinement

  • 6. Decoupling and bulk capacitance verification

  • 7. Rule cleanup and violation closure

  • 8. Final validation gate

  • 9. Release outputs

  • Suggested Working Order

  • Success Criteria