Edge13 Schematic Review


The PCB Placement Pass was already reconciled against the live board; no additional project changes were made this session.
Verified state:
  • All 134 footprints are placed: 81 top / 53 bottom
  • J3 USB-C: (27, −32.9) mm, bottom edge
  • J4 USB-A: (44.72, −21) mm, right edge
  • J5 USB-B: (−44.5, −21) mm, left edge
  • BT1: provisional bottom-side placement at (0, 2) mm
  • J1/J2 remain locked at (±17, 12.5) mm, 90° rotation, preserving the official 34 mm CM5 spacing
  • Board remains 110 × 75 mm, four copper layers
  • No reported component-body overlaps or out-of-bounds footprints
  • No routed traces exist; 285 airwires remain
  • The 18 pre-existing legacy GND via nodes remain
Remaining issues:
  • BT1’s 94.6 × 26 mm body conflicts with the fixed CM5/antenna region. Its position cannot be accepted until enclosure and vertical-clearance geometry are resolved.
  • D3 retains a library/differential-pair warning that must be reviewed before USB routing.
  • Routing congestion is expected near J1, U5, R17, R18, and TP11.
  • Connector plug/enclosure clearance has been planned geometrically but still requires enclosure-level validation.
Execution stopped because your ACUs ran out.
Received notification from "PCB Placement Pass" that it finished — picking the work back up.
The PCB Placement Pass was already fully reconciled against the live board. This is a duplicate completion notification, so no further changes were made.
Placement is complete; remaining unresolved items are the provisional BT1/CM5 mechanical conflict, the D3 USB warning, and enclosure-level connector clearance validation. No routing or schematic changes were performed.
stop all work
Stopped. No further project changes will be made.
Received notification from "PCB Placement Pass" that it finished — picking the work back up.
This is a duplicate completion notification. The placement pass was already reconciled, and the user subsequently ordered all work stopped. No further inspection, placement, routing, or project changes were performed.

J3 USB4085 Replacement Verification
Scope status

Table


RequirementStatusLive evidence
Replace J3 only with GCT USB4085-GF-ACompletedJ3 now instantiates Flux part UID fcfcfd52-62fa-43f5-81b4-3c79a92084ef, part version b5e85569-cc72-43da-b14c-43e033051cef.
Preserve USB-C service/power netsCompletedAll VBUS, GND, CC, D+/D− mappings are restored; SBU contacts remain intentional no-connects.
Use matched library footprint and modelCompleted with library defect notedFootprint USB4085-GF-A.kicad_mod; model usb4085-gf-a.stp. Shell stakes 17–20 are incorrectly authored as NPTH in the library footprint, so physical plated shell grounding is not available even though schematic terminals 17–20 are on GND.
Bottom-edge outward placementCompletedJ3 live edge rule lies exactly on board Y = −37.500 mm and reports faces="down".
No new overlap/out-of-bounds/placement keepout violationCompletedFinal placement engine: 0 overlaps, 0 out-of-bounds. Existing 13 fixed/BT1 keepout reports are unchanged from before this replacement.
Board/stackup unchangedCompleted110 × 75 mm, custom four-layer, total thickness 1.60 mm.
Routing unchangedCompletedNo routeSegment nodes; virtual via count remains 18. No routing tool or copper mutation was used.
J3 live readback
  • Designator: J3
  • Manufacturer: GCT (Global Connector Technology)
  • MPN: USB4085-GF-A
  • LCSC/JLCPCB part: C7095263
  • Part UID: fcfcfd52-62fa-43f5-81b4-3c79a92084ef
  • Position: X = +27.0000 mm, Y = −28.7011 mm
  • Rotation: 0°
  • Layer: Top
  • Component body bounds: approximately X = 21.69…32.31 mm, Y = −34.24…−23.16 mm
  • Footprint: USB4085-GF-A.kicad_mod
  • 3D model: usb4085-gf-a.stp
  • Footprint edge rule: direction 180°, inferred offset 8.799 mm; rendered edge line at Y = −37.500 mm, facing down/outward.
  • Datasheet suitability: top-mount, side-entry USB 2.0 Type-C receptacle; 2.10 mm shell-stake length is compatible with the unchanged 1.60 mm board.
Full terminal mapping
The library symbol uses numbered terminals. The mapping is derived from the published part’s ordered 16-contact pattern and the GCT component-side recommended PCB layout.

Table


J3 terminalUSB-C contactFunctionNet
1A1GNDGND
2A4VBUSUSB_C_VBUS_RAW
3A5CC1USB_C_CC1
4A6DP1SERVICE_USB_DP
5A7DN1SERVICE_USB_DN
6A8SBU1Intentional no-connect
7A9VBUSUSB_C_VBUS_RAW
8A12GNDGND
9B12GNDGND
10B9VBUSUSB_C_VBUS_RAW
11B8SBU2Intentional no-connect
12B7DN2SERVICE_USB_DN
13B6DP2SERVICE_USB_DP
14B5CC2USB_C_CC2
15B4VBUSUSB_C_VBUS_RAW
16B1GNDGND
17Shell stakeShield/retentionGND in schematic
18Shell stakeShield/retentionGND in schematic
19Shell stakeShield/retentionGND in schematic
20Shell stakeShield/retentionGND in schematic
Live net membership confirms:
  • USB_C_VBUS_RAW: J3 pins 2, 7, 10, 15.
  • GND: J3 pins 1, 8, 9, 16, 17, 18, 19, 20.
  • USB_C_CC1: J3 pin 3.
  • USB_C_CC2: J3 pin 14.
  • SERVICE_USB_DP: J3 pins 4, 13.
  • SERVICE_USB_DN: J3 pins 5, 12.
  • No-connects: J3 pins 6, 11.
Pad count and footprint quality
  • Live J3 pad nodes: 20 total.
  • Pads 1–16: sixteen 0.4064 mm drilled through-hole contact pins on 0.85 mm pitch, arranged as two rows.
  • Pads 17–20: four shell/retention stake holes.
Blocking library-footprint limitation
The source footprint payload defines shell stake pads 17–20 as np_thru_hole ovals rather than plated through-hole solder pads. This conflicts with the GCT recommended PCB layout’s solder-area intent and the exact project requirement that all four shell stakes be grounded. The schematic terminals are connected to GND, but the current library footprint provides no plated annular copper for a physical shell-to-GND connection. No footprint edits were made because the task explicitly required the existing library footprint/model. A Flux part-quality report was filed against https://www.flux.ai/adrian95/usb4085-gf-a.
Nearby placements changed

Table


PartPrevious positionFinal positionLayerReason
D1(+27.0, −27.0) mm(+30.0, −25.3) mmTopClear the deeper connector body and align the USB ESD array behind the new contact field.
C2(+30.5, −27.0) mm(+34.0, −25.5) mmTopClear J3/D1 while retaining local raw-VBUS bulk capacitance.
D4(+35.0, −34.5) mm(+19.0, −31.0) mmTopClear the new J3 body and its routing keepout while remaining in the USB-C raw-VBUS region.
C37(+33.0, −28.0) mm(+41.0, −30.0) mmBottomClear J3 and remain near U2’s eFuse timing pin.
TP17(+33.0, −25.5) mm(+36.0, −27.0) mmTopResolve the local conflict created by moving C2; remains accessible.
No other component placement was changed.
Verification results
Placement checks
  • Component-body overlaps caused by this change: 0.
  • Components outside board caused by this change: 0.
  • Placement keepout violations caused by this change: 0.
  • J3 edge placement: success; line at Y = −37.500 mm, mating face down/outward.
  • Existing raw keepout count remains 13, consisting of the previously documented BT1 versus CM5 all-layer-body exclusions and fixed J1/J2/CM5-hole self-intersections. These were not changed.
Board-check diagnostic
The final check-board run reports 60 pre-routing warnings. Relevant to this change:
  • J3 pins 1, 8, 9 and 16 are reported inside edge-connector keepouts; the routing checker explicitly states those keepouts will be ignored. This is an edge-connector routing-model condition, not a component-body placement violation.
  • One ROUTING_UNROUTABLE_DIFFERENTIAL_PAIR_PINS warning remains on D1 for the service USB pair. Moving D1 directly behind J3 did not clear it. Both J3 and D1 expose duplicated flow-through pads on each USB data net; the board checker treats one set as independent differential-pair endpoints. Resolving this requires explicit routing or a part/router model change, both outside this component-replacement-only scope.
  • The prior D3 duplicate-pad warnings and Q1/Q6 same-net multi-pad warnings remain unrelated and unchanged.
Integrity confirmation
  • Board outline: unchanged, 110 × 75 mm.
  • Stackup: unchanged, 1.60 mm four-layer.
  • Net names and net properties: unchanged.
  • All non-J3 schematic connectivity: unchanged.
  • Routing state: unchanged; 0 route segments, 18 existing virtual stitching vias.
  • No traces, vias, pours, board rules, or unrelated component properties were authored.
  • Scope status

  • J3 live readback

  • Full terminal mapping

  • Pad count and footprint quality

  • Blocking library-footprint limitation

  • Nearby placements changed

  • Verification results

  • Placement checks

  • Board-check diagnostic

  • Integrity confirmation