I’m blocked because your account has no available ACUs, so AI execution tools are unavailable and I can’t continue routing or running final checks right now.
Accomplished so far:
Applied the uploaded BOM MPNs/footprint fields to the project properties as provided.
Changed the PCB from 200 × 200 mm to 100 × 100 mm, 4-layer stackup with Layer 2 as ground and Layer 3 as power.
Re-placed all 141 components on the 100 × 100 mm board with functional separation: analog inputs left, ESP32 top edge, Class-D/output stage right, power/regulators bottom/right.
Placement is mostly cleaned up, but 3 decoupling-loop warnings remained after the last placement pass: C14, C26, C33.
Open items:
Route every net.
Resolve remaining placement/DRC warnings.
Run final ERC/DRC.
Confirm whether the custom footprint names from the spreadsheet are accepted by manufacturing/export, since some were set exactly but reported as non-standard property values.
Wirelessly connects nets on schematic. Used to organize schematics and separate functional blocks. To wirelessly connect net portals, give them same designator. #portal
General Purpose Thick Film Standard Power
and High-Power Chip Resistor
47 kOhms ±5% 0.125W, 1/8W Chip Resistor 0805 (2012 Metric) Automotive AEC-Q200 Thick Film
Features:
- RMCF – standard power ratings
- RMCP – high power ratings
- Nickel barrier terminations standard
- Power derating from 100% at 70ºC to zero at +155ºC
- RoHS compliant, REACH compliant, and halogen free
- AEC-Q200 compliant