Connector Design Options


For Rev B, I’ll preserve all 44 direct ESP32 pin-to-pin relocation connections while adding the removable TBD62083APG driver, HMI level shifting, protected USB power, pluggable outputs, and grouped 24V/5V/0V test points.
Before redesigning, confirm:
  1. HMI interface and voltage: UART, I²C, or other; 5 V or 3.3 V?
  2. Number of 24 V outputs and maximum current per output?
  3. Should 24 V power the ESP32 through an onboard 24 V→5 V converter, or remain isolated from USB/5 V power?
  4. Should Rev B replace this project or be created as a separate project so Rev A remains intact?
I’ll review the pasted Rev B requirements and reconcile them with the existing direct-relocation architecture before making changes.
Created a thread; Cloned a project
BF-SR-PCBv1-RevB
BF-SR-PCBv1 signal relocation PCB for ESP32-S3-DEVKITC-1-N32R16V
Build Rev B schematic
Starting...
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Rev B has been cloned separately, so Rev A remains untouched. The Rev B schematic build is underway now, including verification of the original 44 pass-through nets before any active circuitry is added.
Created the separate BF-SR-PCBv1-RevB clone, leaving Rev A unchanged. The Rev B schematic task completed its baseline 44-net inspection and continued through component research/build work, but I cannot inspect or validate the final report because no ACUs remain.
Remaining:
  • Review the completed Rev B schematic changes and selected parts.
  • Confirm all 44 pass-through nets remained unchanged.
  • Resolve ERC issues and approve the schematic checkpoint.
  • Place components, verify ESP32 socket geometry, route, and run final DRC.
Review Rev B schematic
Review selected components
Verify pass-through nets
Document Rev B decisions

BF-SR-PCBv1 Project Specification
Purpose
Mechanical and signal relocation PCB for an Espressif ESP32-S3-DEVKITC-1-N32R16V development board. The PCB contains no active circuitry; it only relocates signals through copper traces.
Core Requirements
  • 2-layer PCB.
  • Mount one ESP32-S3-DEVKITC-1-N32R16V using two 1x22 female sockets.
  • Route every pin straight through 1:1 to two additional 1x22 male headers.
  • No pin remapping.
  • No resistors, capacitors, LEDs, voltage regulators, ICs, or other active/support circuitry.
  • Only copper traces between connectors and test points.
  • Four M3 mounting holes.
  • USB-C connector remains accessible.
  • No copper under USB connector.
  • Four grouped service test points:
    • TP1 = 5V
    • TP2 = 3.3V
    • TP3 = 3.3V
    • TP4 = GND
  • Compact layout while maintaining 2.54 mm connector spacing.
  • Black solder mask and white silkscreen.
  • Intended for industrial DIN enclosure mounting.
Required Silkscreen
  • BayFinder™
  • BF-SR-PCBv1
  • Signal Relocation PCB
  • Revision A
  • ESP32-S3-DEVKITC-1-N32R16V
  • No active circuitry.
Verification Criteria
  • All 44 devkit socket pins connect 1:1 to matching relocation header pins.
  • No active components or passives in BOM except connectors, sockets, test points, mounting holes.
  • Service test points connect to the required rails only.
  • Board has 2 layers, four M3 holes, USB keepout/copper exclusion, and readable silkscreen.
  • Purpose

  • Core Requirements

  • Required Silkscreen

  • Verification Criteria