J1 footprint: kept as the custom TE 5787170-9 footprint and documented as provisional / must be manually verified against the TE drawing before manufacture.
Pin mapping: documented the required continuity-test table for J1 pins 1–8, 99, and 100.
ADC protection: added D1–D4 PESD12VL1BA-N TVS diodes from each protected ±10 V analog output to AGND near J1.
Placement: cleaned placement around J1; D1–D4 are close to the protected dSPACE output pins.
Silkscreen: added labels for J1 pin 1, cable/mating direction, analog output/return labels, and power/ground/chassis labels.
Routing: final traces were not routed, per your instruction and because J1/cable continuity still needs manual verification.
Reviews: remaining layout errors are expected airwires because the board is intentionally unrouted; no final manufacturing export was generated.
BOM: updated BOM now includes 4× PESD12VL1BA-N and J1 listed with MPN 5787170-9.
Fabrication status:NOT ready for fabrication yet until J1 footprint dimensions, pin 1 orientation, cable direction, and dSPACE continuity are physically verified.
Documentation: I created the project file “Pre-Routing Verification Package — WRIM DFIG dSPACE Sensor Interface” with the full footprint audit, continuity table, ADC protection rationale, placement summary, and remaining blockers.
Wirelessly connects nets on schematic. Used to organize schematics and separate functional blocks. To wirelessly connect net portals, give them same designator. #portal
General Purpose Thick Film Standard Power
and High-Power Chip Resistor
47 kOhms ±5% 0.125W, 1/8W Chip Resistor 0805 (2012 Metric) Automotive AEC-Q200 Thick Film
Features:
- RMCF – standard power ratings
- RMCP – high power ratings
- Nickel barrier terminations standard
- Power derating from 100% at 70ºC to zero at +155ºC
- RoHS compliant, REACH compliant, and halogen free
- AEC-Q200 compliant