Done. I deleted CN1 and moved U_MCU/Pico to the top of the board; it is now centered at about (10 mm, 88 mm) with its top edge just inside the board outline.
Open item: the Pico was clamped at the board edge, so if you want more clearance from the top edge I can drop it slightly lower.
I’ll add a low-current front-panel power/enable switch rather than a high-current 12 V path switch, plus output/status LEDs with current-limiting resistors, then verify the schematic changes.
Added the power switch and output LEDs. SW_PWR is a low-current front-panel switch that pulls Pico 3V3_EN to GND to turn logic off, and I added green indicators for BUS_12V and VOUT_19V5 with 4.7kΩ and 8.2kΩ series resistors.
Open items:
These are placed near the top/front-panel area but not routed yet.
If you intended a true high-current input disconnect instead of a Pico enable switch, that needs a different switch/contactor architecture.
Rev A Architecture Plan — Rackmount 12V Distribution PSU
Recommended Rev A Scope
Build Rev A as a single-PSU 12V distribution controller/backplane with a target of 12 physical boost-module slots, while accepting that mechanical/thermal analysis may reduce the first build to 8–10 slots. Rev A defers Ethernet and dual-PSU HA/failover.
Top-Level Architecture
Diagram
Key Decisions
PSU Input
Use Bellwether 70012-1111 for Dell D750E-S1.
User supplied product page, package spec, documentation, and 2D drawing.
Create/import a custom connector part and footprint from the Bellwether files before layout.
Verify Dell D750E-S1 pinout before wiring sense, PS_ON, present, or current-share pins.
Add total input current sensing if practical, but do not rely on INA3221 on the distribution board for per-slot telemetry.
Slot Count
Aim for 12 daughterboard connectors.
Expect possible reduction to 8–10 after mechanical/thermal layout because the slot bay next to one PSU is only about 157.5 mm wide.
Firmware budget remains based on one 750W PSU, not 12 simultaneous 180W outputs.
Per-Slot Power Switching
Preferred implementation:
Per-slot high-side protection/eFuse/hot-swap/load-switch stage sized for the actual ~16–20A worst-case 12V slot current.
MCU enable control per slot.
Fault output per slot if the selected protection device supports it.
Avoid relying on only a discrete MOSFET plus firmware for short-circuit protection. The previously listed TPS25952x-class part may be undersized and needs replacement or architectural adjustment.
Current and Efficiency Monitoring
Distribution-board INA3221 is dropped from Rev A direction.
Prefer per-daughterboard current monitoring so each boost module can report both input and output current for efficiency calculation.
Cost-driven default: two INA181 current-sense amplifiers per daughterboard, one on the 12V input side and one on the 19.5V output side.
Alternative: one distribution-board per-slot input current sensor plus one daughterboard output sensor, but this complicates harnessing/backplane analog routing and is less modular.
Two-channel current monitor ICs remain possible but are currently less attractive due to JLCPCB cost.
LM5122 Mode Control
Keep a MODE control signal to allow firmware-assisted efficiency optimization if the LM5122 implementation supports practical CCM/DCM or efficiency-mode control.
UVLO and hardware safety thresholds stay local to the daughterboard.
Firmware may adjust mode based on measured output current, but hardware protection must remain independent.
MCU / Ethernet
Ethernet is deferred to Rev B.
Raspberry Pi Pico 2 / RP2350 remains acceptable for Rev A control, slot enables, status LED, fault logging, and USB/debug access.
Leave expansion path for future W5500 or other Ethernet control-plane hardware.
Edge Connector Boundary
User-selected 32-pin connector has stated 3A/contact rating.
Existing allocation with 10 VIN and 10 GND pins gives 30A theoretical per rail side; this is enough for a ~16–20A slot with margin if temperature rise and contact imbalance are acceptable.
Drop separate AGND for now; use single GND plus careful Kelvin/current-sense routing on the daughterboard.
Add status/control pins including EN, MODE, FAULT, PGOOD, current telemetry, temperature telemetry, VOUT sense, and at least one module-present/ID/spare signal if pin budget allows.
Boost Module Boundary
The supplied LM5122 BoM is the daughterboard power-stage candidate. The main rack board distributes 12V and control/status signals; current/temperature monitoring is primarily local to each daughterboard.
Required New Components Not Yet in Current Schematic
Implement one daughterboard monitoring/control block: two INA181 stages, thermistors, MODE/EN/FAULT/PGOOD/VOUT sense.
Add Pico 2 control, status LED, debug, 3.3V logic power.
Replicate slots only after one slot/daughterboard interface is reviewed.
Open Questions
Can 12 vertical daughterboards fit with adequate airflow in the 157.5 mm bay, or should Rev A target 8–10?
Which per-slot protection part can meet ~16–20A with JLCPCB availability and acceptable thermals?
Should each daughterboard have a small local ADC/MCU/digital telemetry, or should analog telemetry return to the distribution-board MCU?
How should the rear DC barrel connectors mechanically mount: directly on daughterboards, panel-mounted with pigtails, or daughterboard-mounted through rear slots?
Recommended Rev A Scope
Top-Level Architecture
Key Decisions
PSU Input
Slot Count
Per-Slot Power Switching
Current and Efficiency Monitoring
LM5122 Mode Control
MCU / Ethernet
Edge Connector Boundary
Boost Module Boundary
Required New Components Not Yet in Current Schematic