Project Status and Action Items

Done. I deleted CN1 and moved U_MCU/Pico to the top of the board; it is now centered at about (10 mm, 88 mm) with its top edge just inside the board outline.
Open item: the Pico was clamped at the board edge, so if you want more clearance from the top edge I can drop it slightly lower.
I need a power switch and some output LEDs
I’ll add a low-current front-panel power/enable switch rather than a high-current 12 V path switch, plus output/status LEDs with current-limiting resistors, then verify the schematic changes.
Added the power switch and output LEDs. SW_PWR is a low-current front-panel switch that pulls Pico 3V3_EN to GND to turn logic off, and I added green indicators for BUS_12V and VOUT_19V5 with 4.7kΩ and 8.2kΩ series resistors.
Open items:
  • These are placed near the top/front-panel area but not routed yet.
  • If you intended a true high-current input disconnect instead of a Pico enable switch, that needs a different switch/contactor architecture.
Route controls and verify
Use high-current switch
Route switch and LEDs
Add LED labels
Run design review

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Mechanical Layout Constraints — Rackmount 12V Distribution PSU
Status
Draft constraints from user-provided chassis concept and Bellwether connector documentation. Use these values to drive board outline, connector orientation, slot pitch, and airflow planning.
Chassis Envelope
  • Rack height: 2U, approximately 89 mm external height.
  • Planned depth: approximately 260 mm.
  • Nominal width target: 10 inches / 254 mm.
  • 3D printed enclosure material: ABS.
  • Wall thickness target: approximately 5 mm.
  • Internal usable width estimate: 254 mm - 2 × 5 mm = 244 mm.
PSU Placement
  • Dell D750E-S1 PSU approximate dimensions:
    • Width: 86.5 mm.
    • Depth: 196.5 mm.
    • Height: 38.5 mm.
  • PSU(s) placed in rear corner of enclosure.
  • Two PSUs can stack vertically inside 2U for future Rev B HA/failover, but Rev A remains single-PSU electrically.
  • Remaining internal width next to one PSU: approximately 244 mm - 86.5 mm = 157.5 mm.
Daughterboard Orientation
  • Distribution-board edge connectors run front-to-back.
  • Daughterboards plug in at right angle and stand vertically, also running front-to-back.
  • Daughterboards require PCB edge fingers for the slot interface; the card-edge contacts are part of the daughterboard PCB copper and must be laid out as edge-connector fingers with bevel/finish requirements, not as a separate connector component on the daughterboard.
  • DC barrel output connectors are exposed toward the rear of the chassis.
  • Daughterboard component height becomes horizontal slot pitch / width consumption.
  • Daughterboard PCB width becomes chassis-height consumption.
  • Target daughterboard width / chassis-height usage: about 50 mm, excluding edge-finger engagement and clearance.
PCB Stackup Direction
  • Use 4-layer boards for both the distribution board and the 19.5 V / 180 W boost daughterboard.
  • Recommended default layer assignment:
    • Layer 1 / Top: components, local high-current pours, critical switching loops.
    • Layer 2 / Inner 1: solid GND reference plane.
    • Layer 3 / Inner 2: power plane / high-current distribution pours where practical.
    • Layer 4 / Bottom: secondary routing, low-speed control, additional copper spreading.
  • Do not split the main GND reference plane except for clearly justified Kelvin sense routing; prefer a single ground system.
  • For the boost daughterboard, keep LM5122 gate-drive/switching loops compact on the top layer and use inner/bottom copper for heat spreading and lower impedance return paths.
Slot Count and Pitch Implications
  • Target Rev A: 12 daughterboard connectors if physically feasible.
  • Available bay width next to PSU: about 157.5 mm.
  • Average slot pitch for 12 slots: 157.5 mm / 12 = 13.1 mm per slot.
  • Average slot pitch for 10 slots: 15.8 mm per slot.
  • Average slot pitch for 8 slots: 19.7 mm per slot.
Conclusion: 12 slots is probably too tight unless daughterboard components are very low-profile and airflow is ducted carefully. 8–10 slots is more mechanically realistic for high-power boost modules in the available width.
Airflow Requirements
  • High-power daughterboards need clear front-to-back airflow channels.
  • Avoid placing tall inductors/electrolytics so they block neighboring slots.
  • Prefer consistent slot pitch with at least a few millimeters of air gap between maximum-height components.
  • Add temperature sensing near the hottest daughterboard regions and at chassis exhaust.
  • Consider fan mounting, intake/exhaust path, and PSU airflow direction before final connector placement.
Bellwether 70012 Connector Notes
User supplied Bellwether files:
Extracted product-spec values from OCR; verify against original PDFs before creating final footprint:
  • Series: Bellwether 70012 / 70019 power and signal edge-card connector.
  • Pitch: 2.54 mm power and 1.27 mm signal centerlines.
  • Power contact current rating: 9 A per pin.
  • Signal contact current rating: 1.5 A per pin.
  • Power-power voltage rating: 250 VAC RMS / DC.
  • Signal-signal voltage rating: 30 VDC.
  • Power-signal voltage rating: 400 VAC RMS / DC.
  • Operating / storage temperature: -40°C to +105°C.
  • Power contact resistance: 0.6 mΩ max, tested at 34 A DC per quad contact.
  • Durability: 200 mating cycles.
  • Maximum mating force: 81.6 N.
  • Minimum unmating force: 14.4 N.
Connector Action Items
  • Use the attached 2D/package drawings to create a custom Flux component/footprint for the exact Bellwether 70012-1111 variant.
  • Verify exact pin count, keying, orientation, mounting-hole geometry, and PCB cutout/keepout from the drawing manually; OCR did not extract the footprint tables reliably.
  • Mechanically align the connector to the Dell PSU shell/guide features, not just the PCB pads.
  • For the daughterboard card edge, define final finger pitch, plating/finish, insertion depth, bevel angle, soldermask pullback, keepout, and retention/guide features from the mating ED32BGFBK connector documentation before fabrication.
Status LED
  • Add at least one front/rear visible status LED for Rev A.
  • Recommended minimum: system status RGB LED or separate POWER / FAULT LED.
  • If the enclosure exposes many slots, consider one per-slot fault/enable LED later, but keep Rev A simple unless panel space allows.
  • Status

  • Chassis Envelope

  • PSU Placement

  • Daughterboard Orientation

  • PCB Stackup Direction

  • Slot Count and Pitch Implications

  • Airflow Requirements

  • Bellwether 70012 Connector Notes

  • Connector Action Items

  • Status LED

Rackmount 12V Distribution PSU

Rackmount 12V Distribution PSU thumbnail
2U 10-inch rackmount 12V distribution power supply for Dell server PSUs, with 12 managed boost-module slots, per-slot current monitoring, temperature logging, MCU supervision, and optional Ethernet metrics.

Properties

Ethernet

Power Electronics

JLCPCB assembly target

High Current

12

V

Pricing & Availability

Distributor

Qty 1

Arrow

$5.24–$8.55

Digi-Key

$4.74–$5.13

HQonline

$1.68–$1.79

LCSC

$16.68–$17.00

Mouser

$11.43–$11.83

TME

$10.48–$10.77

Verical

$4.88–$14.99

Controls