I can’t execute design changes right now because AI actions require available ACUs, and this account currently has none available.
What’s accomplished so far:
No schematic or PCB changes have been made.
The project is still empty: 0 components, 0 nets.
Your requested design intent is clear: a digital pet PCB using:
XIAO ESP32-S3 development board
LSM6DSL accelerometer / IMU
NT3H2111W0FHKH NFC tag
DRV2605L haptic motor driver
PCT2075D temperature sensor
7-pin SPI TFT round LCD connector
What remains to be done once ACUs are available:
Create the project specification.
Add and wire the components.
Define I2C/SPI/GPIO pin mapping for the XIAO ESP32-S3.
Add pull-ups, decoupling capacitors, NFC antenna connections, haptic motor connector, and LCD connector.
Run ERC/design review.
Create PCB placement and routing.
Prepare bring-up notes and firmware pin map.
A key clarification needed before schematic capture: please provide the 7-pin LCD connector pinout/order for your round SPI TFT module, since these modules vary by vendor.
Wirelessly connects nets on schematic. Used to organize schematics and separate functional blocks. To wirelessly connect net portals, give them same designator. #portal
General Purpose Thick Film Standard Power
and High-Power Chip Resistor
47 kOhms ±5% 0.125W, 1/8W Chip Resistor 0805 (2012 Metric) Automotive AEC-Q200 Thick Film
Features:
- RMCF – standard power ratings
- RMCP – high power ratings
- Nickel barrier terminations standard
- Power derating from 100% at 70ºC to zero at +155ºC
- RoHS compliant, REACH compliant, and halogen free
- AEC-Q200 compliant