Fathom-X WiFi Bridge Design
Thought for 7 sec
To get it manufactured now, use the exported files like this:
1. Order the bare PCB
Use the Gerber ZIP:
Upload that ZIP to a PCB manufacturer such as JLCPCB, PCBWay, Seeed Fusion, or Elecrow.
Recommended PCB settings:
- Layers: 4-layer
- Board size: 30 mm × 120 mm
- Thickness: 1.6 mm unless you have enclosure constraints
- Copper: 1 oz
- Surface finish: ENIG preferred, HASL acceptable
- Solder mask: any color
- Impedance control: recommended if your fab supports it, because Ethernet/RMII pairs are present
For JLCPCB-style assembly, use:
BOM — JLCPCB CSV
Comment Designator Footprint JLCPCB Part # LCSC Part # GRM31CR72A475KA73L C1 GRM21BR61E226ME44L C2 GRM188R61C106MA73D C10, C3 C19702 GRM188R71C104KA01D C11, C15, C17, C18, C19, C20, C6, C8 C14663 GRM1885C1H331JA01D C12 GRM188R71H104KA93D C13 C14663 C3216X7R2J103K160AA C14 GRM188R61A475KE15D C16, C5 C19666 GRM188R61A105KA61D C21, C4, C7 C15849 SP4021-01FTG-C D2 SOD-323_L1.8-W1.3-LS2.5-RD C720051 XY301V-A-5.0-2P J1 DG250-3.5-02P-11-00A(H) J2 TYPE-C-2.0-16PIN-SMT-3-OR J3 USB-SMD_TYPE-C16PIN-1 C2987387 PDQ30-Q48-S12-D PS1 R-78C5.0-1.0 PS2 R-78E3.3-1.0 PS4 RC0603FR-0710KL R1, R10, R11, R2, R3, R4, R9 C25804 RC0603FR-075K1L R5, R6 C23186 RC1206FR-0710RL R7 RC0603FR-0712K1L R8 C22835 RC0603FR-071K5L R12 C22843 UT11403S T1 XC6220B331MR U1 SOT-23-5 ESP32-WROOM-32E U2 LX200V20 U4 LAN8720A-CP U6 CH340C U7 Pick-and-place — JLCPCB CSV
Designator Layer Rotation Mid X Mid Y C1 Top 90 -3.2mm -14.5mm C2 Top 0 -10.5mm -45.2mm C3 Top 0 -3.2mm 2.8mm C4 Top 90 3.2mm 4.4mm C5 Top 90 3.2mm 7.6mm C6 Top 0 -12.5mm 57.2mm C7 Top 0 -12.5mm 55.4mm C8 Top 0 -12.5mm 46.9mm C10 Top 0 4mm 31mm C11 Top 0 4mm 18.6mm C12 Top 0 -12.4mm 23.8mm C13 Top 0 -12.4mm 28mm C14 Top 0 -12.4mm 22mm C15 Top 0 12.775mm 17mm C16 Top 0 12.775mm 18.8mm C17 Top 0 4mm 20.8mm C18 Top 0 4mm 22.4mm C19 Top 0 4mm 27.2mm C20 Top 0 4mm 28.8mm C21 Top 0 12.775mm 20.6mm D2 Top 0 -12.33mm 20mm J1 Top 0 -6.5mm -53.4999mm J2 Top 180 -8.25mm 11.5mm J3 Top 270 -9.2mm 34.3mm PS1 Top 0 0mm -31mm PS2 Top 0 -5.96mm -5mm PS4 Top 0 6.84mm -5mm R1 Top 0 -12.5mm 53.6mm R2 Top 0 -12.5mm 51.8mm R3 Top 0 12.5mm 49mm R4 Top 0 12.5mm 51mm R5 Top 0 -1.2mm 35.2mm R6 Top 0 -1.2mm 33.4mm R7 Top 0 -12.4mm 26.2mm R8 Top 0 12.775mm 24.3mm R9 Top 0 -12.5mm 48.55mm R10 Top 0 -12.5mm 50.2mm R11 Top 0 12.775mm 26.1mm R12 Top 0 12.775mm 27.9mm T1 Top 0 -7mm 24.9mm U1 Top 0 0mm 6mm U2 Top 0 0mm 49.635mm U4 Top 0 0mm 22mm U6 Top 0 8.35mm 22mm U7 Top 0 10mm 34.2mm
If your manufacturer is not JLCPCB, use the Flux/standard BOM and OpenPNP pick-and-place files instead.
3. Before paying, check these previews
In the fab ordering page:
- Open the Gerber viewer.
- Confirm the board outline is 30 mm × 120 mm.
- Confirm the USB-C connector, tether terminal, and power terminal are at accessible edges.
- Confirm there are no obvious missing copper layers.
- For assembly, check pick-and-place rotations for:
- ESP32-WROOM-32E
- LAN8720A
- CH340C
- LX200V20 module/socket
- UT11403S transformer
- USB-C connector
- polarized/special parts if any
Some parts may not be available through automated JLCPCB assembly, especially:
- LX200V20
- UT11403S
- Possibly the 48V DC/DC converter module
- Some high-voltage capacitors
Best practical approach:
- Let the assembler place common SMD parts: resistors, capacitors, ESP32, LAN8720A, CH340C, USB-C, etc.
- Hand-place or separately source specialty modules/parts: LX200V20, UT11403S, large DC/DC modules if unavailable.
Follow the bring-up plan before connecting the full 48V tether system:
- First power with current limit.
- Verify 12V, 5V, 3.3V, and LX200V20 3.3V rails.
- Program the ESP32 over USB-C.
- Verify Ethernet PHY detection.
- Then test tether/HomePlug link.
Do not connect the full tether power source first without current limiting.
is this a two layer or 4 layer board?
Thought for 11 sec
It is a 4-layer board.
Current layout setup:
- Board size: 30 mm × 120 mm
- Copper layers: 4
- Stackup: Standard 4 Layer custom
- Intended layer use:
- Top: components + signals
- Inner layer: ground reference plane
- Inner layer: power / routing
- Bottom: signals / routing
A 4-layer stackup is the right choice here because the board has Ethernet/RMII signals, USB, multiple power rails, and a narrow 30 mm form factor.
Export 4-layer files
Check stackup details
Fix package mismatches
Review impedance routing
Assembly guidance
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