JLCPCB Board Manufacturability and Cost
3:58
Evaluating assembly costs.
Checking package requirements.
Estimating assembly costs.
Checking components and manufacturability.
Accessing knowledge base.
Running design review.
Reviewing the bill of materials.
Calculating.
Analyzing the PCB layout.
Looking for "package information mechanical dimensions TFBGA 361 ball pitch dimensions" in stm32mp157c.pdf
Looking for "package information mechanical dimensions FBGA package ball pitch dimensions" in 4gb_ddr3l.pdf
Looking for "mechanical data package 361-TFBGA ball pitch" in stm32mp157c.pdf
Looking for "package outline dimensions 361 TFBGA" in stm32mp157c.pdf
Looking for "package outline dimensions FBGA 96 ball pitch" in 4gb_ddr3l.pdf
Looking for "package mechanical dimensions FBGA 96 8x14" in 4gb_ddr3l.pdf
Searching web for: "JLCPCB BGA assembly capability 0.5 mm pitch support"
Found 1 results.
Proposing a manufacturability review.
- Can JLCPCB build and assemble it? Potentially yes, but not yet in its current state. Your layout still has DRC errors and your BOM is missing most MPNs, so it isn’t ready for ordering.
- Total cost with assembly and parts: we can’t quote accurately until we know quantity, assembly options, board size/layers, and all parts’ MPNs. A partial parts subtotal for the major ICs/connectors already specified is about $26.31 per board (see below), excluding all passives and some items.
- Layout DRC errors: Airwires and an overlapping copper via are present. These must be fixed before fabrication.
- BOM completeness: 120+ components (most passives) have no manufacturer part number. Without MPNs JLC can’t source or assemble them, and we can’t price them.
- BGAs present: U1 (361‑TFBGA, 12x12 mm, 0.5 mm periphery / 0.65 mm center pitch per its datasheet) and U2 (96‑ball FBGA, 0.8 mm pitch per its datasheet) are on the design. JLCPCB publicly states they support BGA assembly at 0.5 mm pitch, but 0.5 mm typically requires strict BGA layout rules (often via‑in‑pad with filled/plugged vias) to be manufacturable. Your layout must follow their BGA guidelines.
- These are only the major items that already have MPNs and LCSC pricing visible. All passives, one inductor, Tag‑Connect, and the two DIP switches are not included.
Table
- Subtotal of items above: $26.31 per board (excludes 58× 0402 caps, 18× 0603 caps, 45× resistors, L1, two DIP switches, Tag‑Connect, and anything without LCSC pricing).
- Build quantity (pcs).
- Assembly options: single- or double‑sided placement; consigned vs JLC sourcing; any “extended” parts; stencil type.
- Board parameters: outline size, layer count, finish, mask color, copper weight.
- Confirm BGA rules: whether we can use via‑in‑pad with filled/plugged vias if needed for U1.
- Fix DRC: resolve all Airwires and the overlapping copper via.
- Assign MPNs for all passives to LCSC‑stocked parts (to keep assembly cost low).
- Validate BGA fan‑out to JLC’s 0.5 mm BGA guidelines (via‑in‑pad/plugged via strategy if required).
- Provide the quantity and assembly parameters above; then I’ll compile a full JLC quote pack and total cost.
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