Round Light Engine Design


Completed the review and schematic creation for Round Light Engine V1. I corrected the support circuitry, added and wired the Pico, MCP23017, OLED, six encoders, three trackball headers, pull-ups, decoupling, and bulk capacitance; validation now reports no open errors/warnings for the checks run.
Open items:
  • Trackball header spare pins remain intentionally unconnected until the exact breakout pinout is confirmed.
  • The available 1x08 header footprint is horizontal/angled; use a vertical footprint later if you need straight-up headers.
Project files created:
  • Project Specification — Round Light Engine V1
  • Design Review Notes — Initial Schematic Input
  • Firmware Starter — Round Light Engine V1
  • Board Bring-Up Plan — Round Light Engine V1
Suggested next steps:
  1. Define the board size/mechanical layout for the single-sided console.
  2. Place controls by user-facing ergonomics: OLED top, encoders in rows, trackballs grouped by Lift/Gamma/Gain.
  3. Run single-sided PCB placement and routing, allowing jumper/0Ω links where needed.
Round Light Engine V1 IS COLOR GRADING SOFTWEWRE DEVOLDER BY MY SELF I WANT CRETE CONSOLE CALL ROUND CONSOLE X HERE I UPLODED MY PROTOTYPE DETLSIAS ABOUNT MY HARDWERE REQUREMENT I NEED A COMPLTE SCHEMATIC WIRED CONNECTION PERFERCT AND ACURATE ALSO I NEED ONE SIDE PCB STUCHER TOOO DO IT FOR ME
I’ll treat this as the Round Console X hardware controller for your Round Light Engine color grading software: first I’ll update the project identity/docs, verify the schematic is still clean, then set up a one-sided PCB structure with placement/routing constraints.
I updated the project to Round Console X and changed the description to match your clarified goal: a hardware console for your self-developed Round Light Engine color grading software. I also re-ran schematic checks, and the schematic is currently clean with no open ERC/passive/footprint warnings from the checks run.
Open items:
  • I could not continue into one-sided PCB setup/placement/routing because your account currently has no available ACUs for AI execution.
  • PCB is still at the existing 160mm × 100mm, 4-layer setup; one-sided PCB structure has not yet been applied.
  • Ergonomic placement and routing are still pending.
Next steps when ACUs are available:
  1. Convert layout intent to a single-sided / 2-layer fabrication structure with bottom copper used as the main routing side and jumpers/0Ω links allowed.
  2. Arrange OLED, encoders, and trackball headers into a console-style layout.
  3. Route the PCB and verify no airwires or DRC issues remain.
Single-sided setup
Ergonomic placement
Run design checks
Document requirements

Design Review Notes — Initial Schematic Input
Review Summary
The provided wiring matrix is broadly usable for a Pico-based control console. The changes below are incorporated into the schematic so the design is more robust and easier to route as a single-sided PCB.
Corrections / Improvements Applied
  • I2C pull-ups changed from 10kΩ to 4.7kΩ on SDA and SCL.
  • MCP23017 RESET added with 10kΩ pull-up to 3V3.
  • MCP23017 A0/A1/A2 tied to GND for I2C address 0x20.
  • One 100nF decoupling capacitor added near MCP23017 VDD.
  • One 100nF local capacitor added at OLED VCC.
  • One 100nF capacitor added at each trackball header VDD.
  • One 10µF bulk capacitor added on the 3V3 rail.
  • 10kΩ pull-ups added on all three SPI CS nets.
  • Trackball header spare pins are intentionally left unconnected until the exact breakout pinout is confirmed.
Notes for Layout
  • Keep GP26/GP27/GP28 SPI traces short and grouped.
  • Place CS pull-ups near the Pico or between Pico and sensor headers.
  • Place decoupling capacitors physically close to the power pins/headers they support.
  • Use wider 3V3 and GND traces, around 0.75–1.0mm where possible.
  • Expect jumper wires or 0Ω links if true single-sided routing becomes congested.
  • Review Summary

  • Corrections / Improvements Applied

  • Notes for Layout