Treat Flux like your intern. Tell it what you'd like to build and it'll get to work. You can also ask it questions, brainstorm ideas, and teach it your preferences. Learn More
PCIe refclks, resets, SPI, UART, GPIO, and control pins from the PDF table
Net remapping performed
Table
Old placeholder intent
New ASM2464PDX pin
Net
VCC_105
VDD_GROUP
1V05
VCC_19
VCCL_GROUP
1V9
VCC_33
VCCH_GROUP, VCCA33
3V3_LOGIC
VSS
GND_GROUP, GNDA_GROUP
GND
U4_TXP0
UTXP0
USB4_TXP0
U4_TXN0
UTXN0
USB4_TXN0
U4_RXP0
URXP0
USB4_RXP0
U4_RXN0
URXN0
USB4_RXN0
PTXP0
PTXP0
PCIE_TXP0_TO_M2
PTXN0
PTXN0
PCIE_TXN0_TO_M2
PRXP0
PRXP0
PCIE_RXP0_FROM_M2
PRXN0
PRXN0
PCIE_RXN0_FROM_M2
XI_25M
XI
XI_25M
XO_25M
XO
XO_25M
Placement
U1 was placed on the PCB between the USB-C connector (J1) and M.2 connector (J2). Nearby crystal/load caps and USB4 ESD parts were adjusted to clear the larger 10×10 mm FCCSP package.
Important limitations
The Flux component currently groups the many repeated power, ground, and NC balls into grouped schematic terminals:
VDD_GROUP
VCCL_GROUP
VCCH_GROUP
GND_GROUP
GNDA_GROUP
NC_GROUP
This is acceptable for schematic intent capture, but it is not yet a production-grade 273-ball symbol/footprint representation. Before final PCB routing/manufacturing, these grouped pins should be expanded to individual balls and verified against the official datasheet or vendor CAD library.
Current ERC warnings are expected because many newly exposed ASM2464PDX pins are not yet wired: USB4 lane 1, PCIe lanes 1–3, refclks, CC/SBU/VBUS, SPI, reset, GPIO straps, and sideband signals need intentional wiring or no-connect treatment.
Next recommended work
Wire CC1/CC2/SBU/VBUS from U1 to the Type-C/PD/protection block as appropriate.
Wire SPI flash pins (SPI_CS#, SPI_DO, SPI_DI, SPI_CLK) to U8.
Wire reset/control pins (RST#, HDDPC, PERST0#, GPIO8/CLKREQ#, etc.) to the intended supervisor/M.2 control nets.
Decide whether this design uses only PCIe x4 to one NVMe device or multiple PCIe ports, then wire all relevant PCIe lanes/refclks.
Expand grouped power/ground pins into individual balls before final PCB routing.
Re-run ERC, then place/reroute with high-speed differential constraints.