Check 1 — DC input opening: PASS (with dimensional caveat)
The source subtracts one rectangular box through the +X wall, producing a closed rectangular opening.
Opening center: Y = -17.8063 mm, matching the actual J4 footprint/body midpoint from the live PCB layout (Y = -17.8063 mm).
Opening width along Y: 16.04 mm. The TE Connectivity 282837-3 three-position connector dimension A is 15.24 mm, so clearance is 0.40 mm per side.
Opening vertical span: Z = -0.40 to 10.40 mm (10.80 mm high).
Lid seam: Z = 18.50 mm. Solid wall bridge above the opening: 18.50 - 10.40 = 8.10 mm. Therefore it does not reach the wall top or lid seam.
The opening width follows the connector/interface span rather than the larger PCB-area envelope; the live layout shows the J4 body spans Y approximately -25.4263 to -10.1863 mm, also 15.24 mm, so only 0.40 mm per side is exposed laterally.
Caveat: the manufacturer drawing available to the datasheet extractor does not specify a panel cutout, and its body-height/wire-entry callouts were not machine-readable. Thus the 10.0 mm nominal interface height / 10.8 mm opening height cannot be independently tied to a cited manufacturer panel-cutout dimension. It is nevertheless a closed, centered opening with a substantial bridge and tight lateral sizing.
Required correction: none for centering, seam integrity, or lateral sizing. Before release, physically test the 10.8 mm vertical opening with the intended wire gauge/ferrule and screwdriver access; reduce its height if the full 10.8 mm is not needed.
Exactly three supports are authored at X = -27.6024, 0.0000, +27.5676 mm, distributed across the relay-side perimeter.
Each support is 8.0 mm wide and nominally contacts the PCB only over the perimeter band Y = 48.5 to 49.5 mm (1.0 mm inward from the board edge).
Support top is Z = -1.50 mm, equal to the live PCB underside from the 1.50 mm stackup, so nominal contact is zero-gap/zero-preload.
Each support is built as a closed X-extruded solid joined to the inner wall and floor, with a 2.0 mm drop gusset. The geometry is fused and printable rather than floating.
The supports do not add retaining hooks; vertical PCB insertion/removal remains geometrically possible.
Relay wall windows span Z = -0.40 to 10.40 mm. Supports terminate at Z = -1.50 mm, leaving 1.10 mm vertical separation below the window bottoms, so they do not block the relay openings or terminal access.
Blocking failure
The live-layout inspection available in this review could not expose complete bottom-copper, pad, via, solder-joint, keepout, and component geometry for all three exact contact rectangles. Therefore the required claim that contact occurs only on a safe bare board-edge underside strip—not copper, pads, vias, solder joints, terminals, or components—cannot be independently confirmed. The source comment claiming the nearest pad ends at Y = 41.338 mm was not accepted as evidence because this review is independent.
Required correction: either:
provide/derive an authoritative bottom-layer clearance/keepout inspection proving all three rectangles are copper- and hardware-free, or
move/resize the supports to verified mechanical keepout zones and add a PCB bottom-layer mechanical keepout under each support.
Until that is done, Check 2 remains failed even though the authored support count, height, fusion, printability, removal path, and relay-opening clearance are acceptable.
Final result
Table
Check
Result
Required correction
DC input opening
PASS
No deterministic geometry correction; test the uncited 10.8 mm vertical access height and reduce if unnecessary.
Relay-bank edge supports
FAIL
Independently prove or enforce copper/component keepouts beneath all three 8.0 × 1.0 mm contact strips.
Check 1 — DC input opening: PASS (with dimensional caveat)