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    Assets

    28Pins_EP-Symbol.svg

    28Pins_EP-Symbol.svg

    28Pins_EP-SymbolDefault
    QFN50P500X500X100-29N-removebg-preview.png

    QFN50P500X500X100-29N-removebg-preview.png

    QFN50P500X500X100-29N-removebg-previewThumbnail
    step

    QFN50P500X500X100-29N-3D.step

    QFN50P500X500X100-29N-3D3D Model
    kicad_mod

    QFN50P500X500X100-29N.kicad_mod

    QFN50P500X500X100-29NFootprint

    TCA9555RGER

    TCA9555RGER thumbnail
    The TCA9555 is a 16-bit I/O expander, designed by Texas Instruments, that is compatible with the I2C and SMBus communication protocols. It operates between 1.65 and 5.5 volts and can be used to extend the functionality of most microcontroller families via the I2C interface. The system master can enable the I/O pins as either inputs or outputs and can invert the polarity of the Input Port register. This part is widely used in applications like servers, personal computers, automation equipment, routers, and other electronics with limited GPIO availability.

    Properties

    Integrated Circuit

    Texas Instruments

    TCA9555RGER

    storage.googleapis.com/copilot-datasheets/pdf-upload-eaa9805a5d5e8cab00b4bbae9e17beeefbd3a210fe3068aab9fe401199a2a7d0/a76389f87f99454e02256826a5ed2e703656d48adf402997459f2fd94389c794.pdf?GoogleAccessId=graviton-mvp%40appspot.gserviceaccount.com&Expires=4862057374&Signature=tnVV%2FZpcJ1SYqXU1xjvrz%2F7JAUodudw2iZjLK9V4rpbrFNKw31Ial1xxjLQA9d8%2BTGIuLUi%2BSb%2FHn06rIJqT8%2BHl5EAId6l2d49%2B%2Bx2gnJUFBz%2B6kzljoYOwUnS9FCoBgt9uSWXRvjtdn4bhBuHjEFISfSUdscNMPFh6m7gRnuV%2FqWv6Ym2jhbl0BwuXgGL%2BG3fzmSRwlhSpfqc7moiWHG2VTXmrBS5ik2i8WBW%2B8D43GMWzjo6fNOBDvSsMTmpYCv8zUWE%2FLCjaz8wBh6iUNSD%2FTQLBJ%2Fk708eAbkzttvGYQGcFQUG0Hsi%2BOeURQdB3Tg7QZMhK0Av8TKlpRpf4vQ%3D%3D

    U

    creativecommons.org/licenses/by/4.0/

    RoHS,Green

    QFN50P500X500X100-29N

    Component, Material, %/wt Bond Wire, Copper, 99.9884 Bond Wire, Proprietary Materials, 0.008189 Bond Wire, Iron, 0.000682 Bond Wire, Silver, 0.002047 Die Attach Adhesive, Silver, 81.099945 Die Attach Adhesive, Epoxy, 18.900057 Lead Frame, Copper, 99.25 Lead Frame, Chromium, 0.259999 Lead Frame, Tin, 0.250003 Lead Frame, Zinc, 0.240001 Lead Frame Plating, Nickel, 95.12008 Lead Frame Plating, Gold, 0.780019 Lead Frame Plating, Palladium, 4.099904 Mold Compound, Fused Silica, 90.5 Mold Compound, Carbon Black, 0.499998 Mold Compound, Epoxy, 8.999999 Semiconductor Device, Doped Silicon, 100

    Pricing & Availability

    Distributor

    Qty 1

    Controls