No — those parts are not supposed to have unconnected ends.
They should be connected like this:
L1
One side: BUCK_SW
Other side: 3V3 / buck output
C7, C8, C11
One side: 3V3
Other side: GND
R3
One side: 3V3
Other side: ESP_EN
R4
One side: 3V3
Other side: ESP_BOOT
R6
One side: 3V3
Other side: TANK_FLOAT_NO
R7
One side: 3V3
Other side: AUX_INPUT
R12
One side: 3V3
Other side: I2C_SCL
R13
One side: 3V3
Other side: FLOW_PULSE
Right now, the schematic data shows only one side connected for most of those parts. That means they likely need to be fixed before routing. I can reconnect those missing ends to the correct nets in one pass.
The listed pull-up resistors now go between 3V3 and their signal nets
There are still other schematic warnings unrelated to that exact list, including U1:3V3, OLED1:3V3, U2:FB, and R5:P1, so the schematic still needs another cleanup pass before routing/manufacturing.
The already-MPN parts are: USB-C receptacle, TVS diodes, Schottky diode, AP63203 buck regulator, and ESP32-S3-WROOM module.
Cost-priority recommendations
1. Keep the universal PCB approach for now
One universal WiFi node PCB is likely lower total development cost than separate Well/Tank PCB variants, because it avoids maintaining multiple layouts and BOMs. The cost tradeoff is a few extra unpopulated/unused connector and button functions per node.
Recommended strategy: build one universal board and configure each node in firmware as Well 1, Well 2, or Tank.
2. Standardize passive values and packages
Most resistors are already 0603, which is a good cost/assembly compromise. Recommended MPN family for cost/availability is Yageo RC0603FR-07 series or equivalent 1% thick-film 0603 resistors.
Resistor groups:
Table
Value
Designators
Function
4.7kΩ
R5, R12
I2C pull-ups
10kΩ
R3, R4, R6, R7, R13
EN/GPIO/input pull-ups
5.1kΩ
R10, R11
USB-C CC sink pull-downs
100Ω
R8
Contactor-driver input series resistor
100kΩ
R9
Contactor-driver pull-down
3. Review capacitor packages before locking MPNs
Current capacitor values:
Table
Value / Rating
Designators
Current package
Note
100nF / 10V
C11, C12
0603
Good as generic decoupling/reset caps
100nF / 25V
C10
0603
Good for bootstrap cap
10µF / 50V
C6
0603
May be difficult/expensive in true 0603 with useful capacitance; consider 0805/1206
22µF / 10V
C7, C8
0603
Likely suffers DC-bias derating; consider 0805/1206 for better real capacitance
Cost/quality recommendation: keep 100nF caps in 0603, but move the power-supply bulk capacitors to 0805 or 1206 before selecting final MPNs.
4. Inductor package needs correction before MPN lock
L1 is currently marked 3.9µH, >=2.7A saturation current, but has an SMD_0603 package. A 3.9µH / ~3A buck inductor should not be in an 0603 chip package.
Recommended next action: change L1 to an appropriate shielded power-inductor package such as a 4x4 mm class footprint, then select a real MPN with saturation current above the AP63203 peak-current requirement.
5. Terminal blocks and switches
The 5.00 mm terminal blocks are appropriate for field wiring and are worth keeping through-hole for reliability. The 6 mm tactile switches are inexpensive and beginner-friendly to inspect/rework.
Final MPNs should be chosen from common stocked parts once the assembly vendor preference is known. If using JLCPCB assembly, prefer LCSC basic/common parts where possible.
Recommended next actions
Correct L1 package/MPN first because it affects regulator reliability.
Move C6/C7/C8 to physically realistic packages if needed.
Assign grouped resistor MPNs by value.
Assign terminal block and switch MPNs.
Re-run manufacturing review to confirm missing-MPN count decreases.
Investigate the 5 remaining copper-overlap DRC errors before routing.
Current cost/manufacturing status
Cost-priority recommendations
1. Keep the universal PCB approach for now
2. Standardize passive values and packages
3. Review capacitor packages before locking MPNs
4. Inductor package needs correction before MPN lock