# HTSSOP-14-1EP_4.4x5mm_P0.65mm_EP3.4x5mm_Mask3x3.1mm ## Description HTSSOP-14-1EP is a small surface-mount package commonly used for electronic components. It has a body size of approximately 4.4 mm x 5 mm (L x W) with 14 pins. The lead pitch between the pins is typically 0.65 mm. The package features an exposed pad (EP) with a size of 3.4 mm x 5 mm. The solder mask opening on the EP is approximately 3 mm x 3.1 mm. #part #template ## Project Details - **Owner:** jannys - **Created:** 8/4/2024 - **Last Updated:** 8/4/2024 - **Visibility:** Public - **License:** https://creativecommons.org/licenses/by/4.0/ *The full schematic, PCB layout, bill of materials, and interactive design are available at [https://www.flux.ai/jannys/htssop-14-1ep4p4x5mmp0p65mmep3p4x5mmmask3x3p1mm](https://www.flux.ai/jannys/htssop-14-1ep4p4x5mmp0p65mmep3p4x5mmmask3x3p1mm).* --- *Generated from [https://www.flux.ai/jannys/htssop-14-1ep4p4x5mmp0p65mmep3p4x5mmmask3x3p1mm](https://www.flux.ai/jannys/htssop-14-1ep4p4x5mmp0p65mmep3p4x5mmmask3x3p1mm)*