The old composite U1 and its entire internal regulator layout have been replaced atomically by a four-pad socket-only component. All four logical connections and schematic designator U1 are preserved. The requested electrical/footprint gates report 0 airwires, 0 overlapping-copper errors, 0 missing footprints, and 0 invalid layers. The overall manufacturing release is NOT complete: actual module fit is provisional, one C3/module projected-body warning remains, one protected redundant-copper warning remains, and the existing U2 antenna keepout check still reports an error. The antenna keepout was not removed or weakened.
Identified four external terminals and 25 copper-overlap errors entirely in old module hierarchy.
2. Research/derive nominal geometry
Completed, assumption path
30 × 17 mm vendor nominal; 26.886 × 8.400 mm pitch derived from old external pad geometry, explicitly provisional. Exact HW-183B fit not verified.
3. Create clean socket carrier footprint
Completed
Four 2.2 mm PTH pads, 1.02 mm drills; body silk, four pin labels, 30.5 × 17.5 mm package/courtyard metadata. No internal circuit or traces.
4. Replace U1 and preserve nets
Completed
Atomic replacement verified four nets; independent schematic and baked-pad inspection confirms mapping below.
5. Place near original region, with physical clearance
Failed final clearance acceptance
U1 now (-4,-10) mm, 0°, only 3 mm down from original. XIAO body conflict resolved; C3 projects under raised module edge (3.34 mm² reported overlap). Actual vertical assembly clearance must be verified or a separate C3 relocation authorized.
6. Remove stale traces and route four terminals
Failed exact cleanup; connectivity completed
Protected old VIN+ stub deletion was rejected. Reused it with a 3 mm extension to the new VIN+ pad. Zero airwires, but checker still reports one redundant-copper group containing two protected original segments and the new extension. No unrelated traces deleted.
7. Full checks and clean manufacturing gate
Failed overall release; four explicit gates pass
Zero requested gate violations, but preserved U2 keepout error, C3 projection warning, redundant-copper warning, and provisional mating geometry prevent a clean release claim.
No numbered scope item was left unattempted. Overall design completion must not be inferred from the four passing electrical gates.
Aitendo HW-183B gives 31.2 × 17.3 mm. Common other MT3608 modules are approximately 36 × 17 mm. Larger variants are not guaranteed to fit. HW-183B is not a controlled mechanical interface standard.
Terminal pitch is assumed 26.886 mm longitudinal × 8.400 mm transverse, derived from old U1's external terminal centers, NOT an authoritative HW-183B mechanical drawing. The user explicitly allowed a documented nominal assumption. Measure the actual four hole centers, body, and polarity before fabrication.
An inspected open-source HW-045 footprint, commit 6eec78396005, uses different 37 × 17 mm body geometry and was not used.
Four separate Sullins PPTC011LFBN-RC female sockets. Web extraction of the Sullins female-header drawing gives 3 A/contact, 0.75 × 0.40 mm lead, 1.02 mm recommended PCB hole, 8.50 mm above-board housing height, 2.54 mm housing width. Use matching module male posts; do not mistake the 8.4 mm transverse spacing for a standard multiway 2.54 mm header pitch.
Exact implemented footprint
Top view; X right / Y up; origin at module center.
Table
Pin
Function
Local center mm
Board center mm
Preserved net
1
VIN+
-13.443, +4.200
-17.443, -5.800
PROTECTED_BAT_FUSED
2
VIN-
-13.443, -4.200
-17.443, -14.200
GND
3
VOUT+
+13.443, +4.200
+9.443, -5.800
BOOST_5V
4
VOUT-
+13.443, -4.200
+9.443, -14.200
GND
Four plated through-holes 1.02 mm, copper pads 2.20 mm; pin 1 square, other pads round. Nominal annular ring 0.59 mm. Baked pad inspection confirms STD holes and annular layers Top/Bottom.
30 × 17 mm body silkscreen, 0.15 mm stroke. Baked 2D body bound is 30.3 × 17.3 mm including drawing extents. 30.5 × 17.5 mm package/courtyard metadata. No copper keepout under the module that would obstruct connections.
Four functional silk labels and a unique U1 reference below the module at board (-4,-20) mm. No old internal U1/R1/R2/L1/C1/C2/D1 components remain in the carrier PCB hierarchy; board-level inventory is again 12 components.
Published reusable custom part: part UID 6f4488dd-9c03-4b94-91f2-8510feceb2ae, placed version f1d7f8ff-780c-42aa-8a37-d5e34a7a7560.
Mechanical clearance and serviceability
Only U1 was moved: (-4,-7) → (-4,-10) mm, 0° Top. All unrelated component placements, 70 × 45 mm rounded board outline, existing two-layer 35 µm copper stackup, and XIAO antenna keepout are unchanged. Module top remains open for removal and screwdriver adjustment.
C3's 2D body overlaps the elevated module's lower-left edge; socket pads do not overlap C3 copper. The selected socket body is nominally 8.50 mm tall, but actual male-header seating, underside solder protrusions and C3 assembled height have not been dimensionally accepted. Treat this as a real assembly verification hold, not a suppressed warning. A small C3 relocation would require permission because unrelated placement was explicitly to be preserved.
Routing changes
Removed all internal regulator pads/traces/nets by replacing the composite component, not by deleting unrelated board copper.
Applied input-net 0.60 mm and output-net 0.40 mm width rules for documented currents 1.32 A input and 0.635 A output on 35 µm external copper. Existing inherited-width traces on these two relevant nets also widened; route centerlines were retained. Existing protected VIN+ segments remain 0.80 mm.
Added one exact 0.60 mm wide, 3.00 mm long Top trace, from (-17.4427,-2.8) to (-17.4427,-5.8) mm, joining the retained protected VIN+ stub to U1:VIN+.
U1:VOUT+ contacts the retained BOOST_5V diagonal copper, now 0.40 mm wide. Both ground socket pads are connected through the existing GND fill; its net identity and all-layer configuration are preserved. No new vias required.
Attempted deletion of stale trace UIDs 79a3660d-e095-4047-a2e7-1a9d913bdeb1 and a4702467-a954-47e9-a0d8-d677d85add92 was rejected as protected generated copper. They were not forcibly unlocked. Checker still flags them and extension 8f669b46-7865-4b37-98a7-538ca56f38fa as one redundant group. Needs protected-copper/tool review, not blanket rerouting.
Verification evidence
Read-only schematic inspection confirms VIN+=PROTECTED_BAT_FUSED, VIN-=GND, VOUT+=BOOST_5V, VOUT-=GND; J3:Pin_4 remains intentional NC. Baked pad effective net IDs match the corresponding board-level nets, with no old hierarchical net prefixes. Final targeted check timestamp: 2026-09-19T22:41:42.776Z.
Routing preflight returned BOARD_DEFINITION_GENERIC without specific board-format diagnostics. Outline and stackup inspections and targeted validation did not identify a corresponding invalid-layer/stackup error; no speculative board or keepout rewrite was made. No autorouter job was run; only the exact local trace above was added.
Release blockers / next decision
Measure actual HW-183B module: approve or correct 26.886 × 8.400 mm socket pitch, 30 × 17 mm body and polarity; verify socket mating stackup.
Accept measured C3 vertical clearance, or authorize moving C3 and its local traces.
Investigate protected redundant VIN+ copper and the generic preflight diagnostic.
Independently resolve/justify the existing XIAO keepout finding without removing antenna protection.
Adjust the removable module to 5.0 V before attaching loads; preserve USB reverse-current isolation.