Smart Chair Hardware Design Discussion

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Ergonix Smart Chair V1 — Hardware Design Description
  1. Overview
  • Product: Ergonix Smart Chair V1 – smart seat module for occupancy, posture, and pressure distribution.
  • Board: 2-layer target, 80 mm × 60 mm, USB‑C powered (5 V only), 3.3 V logic.
  • Architecture: ESP32‑C3 module + I2C IMU + 4× FSR analog inputs + USB‑C power and ESD + JST‑PH harness connectors + LEDs, reset, and programming pads.
  • Project stage: Pre‑prototype to Pilot (50–100 units); sourcing through LCSC for JLCPCB assembly.
  1. MVP functions
  • Occupancy detection: FSR-based presence and basic thresholding.
  • Sitting duration tracking: Periodic BLE updates to the app.
  • Basic pressure mapping: 4 zones (front-left, front-right, back-left, back-right).
  • Posture/tilt detection: IMU tilt channels (pitch/roll/yaw as needed).
  • BLE connectivity: BLE link to the mobile app at 1 Hz for sensor data.
  1. Major hardware blocks
  • MCU module: U1 ESP32‑C3‑WROOM‑02‑N4 (primary), fallback U2 ESP32‑C3‑WROOM‑02U‑N4 for external antenna option.
  • IMU: U3 MPU‑6050 over I2C.
  • Power input and protection:
    • USB‑C receptacle: J1.
    • Data‑line ESD: D1 (protects D+/D− at the connector; data not used in V1).
    • VBUS TVS: D4 clamps input surges.
    • CC sink resistors: R19 (CC1→GND), R20 (CC2→GND).
    • 3.3 V LDO: U4 NCP176BMX330TCG with local decoupling C1C4.
  • Sensor interfaces:
    • FSR harness: J2 JST‑PH 6‑pin (4× FSR + VCC + GND).
    • I2C/power harness: J3 JST‑PH 4‑pin (SDA, SCL, VCC, GND).
  • User interface and debug:
  • Grounds and return: GND single reference plane with short ESD return paths near the USB‑C connector.
  1. Power and USB‑C (power‑only)
  • USB‑C sink behavior: Separate CC lines with Rd resistors:
  • ESD/Surge: D1 on D+/D−; D4 on VBUS.
  • Regulation: U4 generates 3.3 V; decouple with C1C4 close to IN/OUT and add local 100 nF near U1 and U3.
  • Native USB note: For V1, USB data is not connected to ESP32‑C3; programming uses UART test pads.
  1. I2C bus and peripherals
  • Signals:
    • SCL: U1 IO4 on net “SCL”; pulled up via R22 to 3V3; available on J3 pin 1; to U3:SCL.
    • SDA: U1 IO5 on net “SDA”; pulled up via R23 to 3V3; available on J3 pin 2; to U3:SDA.
  • Pull‑ups: 4.7 kΩ typical, placed near U1. Keep total bus capacitance within spec; the 30–50 cm harness is accounted for.
  1. FSR analog front‑end (4 channels)
  • Harness: J2 carries 4 FSR sense lines plus power and ground.
  • Per‑channel network (example, same pattern for all four):
    • Divider and sense/filter:
  • Notes:
    • Series/input protection and RC filtering mitigate noise from long harness runs.
    • ADC sampling at 1 Hz target; firmware to average a few samples for noise reduction.
    • Calibration: per‑user software calibration; optional BOM‑tunable resistor footprints for range adjustments.
  1. User interface, reset, and programming
  1. Pin map summary (current)
  • ESP32‑C3 core pins (project nets):
    • I2C: IO4 = SCL, IO5 = SDA.
    • Programming: IO21 = PROG_TX (UART0 TX), IO20 = PROG_RX (UART0 RX), IO0 = BOOT, EN = reset.
    • LEDs: IO6, IO7 used for indicator control.
    • FSR: Four ADC channels wired to nets FSR1–FSR4 via the front‑ends listed above.
  • Boot/strapping caution: IO0 and EN are strap/reset; avoid heavy loads or fixed external states during reset.
  1. RF and antenna plan
  • Primary: U1 integrated PCB antenna at a board edge with a datasheet‑compliant keep‑out (no copper/vias/components in front of the antenna).
  • Metal frame proximity: Validate RSSI/packet loss with the board mounted; if detuning occurs, pivot to U2 (external antenna option) with a remote antenna position away from metal.
  1. Connectors, harnessing, and mechanical
  • USB‑C: J1 for power‑only.
  • FSR harness: J2 6‑pin JST‑PH; route entries away from RF edge; add silkscreen pin‑1 marking.
  • I2C/power harness: J3 4‑pin JST‑PH; exposes SDA/SCL/VCC/GND for IMU or expansion.
  • Mounting: Place holes to avoid antenna aperture and thick structural members; keep cable egress clear of antenna region.
  1. ESD, protection, and grounding
  • USB:
    • D+/D− protected by D1 at connector side (low‑capacitance ESD).
    • VBUS protected by D4; consider inline fuse on VBUS if needed.
  • CC detection:
  • Ground strategy:
    • Single reference plane; short ESD return to J1; keep analog returns (FSR filters) close to the plane and away from high‑dv/dt paths.
  1. BOM and sourcing snapshot
  • All mains are LCSC‑backed; designed for JLCPCB assembly at qty‑100. Key line items by designator:
  • Availability: Selected parts are common and stocked; alternates can be added if any supply constraints arise at order time.
  1. Firmware data and update cadence
  • BLE data at 1 Hz: 4 FSR channels + basic IMU tilt; occupancy and duration counters as needed.
  • Programming path: UART via TP_PROG_TX/TP_PROG_RX with TP_BOOT and TP_EN. Native USB not used in V1.
  1. Test and calibration plan (bring‑up)
  • Power/USB: Verify no shorts; measure 5 V at J1 and 3.3 V at U4:OUT.
  • Programming: Confirm boot into UART download with IO0 low at reset; flash a simple LED blink on D2/D3.
  • I2C/IMU: Scan bus; read WHO_AM_I from U3.
  • FSRs: Confirm analog ranges with known loads; perform software baseline calibration.
  • RF soak: 8+ hour BLE link stability in chair frame environment; log RSSI/packet loss.
  1. Layout and DFM notes
  • Antenna: Keep‑out per module datasheet; place U1 at a board edge with no copper/vias/components in front of the antenna.
  • Analog vs digital: Keep FSR entries and RC filters away from USB and switching currents; short, direct ground returns to the plane.
  • ESD: Place D1 and D4 close to J1 with minimal inductance in the return path.
  1. Open items and next steps
  • Finalize routing and silkscreen keep‑out markings for the antenna aperture.
  • Confirm I2C and FSR pin assignments at firmware integration time; avoid sharing IO6 between LED and FSR in the next spin if possible.
  • Export manufacturing package: Gerbers, Pick‑and‑Place, and BOM CSV with LCSC numbers; attach assembly notes for the harness orientation and antenna placement.
  1. Revision control
  • Current intent: V1 power‑only USB‑C, 4× FSR channels, integrated antenna primary, external antenna fallback via U2. Any changes to pin mapping or parts will be recorded in the project properties and reflected in the BOM.
This description reflects the current design state and is intended for internal alignment, firmware planning, purchasing (LCSC/JLCPCB), and mechanical integration.
shorter executive summary
firmware interface details
manufacturing notes expansion
test procedure checklist
mechanical constraints
59 days

Ready.


J1
TP_PROG_TX
C6
Capacitance
100nF
R10
Resistance
10k Ω
J2 Pin_6 - R9 P1
C5
Capacitance
100nF
J2 Pin_5 - R5 P1
PROG_BOOT
J2 Pin_3 - R7 P1
SW1 2 - GND GND
U4 OUT - U1 3V3
J2 Pin_4 - R6 P1
D2
R4
Resistance
10k ohms
C3
Capacitance
100nF
PROG_BOOT
R3
Resistance
10k Ω
C2
Capacitance
100nF
C4
Capacitance
100nF
D3
R7
Resistance
10k Ω
U1 IO9 - U3 SDA
TP_PROG_RX
U1 EN - SW1 1
R6
Resistance
10k Ω
J1 D2+ - D1 CATHODE_4
SW1 2 - GND GND
R11
Resistance
10k Ω
R9
Resistance
10k Ω
TP_EN
PROG_TX
R12
Resistance
10k Ω
R8
Resistance
10k Ω
D2
TP_PROG_TX
R2
Resistance
4.7k ohms
PROG_BOOT
U1 EN - SW1 1
R1
Resistance
4.7k ohms
PROG_RX
D3
J2 Pin_3 - R7 P1
J2 Pin_6 - R9 P1
SW1 2 - GND GND
U1 EN - SW1 1
C7
Capacitance
100nF
SW1 2 - GND GND
J2 Pin_5 - R5 P1
SW1 2 - GND GND
PROG_RX
C8
Capacitance
100nF
R5
Resistance
10k Ω
J2 Pin_5 - R5 P1
U1 IO8 - U3 SCL
C1
Capacitance
100nF
J2 Pin_4 - R6 P1
J2 Pin_6 - R9 P1
GND
SW1


  • Ground
    A common return path for electric current. Commonly known as ground.
  • Net Portal
    Wirelessly connects nets on schematic. Used to organize schematics and separate functional blocks. To wirelessly connect net portals, give them same designator. #portal
  • Power Net Portal
    Wirelessly connects power nets on schematic. Identical to the net portal, but with a power symbol. Used to organize schematics and separate functional blocks. To wirelessly connect power net portals, give them the same designator. #portal #power
  • Generic Resistor
    A generic fixed resistor for rapid developing circuit topology. Save precious design time by seamlessly add more information to this part (value, footprint, etc.) as it becomes available. Standard resistor values: 1.0Ω 10Ω 100Ω 1.0kΩ 10kΩ 100kΩ 1.0MΩ 1.1Ω 11Ω 110Ω 1.1kΩ 11kΩ 110kΩ 1.1MΩ 1.2Ω 12Ω 120Ω 1.2kΩ 12kΩ 120kΩ 1.2MΩ 1.3Ω 13Ω 130Ω 1.3kΩ 13kΩ 130kΩ 1.3MΩ 1.5Ω 15Ω 150Ω 1.5kΩ 15kΩ 150kΩ 1.5MΩ 1.6Ω 16Ω 160Ω 1.6kΩ 16kΩ 160kΩ 1.6MΩ 1.8Ω 18Ω 180Ω 1.8KΩ 18kΩ 180kΩ 1.8MΩ 2.0Ω 20Ω 200Ω 2.0kΩ 20kΩ 200kΩ 2.0MΩ 2.2Ω 22Ω 220Ω 2.2kΩ 22kΩ 220kΩ 2.2MΩ 2.4Ω 24Ω 240Ω 2.4kΩ 24kΩ 240kΩ 2.4MΩ 2.7Ω 27Ω 270Ω 2.7kΩ 27kΩ 270kΩ 2.7MΩ 3.0Ω 30Ω 300Ω 3.0KΩ 30KΩ 300KΩ 3.0MΩ 3.3Ω 33Ω 330Ω 3.3kΩ 33kΩ 330kΩ 3.3MΩ 3.6Ω 36Ω 360Ω 3.6kΩ 36kΩ 360kΩ 3.6MΩ 3.9Ω 39Ω 390Ω 3.9kΩ 39kΩ 390kΩ 3.9MΩ 4.3Ω 43Ω 430Ω 4.3kΩ 43KΩ 430KΩ 4.3MΩ 4.7Ω 47Ω 470Ω 4.7kΩ 47kΩ 470kΩ 4.7MΩ 5.1Ω 51Ω 510Ω 5.1kΩ 51kΩ 510kΩ 5.1MΩ 5.6Ω 56Ω 560Ω 5.6kΩ 56kΩ 560kΩ 5.6MΩ 6.2Ω 62Ω 620Ω 6.2kΩ 62KΩ 620KΩ 6.2MΩ 6.8Ω 68Ω 680Ω 6.8kΩ 68kΩ 680kΩ 6.8MΩ 7.5Ω 75Ω 750Ω 7.5kΩ 75kΩ 750kΩ 7.5MΩ 8.2Ω 82Ω 820Ω 8.2kΩ 82kΩ 820kΩ 8.2MΩ 9.1Ω 91Ω 910Ω 9.1kΩ 91kΩ 910kΩ 9.1MΩ #generics #CommonPartsLibrary
  • Generic Capacitor
    A generic fixed capacitor ideal for rapid circuit topology development. You can choose between polarized and non-polarized types, its symbol and the footprint will automatically adapt based on your selection. Supported options include standard SMD sizes for ceramic capacitors (e.g., 0402, 0603, 0805), SMD sizes for aluminum electrolytic capacitors, and through-hole footprints for polarized capacitors. Save precious design time by seamlessly add more information to this part (value, footprint, etc.) as it becomes available. Standard capacitor values: 1.0pF 10pF 100pF 1000pF 0.01uF 0.1uF 1.0uF 10uF 100uF 1000uF 10,000uF 1.1pF 11pF 110pF 1100pF 1.2pF 12pF 120pF 1200pF 1.3pF 13pF 130pF 1300pF 1.5pF 15pF 150pF 1500pF 0.015uF 0.15uF 1.5uF 15uF 150uF 1500uF 1.6pF 16pF 160pF 1600pF 1.8pF 18pF 180pF 1800pF 2.0pF 20pF 200pF 2000pF 2.2pF 22pF 20pF 2200pF 0.022uF 0.22uF 2.2uF 22uF 220uF 2200uF 2.4pF 24pF 240pF 2400pF 2.7pF 27pF 270pF 2700pF 3.0pF 30pF 300pF 3000pF 3.3pF 33pF 330pF 3300pF 0.033uF 0.33uF 3.3uF 33uF 330uF 3300uF 3.6pF 36pF 360pF 3600pF 3.9pF 39pF 390pF 3900pF 4.3pF 43pF 430pF 4300pF 4.7pF 47pF 470pF 4700pF 0.047uF 0.47uF 4.7uF 47uF 470uF 4700uF 5.1pF 51pF 510pF 5100pF 5.6pF 56pF 560pF 5600pF 6.2pF 62pF 620pF 6200pF 6.8pF 68pF 680pF 6800pF 0.068uF 0.68uF 6.8uF 68uF 680uF 6800uF 7.5pF 75pF 750pF 7500pF 8.2pF 82pF 820pF 8200pF 9.1pF 91pF 910pF 9100pF #generics #CommonPartsLibrary
  • Generic Inductor
    A generic fixed inductor for rapid developing circuit topology. *You can now change the footprint and 3D model at the top level anytime you want. This is the power of #generics
  • Terminal
    Terminal
    An electrical connector acting as reusable interface to a conductor and creating a point where external circuits can be connected.
  • RMCF0805JT47K0
    47 kOhms ±5% 0.125W, 1/8W Chip Resistor 0805 (2012 Metric) Automotive AEC-Q200 Thick Film #forLedBlink
  • 875105359001
    10uF Capacitor Aluminum Polymer 20% 16V SMD 5x5.3mm #forLedBlink #commonpartslibrary #capacitor #aluminumpolymer #radialcan
  • CTL1206FYW1T
    Yellow 595nm LED Indication - Discrete 1.7V 1206 (3216 Metric) #forLedBlink

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