PCB Placement Redesign


Execute the bottom/power PCB placement redesign now. Set board to 32 mm x 32 mm rounded-square with 8 mm corner radius and Standard 4 Layer stackup overrides: L1 Signal, L2 Ground Plane, L3 Power Plane, L4 Signal. Do not route. Preserve schematic components; do not delete. Ensure bottom-board components are included for PCB/BOM and top-board-only components are marked Exclude from PCB/BOM/Pick&Place. Place J7 exactly at X=+5.0 mm, Y=-17.6 mm, rotation 0°. Place U1/J2/RT1/U2/Q1/F1/J1/D1/PS1/L4/D2/D3/IC1/K1/J5/J6/D9/M1-M4/Q2-Q5/D4-D7 and local passives in the required functional groups. Run DRC/fit/routing feasibility checks, do not route, and update/create the project file 'Bottom Power PCB Placement Notes'. Keep final concise.
I’ll apply the bottom/power PCB placement redesign, keep the schematic intact, exclude top-board-only parts from fabrication outputs, then run placement/fit/DRC feasibility checks without routing.
I found the existing project files list and am applying the requested board geometry/stackup first, then I’ll use the project notes to classify bottom vs top-board-only parts.
The board setup operation is hitting a platform-side “missing project document context” error, so I’m checking whether layout/document state is accessible before retrying with a lower-level edit path.
Processing was stopped.
Here's a summary of what I was working on:
Troubleshooting tool issues
It looks like the tool is failing, which has me wondering if there's an active run. I might need to inspect the project metadata or check if the current project isn't in the right context. I see that the layout appears to be empty, which is odd. Perhaps there’s no layout document in context. I should report this, but maybe I can still proceed with mutating the layout component positions. It’s worth a try to read the docs for more insight.
Use Placement tool
Inspect current setup
Create placement notes
Run checks only
Inspect, place, check

Top Board Manufacturing Readiness Report
Updated: 2026-05-28
Current Top-Board Configuration
  • Board size: 40 mm x 40 mm
  • Shape: rounded square / rectangle with 8 mm corner radius
  • Components: all current top-board components retained; no components removed
  • Stackup: Standard 4 Layer (Custom)
  • Approximate configured stackup thickness from layer table: 1.331 mm based on the listed overlay, paste, mask, copper, prepreg, and core layers
  • Requested thickness: 0.8 mm
  • Result: 0.8 mm is not currently applied. The active achievable stackup is approximately 1.33 mm. The user previously accepted 1.52 mm if 0.8 mm is not possible; the current stackup is thinner than 1.52 mm but still not 0.8 mm.
Completed This Pass
  1. Resized the PCB from 32 mm x 32 mm to 40 mm x 40 mm with 8 mm corner radius.
  2. Re-ran component placement with extra spacing.
  3. Resolved the previously blocking physical placement issues:
    • C10/L3 pad overlap: resolved during wider-board placement.
    • C28/C29 pad overlap: resolved during wider-board placement.
    • R13 partly outside board: resolved; no outside-boundary warning for R13 remains.
    • Blocked U3/J7 escape from tight placement: significantly improved by spreading parts and reducing board density.
  4. Removed/verified no dangling trace warnings remain before routing.
  5. Ran board validation. Current board validation reports the board is valid.
Remaining Non-Blocking Board Validation Warnings
The validator still reports same-net overlapping pins around the U3 ground exposed-pad/VSS pad cluster. This is expected for grouped same-net ground pads and is not a different-net short.
It also reports R2/R6 same-net overlap on 3V3_MAIN. This is same-net and not a short between different signals, but should still be visually reviewed before final manufacturing.
Routing Status
Routing could not be started because the previous stale auto-layout job is still active in the project:
  • Active job: auto-layout-c27cbec8-768f-41db-96ff-756b48e08359
  • Status: outOfCredit
  • Router response: a new auto-route job cannot start until the existing job is completed, cleared, or discarded.
I retried routing again on 2026-05-28 and received the same blocker. I do not currently have a tool/action available in this session that can cancel or discard that stale job. This must be cleared in the project UI if a discard control is visible, or by Flux support/system controls before a new routing job can be launched.
Current DRC Snapshot After Placement
A fresh DRC query still reports 140 airwire errors because routing has not run. This is expected while the board is unrouted.
No dangling trace warnings were found in the pre-routing check.
Manufacturing Export Gate
Manufacturing export was not generated because the design fails the mandatory pre-export gate:
  • Airwires remain.
  • Autorouting is blocked by the stale out-of-credit job.
Exporting Gerbers, drill, BOM, pick-and-place, assembly drawings, STEP, DRC report, or schematic PDF now would produce an incomplete manufacturing package.
Required Next Step
Clear/discard the stale auto-layout job auto-layout-c27cbec8-768f-41db-96ff-756b48e08359 from the project. After that, the current 40 mm placement is ready for a new routing attempt.
Once the stale job is cleared:
  1. Run auto-route.
  2. Re-run DRC.
  3. Fix any remaining routing/clearance/floating-copper issues.
  4. Export the manufacturing package only after the DRC gate passes.
  • Current Top-Board Configuration

  • Completed This Pass

  • Remaining Non-Blocking Board Validation Warnings

  • Routing Status

  • Current DRC Snapshot After Placement

  • Manufacturing Export Gate

  • Required Next Step