PCB Net Routing Assistance

Diagnostic confirmed: the L2/L3 zones have copper geometry but are missing net assignments (effectiveNetId is null), so DRC treats them as decorative copper, not net-bound planes.

Fix in two steps:

STEP 1 — Create missing zones with explicit net assignment

The L2 GND zone and L3 3V0 dominant zone do not exist as proper queryable nodes. Create them now:

a) L2 GND PLANE

Layer: Mid-Layer 1 (L2)
Net: GND (assign explicitly — set effectiveNetId / net property)
Shape: circle, diameter 57.4mm, centred at (0, 0) — slightly smaller than the 58mm board outline to maintain 0.3mm edge clearance
Fill type: solid copper pour
Connection style: thermal relief to net-matching pads
Thermal relief: 4 spokes, 0.4mm spoke width, 0.3mm clearance
Stitching density: 2mm

b) L3 3V0 DOMINANT POUR

Layer: Mid-Layer 2 (L3)
Net: 3V0 (assign explicitly)
Shape: circle, diameter 57.4mm, centred at (0, 0), MINUS the two existing island regions (VSYS and 1V8_SGP41) — i.e., the 3V0 pour fills L3 everywhere EXCEPT inside the islands
Fill type: solid copper pour
Connection: thermal relief, same parameters as L2

STEP 2 — Assign net to existing islands

The L3 VSYS and L3 1V8_SGP41 island zones exist but have no net assignment. Set them now:

c) L3 VSYS ISLAND

Existing zone at (10, 18), 10×12mm
Net: VSYS (assign explicitly — currently has no effectiveNetId)

d) L3 1V8_SGP41 ISLAND

Existing zone at (-10, 22), 8×8mm
Net: 1V8_SGP41 (assign explicitly)

After Step 1 and Step 2:

Force a pour rebuild / fill regeneration on all 4 zones
Verify each zone now reports a valid effectiveNetId matching its intended net
Re-run DRC and report:
- New total airwire count
- Specifically the GND, 3V0, VSYS, 1V8_SGP41 airwire counts
- Render each layer (L1, L2, L3, L4) separately so I can verify the copper fills look correct

Expected result: airwire count should drop dramatically (from 170 to under 30), because most of the GND/3V0/VSYS airwires resolve through the now-net-bound planes.

If after this the count is still > 50, do NOT iterate further. Report back and stop. I'll handle the next decision from outside Flux.

Thought for 10 sec

flux

I’ll attempt the four-zone net binding exactly as specified, then verify DRC and layer rendering. First I’m checking whether the layout editor exposes net assignment for copper pours; if it does, I’ll apply the plane fixes and validate immediately.

Thought for 22 sec

flux

Blocked: I can’t complete this safely because the current layout controls do not expose any editable net/effectiveNetId/net-name property for zones. I verified that connectedLayers, shape, stitching, and thermal-style rules exist, but net, Net Name, and effectiveNetId are not valid editable zone rules.

I did not create more decorative copper, because that would repeat the same failure mode. The next decision needs to happen outside this interface: bind the copper pours to nets in the PCB editor/API, then rerun DRC and layer renders.

Find zone net UI

List airwires by net

Inspect zone properties

Export layout data

Files

Schematic

Layout

Preview

Haelo Clip v2 PCB Configuration

Board outline

Shape: circular
Diameter: 58 mm
Centre: PCB origin (0, 0)

Stackup as configured

Template: custom-standard-4-layer
L1 Top Copper: Signal
L2 / Mid-Layer 1: Ground Plane
L3 / Mid-Layer 2: Power Plane
L4 Bottom Copper: Signal
Tool-reported stackup thickness: 1.30 mm
Requested fabrication thickness recorded in project metadata: 1.0 mm finished
Surface finish recorded in project metadata: ENIG
Solder mask: black
Silkscreen: white

Mounting holes

All are configured as HOLE pads with no connected copper layers.

Table

Hole	Position (mm)	Drill
M2 Mount Hole 12 o'clock	(0, +27)	2.2 mm
M2 Mount Hole 4 o'clock	(+23.4, -13.5)	2.2 mm
M2 Mount Hole 8 o'clock	(-23.4, -13.5)	2.2 mm

SPS30 mount holes

Configured as HOLE pads with no connected copper layers.

Table

Hole	Position (mm)	Drill
SPS30 M1.6 Mount Hole Left	(-17.3, 0)	1.8 mm
SPS30 M1.6 Mount Hole Right	(+17.3, 0)	1.8 mm

Battery rear pads

Both are on Bottom / Layer 4, 3 mm x 4 mm SMD pads, Direct connect / no thermal relief.

Table

Pad	Position (mm)	Size
BAT+	(-5, 0)	3 mm x 4 mm
BAT-	(+5, 0)	3 mm x 4 mm

Rear-side keepout and marker

Rear copper keepout: 38 mm diameter circular zone centred at (0, 0), on Bottom / Layer 4.
VHB pad marker: 35 mm diameter circle centred at (0, 0), on Bottom silkscreen.

L2 ground plane

L2 has been changed from Signal to Ground Plane in the stackup.
An explicit circular zone named L2 Continuous GND Plane was added at (0, 0), 58 mm diameter, on Mid-Layer 1.
This represents the continuous GND plane across the board; drill/hole clearance and via clearance are handled by pad/hole/keepout rules.

L3 power regions

L3 is configured as a Power Plane layer with three explicit, separate copper regions on Mid-Layer 2:

Table

Region	Position (mm)	Size	Purpose
L3 3V0 Dominant Region	(0, 0)	58 mm x 20 mm	Main 3V0 power region
L3 1V8_SGP41 Island	(0, +17)	10 mm x 10 mm	Upper-third 1V8_SGP41 island
L3 VSYS Island	(0, -17)	10 mm x 10 mm	Lower-third VSYS island

Notes

Placement and routing were not run.
The standard stackup template currently reports 1.30 mm total thickness, while the requested fabrication target is 1.0 mm finished thickness. The 1.0 mm target is recorded as fabrication metadata for manufacturing selection.
The L3 regions are preliminary fixed regions before component placement; after placement, their positions can be fine-tuned to sit exactly under the SGP41 and nPM1100 zones without changing the three-region power-plane architecture.

Fixed front-side component placement

The following Layer 1 / Top components were placed and marked protected = true so later placement should not move them.

Table

Component	Position (mm)	Rotation Z	Note
J1	(0, -25)	0 deg	USB-C at 6 o'clock; adjusted inward from -27 so the connector edge is near the circular board outline
SW1	(+27, 0)	90 deg	Tactile switch at 3 o'clock rim
J2	(-13, +18)	180 deg	SPS30 connector between 10 and 11 o'clock, cable exit toward 9 o'clock
D5	(+5, +22)	0 deg	LED_STATUS green
R12	(+5, +20.5)	0 deg	LED_STATUS resistor adjacent to D5
D6	(+8, +22)	0 deg	LED_FW_ERR red adjacent to D5
R13	(+8, +20.5)	0 deg	LED_FW_ERR resistor adjacent to D6
D2	(-8, -20)	0 deg	LED_CHG amber near USB/power zone
D3	(-12, -20)	0 deg	LED_ERR_CHG red adjacent to D2
J3	(-18, -15)	-45 deg	Tag-Connect front-face SWD access between 7 and 8 o'clock

No other components were auto-placed during this step.

Board outline
Stackup as configured
Mounting holes
SPS30 mount holes
Battery rear pads
Rear-side keepout and marker
L2 ground plane
L3 power regions
Notes
Fixed front-side component placement