Wearable Health Patch


Prepared the PCBWay DFM submission materials and regenerated the STEP model. I can’t submit to PCBWay directly from Flux, but these files are ready for you to upload to PCBWay’s rigid-flex/HDI quote channel for engineering feedback.
Project files:
Upload package:
Open items:
  • Final assembly is still incomplete: DRC has unresolved airwires.
  • Use these files for PCBWay engineering review only, not fabrication release.
  • After PCBWay provides the approved stackup/via table, manually finish AD5940/ADS1292 fanout, clear airwires, rerun DRC, then regenerate final exports.
I’ll inspect the current PCB state, determine whether placement, routing, or both need work, then run the appropriate auto-layout operations and verify the applied result.
Blocked: your account currently has no available ACUs, so AI inspection and auto-layout operations are unavailable.
Current known project state:
  • 6-layer rigid-flex working layout.
  • AD5940 support placement previously reorganized.
  • PCBWay HDI-oriented rules applied.
  • Last verified state had 24 unresolved airwires.
No PCB changes were made in this session. Remaining work is to inspect the latest board state, determine whether placement and/or routing is needed, run auto-layout, apply the result, and verify DRC once ACUs are available.
Check ACU balance
List airwires
Check DRC/ERC
Manual placement review

PCBWay DFM Submission Instructions — Neura Vital Patch
Status
Prepared for PCBWay engineering review only. The design is not ready for fabrication release because final DRC still has unresolved airwires.
Files to Upload to PCBWay
Upload these files together through PCBWay's rigid-flex / HDI quote channel:
  1. Latest Gerber ZIP from Flux.
  2. Manual Routing Fix Report.
  3. PCBWay DFM Review Request markdown file.
  4. STEP model for mechanical/assembly review.
  5. BOM/Pick-place only if PCBWay requests assembly context; do not place assembly order yet.
Message to PCBWay
Please review this as a pre-fabrication DFM/stackup study for a biomedical wearable rigid-flex prototype. The design intentionally still contains unresolved airwires and needs your approved stackup/rules before final manual routing.
Please confirm:
  • 6-layer rigid-flex stackup.
  • Rigid island under AD5940BCBZ-RL7 0.4 mm pitch WLCSP/BGA.
  • Minimum trace/space allowed in the AD5940 rigid island.
  • Whether 75 um trace/space is acceptable.
  • Laser microvia diameter, capture pad, and aspect ratio.
  • Whether via-in-pad is allowed, and if filled/capped vias are required.
  • Whether stacked or staggered microvias are allowed.
  • USB-C same-net VBUS/GND pad geometry acceptability.
  • Bottom-side 0402 passives near AD5940.
  • Minimum bend radius and no-component/no-via bend-zone requirements.
  • USB 2.0 impedance stackup data and recommended D+/D- geometry.
After PCBWay Responds
  1. Replace the provisional Flux stackup/rules with PCBWay's approved stackup and via table.
  2. Manually complete AD5940/ADS1292 fanout using approved microvia/via-in-pad rules.
  3. Re-run DRC until airwires are zero.
  4. Regenerate Gerbers/BOM/PnP/STEP only after final DRC is clean.
Warning
Do not order this revision for assembly. Use it only for PCBWay engineering feedback and manual routing repair.
  • Status

  • Files to Upload to PCBWay

  • Message to PCBWay

  • After PCBWay Responds

  • Warning