Temperature and Humidity Sensor Design

Applied changes.

0:01

nets {

net USB_DP = J1:DP1, J1:DP2, D1:1, D1:6;

net ESP_EN = U3:EN, R5:P2, C10:P1;

net GND = C3:P2, U3 GND - U3 GND:GND, U3:41, U3:50, U3:49_3, U3:11, U3:38, U3:40, U3:37, U3:39, U3:46, U3:51, U3:49_7, U3:52, J1 SHIELD - D1 GND:GND, U3:1, U3:49_8, U3:2, U3:49_9, U3:48, U1 SHDN_N - IC1 EP:GND, IC1:EP, J1 GND_A - J1 GND_B:GND, J1:GND_A, U3:49_1, U1:PAD, R1:P2, R7 P2 - R9 P2:GND, R7:P2, U3:14, J1:SH4, J1:SH2, J1:SH1, J1:SH3, C12:P2, C8:P2, C13:P2, C2:P2, R2:P2, C5:P2, C1:P2, C10:P2, R9:P2, U3:42, U3:43, U3:44, U3:49_5, U3:47, R11:P2, C9:P2, U3:36, IC1:VSS, U1:SHDN_N, U1:MODE, J1:GND_B, U3:49_6, U1:PGTH, U3:49_4, U3:49_2, U2:GND, U3:45, C6:P2, U3:53, C4:P2, U1:GND, C7:P2, D1:GND;

net 3V3 = IC1:VDD, C13:P1, D2:K, C9:P1, L1:P2, C7:P1, C5:P1, R3:P1, C12:P1, C6:P1, C4:P1, U2:FB, D2:A, R4:P1, R5:P1, U3:3V3, R6:P1;

net VBUS_5V = J1:VBUS_A, J1:VBUS_B, C1:P1, D1:VBUS, U1:1, U1:2, Q1:D;

net CC2 = J1:CC2, R2:P1;

net CC1 = J1:CC1, R1:P1;

net BOOT_STRAP = R6:P2, U3:IO9;

net I2C_SCL = U3:IO10, R4:P2, IC1:SCL;

net USB_DN = J1:DN1, J1:DN2, D1:3, D1:4;

net I2C_SDA = R3:P2, U3:IO8, IC1:SDA;

}

flux

Work done
  • Completed the protected USB-C sensor-node schematic around J1, U1, U2, U3, and IC1.
  • Added connector-side ESD protection with D1, the external blocking FET Q1, buck bootstrap parts D2 and C11, TPS26630 threshold/programming resistors R7 through R11, and added local decoupling including C12 and C13.
  • Wired the full power tree and interfaces: USB-C CC pull-downs R1/R2, protected 5 V path, 3.3 V buck rail, ESP32 enable/boot straps with R5, R6, C10, and the I2C sensor bus with R3 and R4.
  • Updated the permanent requirements and architecture record in Project Specification.
Success criteria review
  • ✅ USB-C 5 V input is integrated with CC termination, front-end ESD, and a TPS26630 protection stage covering reverse-blocking behavior, OVP, UVLO, and OCP programming.
  • ✅ The system includes a digital temperature/relative-humidity sensor via IC1 on I2C to the Wi-Fi + BLE MCU U3.
  • ✅ The schematic is fully interconnected with named power and interface nets and is ready to move into PCB layout work.
Next steps I can continue straight into PCB layout setup: board sizing, stackup selection, and intelligent placement with the ESP32 antenna kept at the board edge. If you want, I can do that next.
Place components intelligently
Run design review
Tighten USB protection
Sign up to send
J1 SHIELD - D1 GND
J1 GND_A - J1 GND_B
J1 GND_A - J1 GND_B
U1 SHDN_N - IC1 EP
J1 GND_A - J1 GND_B
J1 DN1 - J1 DN2
J1 VBUS_A - J1 VBUS_B
J1 DN1 - J1 DN2
J1 CC2 - R2 P1
J1 VBUS_A - J1 VBUS_B
J1 DP1 - J1 DP2
J1 CC1 - R1 P1
J1 DP1 - J1 DP2
J1

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USB-C Wi-Fi BLE Env Sensor Node

USB-C Wi-Fi BLE Env Sensor Node thumbnail
Low-power USB-C powered environmental sensor node with a protected 5 V USB-C sink input, TPS26630 front-end protection for reverse/OVP/UVLO/OCP, efficient 3.3 V buck regulation, ESP32-C3 Wi-Fi plus BLE connectivity, and an I2C SHT41 temperature/relative-humidity sensor. The design targets robust operation from USB-C sources advertising 0.5 A to 3 A and is being completed as a schematic ready for PCB layout.

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