PCB Routing Assistance

Applied thermal relief to the targeted GND/DGND/VSS pads on the board: Relief connect, 4 spokes, 0.25 mm spoke width, 45° spoke angle. The follow-up check shows airwire errors on GND-related pads/fill stitching, so the pour may need repour/reroute cleanup next; I did not change placement or routing.
Hey, there are a lot of nets that have "GND" in their name, can you connect anything with "GND" in its net name to the main GND connection?
I’ll find every net whose name contains “GND”, merge those into the main GND net in the schematic, then run ERC/DRC connectivity checks to catch any remaining split grounds.
I checked the schematic netlist and there are no separate “GND” nets to merge: everything ground-related is already on the main ^GND net, including DGND-labeled pins. The remaining GND/DGND items are PCB airwires to ground pads/fill/stitch vias, so the next fix would be repouring/rerouting GND copper rather than changing schematic connectivity.
Repair GND routing
Run route evidence
Check manufacturing readiness
Inspect thermal reliefs
J1
U1
Manufacturer Part Number
ESP32-S3-WROOM-1-N16R8
U20
U2
U11
U12
J30
U10
J2
C11
Capacitance
10nF
J4
C18
Capacitance
10µF
C3
Capacitance
10µF
C4
Capacitance
100nF
C24
Capacitance
100nF
C2
Capacitance
10µF
C19
Capacitance
100nF
C16
Capacitance
1µF
C14
Capacitance
10µF
C6
Capacitance
100nF
C12
Capacitance
10nF
C13
Capacitance
10nF
C23
Capacitance
100nF
C5
Capacitance
100nF
C10
Capacitance
100nF
C17
Capacitance
100nF
C40
Capacitance
10nF
C1
Capacitance
10µF
C20
Capacitance
100nF
C22
Capacitance
100nF
C8
Capacitance
100nF
C9
Capacitance
100nF
C60
Capacitance
10µF
C21
Capacitance
100nF
C70
Capacitance
100nF
C15
Capacitance
10µF
C7
Capacitance
100nF
U6
R14
Resistance
4kΩ
R4
Resistance
4.7kΩ
R8
Resistance
10kΩ
R10
Resistance
1kΩ
D1
R12
Resistance
1kΩ
R17
Resistance
10kΩ
R19
Resistance
10kΩ
R2
Resistance
5.1kΩ
R6
Resistance
10kΩ
R11
Resistance
1kΩ
R1
Resistance
5.1kΩ
R3
Resistance
4.7kΩ
R7
Resistance
10kΩ
R9
Resistance
1kΩ
U9
U8
R5
Resistance
10kΩ
R16
Resistance
10kΩ
R15
Resistance
4kΩ
U7
R20
Resistance
4kΩ
R13
Resistance
4kΩ
Q1
J14
J20
J19
LED2
J11
J12
U3
LED1
U4
BT1
L1
Inductance
3.3µH
IC1
J13
Q2
J10
U5
J21
SW2
SW1
U30
F1
D10
D11

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Post-Routing PCBA Review and Blockers
Routing Status
The stuck Auto-Layout session was cleared by the user and autorouting was retried.
  • Initial routing pass completed and added 1290 routing nodes.
  • One cleanup routing pass was run after deleting bad fragments and added 15 routing nodes.
  • Further routing attempts were stopped because the second pass produced minimal improvement, matching the retry limit guidance.
Current Manufacturing Gate Result
The board is not yet ready for JLCPCB PCBA export.
Remaining blocking issues:
  • 7 airwire errors remain, mainly SHIELD/GND/via-stitch related plus one LTE_PWRKEY trace stub condition.
  • 1 floating copper error remains, likely associated with a mounting-hole/through-hole object.
  • 1 dangling trace warning remains in the LTE_PWRKEY cleanup area.
  • R18 is intentionally/unresolved floating at schematic level and should be reviewed or removed if not required.
Because airwires remain, Gerber/BOM/CPL/assembly package export was intentionally skipped to avoid producing a nonfunctional manufacturing package.
MAX31865 / PT1000 Answer
The MAX31865 circuits are integrated on the PCB. The design contains four MAX31865AAP+T ICs:
  • U20: PT1000-1 RTD-to-digital converter.
  • U10: PT1000-2 RTD-to-digital converter.
  • U11: PT1000-3 RTD-to-digital converter.
  • U12: PT1000-4 RTD-to-digital converter.
PT1000 probes connect directly to the board terminals. External MAX31865 plug-in modules are not required for the current production-PCBA design.
Note: MAX31865AAP+T is listed as a JLCPCB Extended part, not Basic, so assembly cost may be higher than Basic passives.
SIM7600 / LTE Answer
The SIM7600 modem itself is not included as an assembled SMT module in the BOM. The design currently provides a 6-pin LTE expansion header, J18, using Samtec TSW-106-07-G-S.
J18 connections:
  • 5V protected power.
  • GND.
  • LTE RX/TX UART.
  • PWRKEY.
  • LTE status.
The SIM7600 modem should therefore be treated as customer-supplied / external expansion hardware unless a specific SIM7600 module footprint is added later.
LTE Antenna Answer
No dedicated LTE antenna connector is currently included on this carrier board. There is no U.FL/IPEX/SMA/on-board LTE antenna footprint for SIM7600 in the current design.
Antenna handling is expected to be part of the external SIM7600 module. If the carrier should directly host the SIM7600 module, add the exact module footprint and its required RF antenna connector, typically U.FL/IPEX on the module or SMA via a cabled pigtail/enclosure bulkhead.
  1. Manually inspect and fix the remaining SHIELD/GND airwires around USB shield/ground and stitch vias.
  2. Remove or correctly connect the residual LTE_PWRKEY dangling trace/stub.
  3. Investigate the floating through-hole object reported as 11e9277b; if it is an NPTH mounting hole, confirm whether the DRC warning can be safely accepted or adjust the hole definition.
  4. Decide whether R18 is needed; connect it properly or remove it.
  5. Rerun DRC.
  6. Generate JLCPCB Gerber/BOM/CPL/PDF/STEP only after airwires and copper errors are cleared.
  • Routing Status

  • Current Manufacturing Gate Result

  • MAX31865 / PT1000 Answer

  • SIM7600 / LTE Answer

  • LTE Antenna Answer

  • Recommended Next Engineering Actions

Ascent Condensation Intelligence Monitor Carrier FINAL thumbnail
Arduino Nano ESP32 industrial carrier board for the Ascent Condensation Intelligence Monitor with environmental, PT1000, condensation, RTC, SD, LiDAR, LTE expansion, relay, buzzer, and protected field interfaces.

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