PCB Routing Assistance

Applied thermal relief to the targeted GND/DGND/VSS pads on the board: Relief connect, 4 spokes, 0.25 mm spoke width, 45° spoke angle. The follow-up check shows airwire errors on GND-related pads/fill stitching, so the pour may need repour/reroute cleanup next; I did not change placement or routing.
Hey, there are a lot of nets that have "GND" in their name, can you connect anything with "GND" in its net name to the main GND connection?
I’ll find every net whose name contains “GND”, merge those into the main GND net in the schematic, then run ERC/DRC connectivity checks to catch any remaining split grounds.
I checked the schematic netlist and there are no separate “GND” nets to merge: everything ground-related is already on the main ^GND net, including DGND-labeled pins. The remaining GND/DGND items are PCB airwires to ground pads/fill/stitch vias, so the next fix would be repouring/rerouting GND copper rather than changing schematic connectivity.
Repair GND routing
Run route evidence
Check manufacturing readiness
Inspect thermal reliefs
J1
U1
Manufacturer Part Number
ESP32-S3-WROOM-1-N16R8
U20
U2
U11
U12
J30
U10
J2
C11
Capacitance
10nF
J4
C18
Capacitance
10µF
C3
Capacitance
10µF
C4
Capacitance
100nF
C24
Capacitance
100nF
C2
Capacitance
10µF
C19
Capacitance
100nF
C16
Capacitance
1µF
C14
Capacitance
10µF
C6
Capacitance
100nF
C12
Capacitance
10nF
C13
Capacitance
10nF
C23
Capacitance
100nF
C5
Capacitance
100nF
C10
Capacitance
100nF
C17
Capacitance
100nF
C40
Capacitance
10nF
C1
Capacitance
10µF
C20
Capacitance
100nF
C22
Capacitance
100nF
C8
Capacitance
100nF
C9
Capacitance
100nF
C60
Capacitance
10µF
C21
Capacitance
100nF
C70
Capacitance
100nF
C15
Capacitance
10µF
C7
Capacitance
100nF
U6
R14
Resistance
4kΩ
Q1
J14
R4
Resistance
4.7kΩ
R8
Resistance
10kΩ
R10
Resistance
1kΩ
D1
J11
R12
Resistance
1kΩ
R17
Resistance
10kΩ
J12
R19
Resistance
10kΩ
R2
Resistance
5.1kΩ
R6
Resistance
10kΩ
R11
Resistance
1kΩ
R1
Resistance
5.1kΩ
R3
Resistance
4.7kΩ
R7
Resistance
10kΩ
R9
Resistance
1kΩ
U9
J13
Q2
U8
R5
Resistance
10kΩ
R16
Resistance
10kΩ
R15
Resistance
4kΩ
U7
R20
Resistance
4kΩ
R13
Resistance
4kΩ
J20
J19
LED2
U3
LED1
U4
BT1
D10
L1
Inductance
3.3µH
IC1
SW2
SW1
U30
J10
U5
D11
J21
F1

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PCBA Routing Blocker and Placement Cleanup Notes
Status
The production ESP32-S3 PCBA redesign has been cleaned up for manufacturable placement, but it is not ready for JLCPCB PCBA export because PCB copper routing is incomplete.
Work Completed
  • Preserved the 120 mm × 100 mm, 4-layer board setup.
  • Preserved connector grouping:
    • Power/USB/communications on the left edge.
    • PT1000 / field sensor terminals on the right edge.
    • Condensation connectors along the bottom edge.
  • Preserved mounting holes and field-service layout intent.
  • Improved placement around the ESP32-S3 support circuitry for better pad access and future routing.
  • Kept the ESP32-S3 antenna/keepout intent intact.
  • Confirmed routing feasibility check passes: the board is considered valid and ready for routing.
Current Blocker
The PCB still contains unresolved airwires. These represent logical schematic connections that do not yet have copper traces on the PCB. JLCPCB PCBA files should not be generated from this state because the manufactured board may not electrically function.
Why Exports Were Not Generated
Per the manufacturing release gate, Gerber/BOM/CPL/assembly outputs should only be generated after critical DRC checks are clean, especially:
  • No airwires.
  • No missing footprints.
  • No invalid layers.
  • No overlapping copper between different nets.
At this checkpoint, airwires remain, so production export is intentionally blocked.
  1. Cancel or clear the stuck Flux autoroute job if possible, then run routing.
  2. If autoroute remains blocked, route the board manually in a PCB editor using this order:
    • USB-C D+/D− and VBUS.
    • ESP32-S3 power, EN, BOOT, USB, UART/programming.
    • 3V3/5V power distribution and ground plane stitching.
    • microSD SPI and RTC/SEN66/LiDAR I2C.
    • MAX31865 SPI/chip-select and PT1000 analog front-end connections.
    • Condensation sensor ADC inputs with pull-ups/filters/ESD.
    • LTE header UART/reset/PWRKEY/power.
    • LEDs, buzzer, relay/alarm outputs.
  3. Rerun DRC/ERC after routing.
  4. Generate JLCPCB Gerber, BOM, CPL/pick-and-place, assembly drawings/PDF, STEP/GLB only after checks are clean.
Manufacturing Risk if Exported Now
High. The PCB would likely be missing electrical connections because routed copper is incomplete.
  • Status

  • Work Completed

  • Current Blocker

  • Why Exports Were Not Generated

  • Recommended Resolution

  • Manufacturing Risk if Exported Now

Ascent Condensation Intelligence Monitor Carrier FINAL thumbnail
Arduino Nano ESP32 industrial carrier board for the Ascent Condensation Intelligence Monitor with environmental, PT1000, condensation, RTC, SD, LiDAR, LTE expansion, relay, buzzer, and protected field interfaces.

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