1. 12V enters through J1.
2. F1 limits fault current during Rev A validation.
3. D1 provides reverse-polarity protection.
4. Protected 12V feeds pogo contacts J2 pins 1 and 2 and U1 VIN.
5. U1 generates 3.3V for ESP32 logic, pull-ups, and indicator LED.
6. ESP32 GPIO21 maps to DATA/SDA.
7. ESP32 GPIO22 maps to ID/SCL.
8. ESP32 GPIO16 maps to DETECT.
9. Pull-ups R2/R3 establish an I2C-compatible open-drain bus.
10. Test points expose all important rails and interface signals.

1. J3 pin 1 passes directly to J4 pin 1: 12V_A.
2. J3 pin 2 passes directly to J4 pin 2: 12V_B.
3. J3 pins 3/4 pass to J4 pins 3/4: duplicated ground return.
4. J3 pin 5 passes to J4 pin 5: DATA/SDA.
5. J3 pin 6 passes to J4 pin 6: ID/SCL.
6. J3 pin 7 passes to J4 pin 7: DETECT.

1. 12V_A from J5/J6 feeds U7 VIN.
2. U7 creates local 3.3V for U3.
3. U3 SDA connects to DATA/SDA.
4. U3 SCL connects to ID/SCL.
5. A0/A1/A2/WP are tied to GND for a fixed Rev A EEPROM address and write-enabled prototype behavior.
6. R4 connects ID/SCL to GND as an analog/simple ID option for first firmware experiments.
7. J6 provides optional pass-through to modules above.

Text
[1 12V_A] [2 12V_B] [3 GND_A] [4 GND_B] [5 DATA] [6 ID] [7 DETECT]

• Use large ENIG-plated circular or rounded-rectangle pads.
• Keep solder mask openings generous and symmetric.
• Put silkscreen labels near the pads but not under pogo travel.
• Add orientation triangle or asymmetric mechanical keying.
• Magnets provide gross alignment; plastic/metal locating geometry should provide final anti-rotation so pogo pins are not used as alignment dowels.
• Keep magnet centers mechanically referenced to the contact datum.
• Do not place ferromagnetic parts near antennas or current-sense circuitry without testing.

• Nominal input: 12V DC.
• Prototype fuse: 500mA hold current.
• Rev A safe continuous demonstration load target: approximately 300mA total stack current.
• Short duration test ceiling: below the selected polyfuse trip behavior and pogo pin current rating.
• Logic load: ESP32 development board can draw roughly 80mA to 250mA depending on Wi-Fi activity.
• Smart ID EEPROM/regulator load is small compared with LED load.

1. Treat every exposed pogo contact as user-accessible low-voltage power.
2. Keep Rev A at 12V DC and current-limited.
3. Validate worst-case contact temperature rise under load.
4. Measure voltage drop from base to top of stack.
5. Use duplicated power and ground contacts for current sharing.
6. Add ESD protection to DATA/ID/DETECT in the next revision if external handling tests show susceptibility.
7. Avoid assuming pogo pin current rating from catalog headline values; derate based on compression, plating, contamination, and cycle life.
8. Provide a defined fault response in firmware: detect overcurrent, disable outputs if a controllable load switch is added, and indicate fault state.

Diagram

• module_type
• hardware_revision
• serial_number
• material_or_finish_code
• lifecycle_status
• manufacturing_lot
• supported_capabilities
• authentication_or_integrity_field placeholder

• Use wide copper for 12V_A, 12V_B, GND_A, and GND_B.
• Flood unused area with GND on bottom layer.
• Keep DATA/ID away from high-current switching LED traces.
• Place test points at board edges where possible.
• Keep regulator input/output capacitors close to regulator pins.

1. Inspect polarity and continuity before applying power.
2. Apply 12V current-limited bench supply.
3. Confirm protected 12V after F1/D1.
4. Confirm 3.3V_BASE at TP3.
5. Confirm D2 indicator lights.
6. Confirm DATA/ID pull up to 3.3V.
7. Confirm DETECT state changes when a module is connected.

1. Measure 12V at the top contacts of the pass-through module.
2. Load the top of stack at 100mA, 200mA, and 300mA.
3. Record voltage drop across each contact pair.
4. Record contact temperature rise.
5. Repeat after multiple mating cycles.

1. Read analog/resistor ID value through firmware or bench test.
2. Probe I2C bus and confirm pull-ups.
3. Read AT24C02 EEPROM address.
4. Store and read module metadata fields.
5. Remove/reinstall module and verify configuration recognition repeatability.

1. Confirm magnets align contacts before pogo compression.
2. Verify orientation markings prevent reversed mating.
3. Check pogo compression range.
4. Cycle modules repeatedly and inspect pad wear.

• Confirm pogo pad geometry with selected pogo pin compression and travel.
• Use ENIG surface finish for contact pads.
• Keep silkscreen clear of contact pads.
• Verify board outline and mounting holes against mechanical CAD.
• Confirm connector footprints and hole sizes.
• Confirm all generic passives have values, package sizes, voltage ratings where needed.
• Verify BOM MPNs and alternates.
• Run ERC/DRC before export.
• Export Gerbers, BOM, pick-and-place, assembly drawing, and STEP model.
• Photograph populated boards with labeled interface contacts for patent/support material.

1. A standardized magnetic electrical interface for vertically stackable modules.
2. Electrical pass-through using duplicated low-voltage power contacts and shared ground returns.
3. Reserved conductors for data communication through stacked modules.
4. Embedded identification elements on a module PCB.
5. Module metadata storage and retrieval.
6. Automatic configuration recognition by a powered base.
7. A scalable interface that can support non-lighting modules using the same mechanical/electrical standard.

• Gerber ZIP including copper, solder mask, silkscreen, board outline, and drill files.
• BOM CSV with designators, MPNs, values, and quantities.
• Pick-and-place / centroid file for SMT assembly.
• Assembly drawing with designators and polarity markers.
• Schematic PDF or screenshot.
• PCB top/bottom screenshots showing pogo pad layout and silkscreen labels.
• STEP file for mechanical integration.
• High-resolution render or photo for patent exhibits.
• Interface control drawing showing pin numbering, polarity, and magnetic alignment datum.

• The current Flux project contains all three PCB schematic groups in one proof-of-concept workspace. For production release, split Base Controller, Pass Through Module, and Smart ID Test Module into separate PCB projects so each can have its own board outline and manufacturing export.
• The 7-position header parts are schematic/layout placeholders for the standardized pogo pad interface. Final pogo footprint geometry must match the selected pogo pin vendor and mechanical stack.
• The DETECT line should receive a defined pull-up/pull-down strategy in a later electrical refinement.
• ESD protection on exposed DATA/ID/DETECT contacts should be added before field testing.