Revisión de Pines Flotantes


Avance realizado:
  • Reorganicé el layout por zonas:
    • Digital/sensores/alimentación lógica a la izquierda.
    • Foso central libre entre digital y potencia/HV.
    • HV/CDI en la parte inferior derecha: C_HV, Q1, D3/D4, U6, PAD_AC_IN, PAD_AC_RET, PAD_SPARK, PAD_SPARK_RET.
    • Auxiliares en la parte superior derecha: Q2/Q3, D5/D6, PAD_AUX1, PAD_AUX2, PAD_AUX_GND.
  • Mantuvimos todos los componentes en Top.
  • La última pasada de colocación reportó que ya no hay componentes fuera de placa ni solapes principales.
Pendiente:
  • No pude continuar con más verificación/ruteo porque no hay ACUs disponibles.
  • Falta correr DRC/ERC final después de la última colocación.
  • Falta enrutar la PCB y configurar/confirmar plano de GND.
  • Falta revisar que las rutas HV mantengan separación suficiente después del ruteo.
Siguiente paso cuando haya ACUs: correr verificación DRC/ERC completa, enrutar con plano GND y revisar separación HV/digital antes de fabricación.
Enruta primero las pistas HV con clearance amplio y después las señales digitales.
Voy a enrutar primero las redes HV con clearance amplio, luego las señales digitales/auxiliares, y al final correré ERC/DRC para revisar separaciones y airwires.
Listo. Enruté la PCB con prioridad HV:
  • AC_IN_HV y SPARK_OUT: prioridad máxima, pista preferida 1.5 mm y clearance 2.5 mm.
  • Luego se enrutaron GND, alimentación, sensores y señales digitales.
  • Ajusté D3, D4, Q3, D6, C7 y R17 para liberar pads antes del ruteo.
  • Autoroute aplicado: 349 trazas/vías.
Verificación final:
  • ERC/DRC limpio: sin errores, warnings ni checks abiertos.
  • Sin airwires.
  • Sin solapes de cobre/trazas.
  • Sin capas inválidas ni trazas colgantes.
Estimated time saved vs. manual EDA workflow: ~4–6 horas.
Review, label and export
Revisa manufacturabilidad
Agrega silkscreen
Genera reporte final
Exporta fabricación

Pre-Layout Zone Classification — Smart CDI Motorcycle ECU
Final quick anomaly scan
Checked review categories:
  • ERC floating pins
  • ERC no-connect handling
  • ERC shorted components
  • ERC missing power pins
  • ERC single-pin / undriven nets
  • Missing PCB footprints
  • Parts availability
  • MPN and datasheet checks
Result: no open errors or warnings were reported by the queried checks.
Engineering notes before layout:
  • The BOM metadata intentionally overrides several original library part names:
    • Q1 library part name is 2N6509G, but approved BOM MPN is BT151-600R / TO-220 SCR equivalent.
    • Q4 library part name is IRFR420ATRPBF, but approved BOM MPN is IRFZ44N / TO-220 MOSFET equivalent.
    • U3 library part name is AP2112K-3.3TRG1, but approved BOM MPN is AMS1117-3.3 / SOT-223 equivalent.
  • This is acceptable as a workshop/manual-BOM design decision, but footprints/pinouts must be visually verified before routing and fabrication.
  • SG3525 timing values are provisional: R25 = 15kΩ, C12 = 1nF. Tune these on bench for the real transformer and target charge rate.
  • C_HV, T1, Q1, and U5 remain manual-approved safety-critical items; do not auto-substitute.
Power / High-Voltage Zone
Place these together in a physically isolated HV/power region with wide traces, creepage, and no digital routing through the zone.
Battery input and automotive protection
  • J1 — 12 V battery input terminal, 5.08 mm THT
  • D2 — S3M reverse/input diode path
  • D1 — SMBJ15A TVS transient clamp
  • L1 — 47uH input filter inductor
  • C4 — 100nF protected 12 V bypass
  • C5 — 10uF protected 12 V bulk/local bypass
  • C11 — 100nF protected 12 V bypass
  • C21 — 470uF protected 12 V bulk capacitor
  • TP1 — 12V_PROTECTED test point
  • R21 — 0Ω star-ground link between GND_POWER and digital return point near J1 negative
5 V buck / power conversion
  • U2 — XL1509-5.0E1 buck regulator
  • L2 — 100uH buck inductor, CD75 intent
  • D9 — SS34 buck catch diode
  • C6 — 220uF 5 V output bulk capacitor
  • C7 — 100nF 5 V output bypass
  • C8 — 10uF 5 V output capacitor
  • TP2 — 5V_OUT test point
SG3525 / flyback charger primary
  • U4_SG3525 — SG3525 PWM controller
  • R22 — 22Ω IRFZ44N gate resistor
  • R23 — 10kΩ IRFZ44N gate-source pulldown
  • R25 — 15kΩ SG3525 RT timing resistor
  • C12 — 1nF SG3525 CT timing capacitor
  • C20 — 100nF SG3525 REF decoupling capacitor
  • Q4 — IRFZ44N TO-220 flyback MOSFET, BOM override
  • T1 — EE25 / validated CDI flyback transformer
  • C19 — 10nF switch-node/snubber-related capacitor
Flyback secondary, CDI storage, SCR discharge
  • D3 — US1M fast HV rectifier
  • D4 — US1M HV clamp/freewheel/protection path
  • C_HV — 1.5uF HV CDI film capacitor, manual THT/mechanical item
  • Q1 — BT151-600R TO-220 SCR, BOM override
  • R24 — 1kΩ SCR gate-cathode pulldown
  • R8 — 100Ω opto/SCR gate resistor
  • C13 — 10nF SCR gate/noise suppression capacitor
  • U6 — MOC3021S opto trigger
  • R7 — 220Ω opto LED input resistor
  • J2 — coil output terminal, 5.08 mm THT
  • TP4 — HV_FB test point
  • TP5 — SCR_FIRE/GPIO27 trigger test point
  • R18, R19, R20 — HV feedback divider / feedback network
Auxiliary low-side outputs, power side
  • Q2 — AO3400A AUX1 low-side MOSFET
  • Q3 — AO3400A AUX2 low-side MOSFET
  • R14, R16 — 100Ω gate resistors
  • R15, R17 — 10kΩ gate pulldowns
  • D5, D6 — RS1M output protection diodes
  • CN2 — auxiliary output connector
Digital / Control Zone
Place these in the low-voltage digital/control region. Keep them away from the flyback switch node, HV capacitor, SCR, coil connector, and transformer.
ESP32 core and programming
  • U1 — ESP32-WROOM-32UE-N4
  • J6 — PROG_UART 1x6 2.54 mm programming header
  • SW1 — DIP/config switch
  • SW2 — BOOT/IO0 switch
  • SW3 — EN/reset switch
  • R1 — 10kΩ EN pullup
  • R2 — 10kΩ IO0/BOOT pullup
  • R3, R4, R5, R6 — 10kΩ pullups/pulldowns for DIP/GPIO support
  • C1 — 10uF 3V3 bulk near ESP32
  • C2 — 100nF ESP32 local decoupling
  • C3 — 1uF EN/reset/boot support capacitor
  • C9 — 10uF regulator/output bulk near U3/ESP32
  • C10 — 100nF ESP32/3V3 local decoupling
  • C18 — 100nF digital local decoupling
  • TP3 — 3V3 test point
3.3 V regulator
  • U3 — AMS1117-3.3 metadata override / 3.3 V regulator
  • C9, C10, C18 — local input/output bypassing for 3.3 V rail, final placement must match actual AMS1117 stability guidance
VR pickup interface and analog sensor input
  • U5 — MAX9924 VR sensor interface, manual-approved safety-critical item
  • J3 — VR pickup connector
  • TP6 — VR_OUT / VR_PULSE test point
  • C16 — 100nF MAX9924 VCC decoupling
  • C17 — 10nF MAX9924 threshold/filter capacitor
  • R12 — 2.2kΩ MAX9924/signal support resistor
  • CN1 — sensor connector
  • J5 — sensor connector / 5 V sensor power interface
  • R9, R10 — TPS/sensor divider
  • R11, R13 — analog input protection/filter resistors
  • C14, C15 — analog input filter capacitors
  • D7, D8 — BZT52C3V3 input clamps
  • TP6 — VR output debug test point
Digital-side test/debug points
  • TP2 — 5V_OUT test point, place near 5 V distribution but accessible from digital edge
  • TP3 — 3V3 test point near ESP32/U3
  • TP5 — GPIO27/SCR trigger scope point near ESP32 side of opto input
  • TP6 — VR_OUT scope point near MAX9924 output
Components with mixed-boundary placement
These sit at the isolation boundary and should be oriented to keep current/noise flow one-way:
  • U6 MOC3021S: LED/input side toward ESP32/digital; output/MT side toward SCR/power.
  • R7: physically near U6 input pin and ESP32 GPIO27 trace; short trace to U6 LED.
  • R8/R24/C13: physically near Q1 gate/cathode, not near ESP32.
  • R21: physically at the single star point close to J1 pin 2 / battery negative. It is the only intentional GND_POWER-to-digital tie.
  • TP4 HV_FB: accessible but physically outside the pure digital core; route divider output away from switch-node noise.
Mandatory physical-neighborhood instructions
Decoupling and regulator stability
  • C16 must be directly beside U5 VCC/GND pins.
  • C20 must be directly beside U4_SG3525 REF/GND pins.
  • C12 and R25 must be close to U4_SG3525 CT/RT/DISCH pins with no long routing.
  • C1/C2/C10/C18 should be distributed close to ESP32 3V3/GND pins; keep one 100nF as close as possible to U1.
  • C9 and the required AMS1117 input/output capacitors must be placed tight to U3 pins. Verify the actual AMS1117 footprint/pinout and ESR/cap requirements before fabrication.
  • C6/C7/C8 must be close to the 5 V buck output and U2/L2/D9 loop.
  • C4/C5/C11/C21 must be close to the protected 12 V input distribution and flyback/buck feed.
High-current / switching loops
  • R22 must sit directly at Q4 gate; the SG3525-to-R22 trace may be longer than R22-to-gate, but keep both short.
  • R23 must sit directly between Q4 gate and source.
  • Q4, T1 primary, C19/snubber components, and the 12 V input bulk capacitors must form the smallest practical loop.
  • Keep FLYBACK_SWITCH copper short, wide where appropriate, and isolated from all ESP32/MAX9924/sensor traces.
  • D3 must be close to T1 secondary and C_HV charge path; minimize HV loop area.
  • C_HV, Q1, J2 coil output, and D4 must be clustered as the CDI discharge loop with short, wide HV traces.
  • R24, R8, and C13 must sit close to Q1 gate/cathode.
Grounding / isolation
  • Treat GND_POWER as the return for flyback, buck, SCR, coil, auxiliary outputs, and input protection.
  • Treat digital return/GND as the return for ESP32, MAX9924, sensor conditioning, programming header, and logic switches.
  • Join the two domains only through R21 at the battery negative/star point near J1 pin 2.
  • Do not pour digital ground under the flyback switch node, transformer primary, SCR anode/cathode discharge loop, or coil output connector.
  • Do not route MAX9924 input or ESP32 GPIO traces through the HV/power zone.
Connectors and mechanical placement
  • J1 and J2 must sit at the board edge with mechanical clearance for 5.08 mm wiring.
  • J3/CN1/J5 should sit on the sensor/digital edge, away from J2 coil output and transformer.
  • J6 PROG_UART should sit near U1 but on an accessible board edge.
  • T1 and C_HV need mechanical keepouts and mounting validation; do not crowd small SMD passives under/around their mechanical envelope.
Is it cleared for PCB mode?
Cleared for entering PCB placement mode with strict constraints:
  • Use two hard zones: HV/power and digital/control.
  • Place before routing; do not auto-route before manual/constraint-based placement.
  • Preserve 6 mm clearance from HV/CDI nets to digital signals.
  • Use 2.5 mm minimum on HV/CDI discharge nets, 1.0 mm on power rails, and 0.3 mm on logic/sensor traces as previously configured.
  • Visually verify TO-220 pinouts for Q1/Q4 and SOT-223 pinout for U3 before routing.
  • Bench-tune SG3525 timing/compensation values after first prototype.
Conclusion: the schematic is electrically clean enough to proceed to PCB placement, but not directly to final auto-routing/fabrication until the part-name/MPN override footprints and HV creepage are visually checked.
  • Final quick anomaly scan

  • Power / High-Voltage Zone

  • Battery input and automotive protection

  • 5 V buck / power conversion

  • SG3525 / flyback charger primary

  • Flyback secondary, CDI storage, SCR discharge

  • Auxiliary low-side outputs, power side

  • Digital / Control Zone

  • ESP32 core and programming

  • 3.3 V regulator

  • VR pickup interface and analog sensor input

  • Digital-side test/debug points

  • Components with mixed-boundary placement

  • Mandatory physical-neighborhood instructions

  • Decoupling and regulator stability

  • High-current / switching loops

  • Grounding / isolation

  • Connectors and mechanical placement

  • Is it cleared for PCB mode?