The HY2120 Kelvin-sensing work completed, but I could not retrieve and reconcile its final report before execution ended.
Confirmed work from this session:
- Added dedicated Kelvin branches from:
- U6 VSS → RS1 BATT_NEG-side land
- U6 CS/R38 → Q2 source land
- Removed the previous remote sense branches.
- Preserved component placement, USB routing, MOTOR_B Kelvin routing, high-current copper, and the 0.10 mm spacing rule.
- Latest verified board state:
- 0 airwires
- 0 blocking DRC errors
- 17 intentional redundant-copper groups retained
- The last reviewed qualification still had two unresolved release gates:
- Proving isolation of the Q2 Kelvin pickup via from Bottom/Mid-Layer-2 load-current copper.
- Conservatively bounding the internal RS1–Q1–Q2 copper resistance and confirming positive margin below the HY2120’s 170 mV minimum overcurrent threshold.
The final executor was specifically working on those two gates, but its result was not available for reconciliation. Therefore, the board is not yet approved for manufacturing, and no new manufacturing exports were generated.
Remaining work:
- Retrieve and review the final Kelvin-sensing report.
- Confirm the 10.565 A / 500 ms hot overcurrent margin.
- Run an independent final ERC/DRC and protection-path review.
- Verify JLCPCB BOM stock and via/stencil requirements.
- Update firmware and bring-up documentation.
- Regenerate Gerbers, BOM, CPL, STEP, PDF, and IPC-D-356 files.
Execution stopped because your ACUs ran out.