IoT Fire Alarm Device Design


You should ask Quectel / supplier for the EC25MXGA hardware design package, not just the marketing datasheet.
Ask for:
  1. EC25MXGA Hardware Design Guide
    • Full pin descriptions
    • Power supply requirements
    • PWRKEY / RESET timing
    • UART / USB / SIM / RF reference circuits
    • VDD_SDIO usage guidance
  2. Recommended PCB land pattern / footprint
    • Pad dimensions
    • Pad numbering
    • Paste mask / solder mask recommendations
    • Keepout zones under/around the module
    • Assembly notes
  3. Reference schematic
    • VBAT_RF / VBAT_BB decoupling
    • SIM socket wiring
    • Antenna matching / ESD
    • Status pins
    • Power-on/off sequence
  4. RF layout guidelines
    • 50 Ω antenna routing
    • Ground stitching via recommendations
    • Antenna connector/matching network placement
    • Diversity/GNSS pins if used or unused
  5. Certification documents
    • RCM / ACMA / AS/CA S042 relevance
    • Carrier approval info for Australia
    • LTE band support for AU carriers
    • Test reports if available
  6. Lifecycle / supply confirmation
    • Active production status
    • Recommended replacement if EC25MXGA is not preferred
    • Minimum order / lead time
Short message you can send:
We are designing a dual-modem Australian fire alarm signalling device using 2 × EC25MXGA. Please provide the EC25MXGA hardware design guide, recommended PCB land pattern/footprint, reference schematic, RF layout guide, SIM interface recommendations, VDD_SDIO connection guidance, Australian carrier/certification documentation, and lifecycle/supply status.
Ok I’ll contact them
Good plan. Ask them specifically for the hardware design guide + recommended PCB land pattern for EC25MXGA-128-SNNS.
Until we get that, the safest path is:
  • Keep EC25MXGA in the design.
  • Do not send the PCB to manufacture yet.
  • Continue with placement/routing cleanup only as a draft.
  • Finalize modem footprint, SIM wiring, RF layout, and VDD_SDIO treatment once Quectel confirms the official guidance.
Clean draft layout
Review EC25 wiring
Check power budget
Update factory checklist
Run current checks

Schematic Capture Status — Power Block
Completed in schematic
Added and wired the first power-stage components:
  • J1: 2-position 5.08 mm field power input terminal.
  • D1: SMBJ24A TVS for input transient protection.
  • U1: LTC4368 input protection controller for OV/UV/reverse-supply protection.
  • Q1/Q2: PSMN5R2-60YLX 60 V N-channel MOSFETs as back-to-back input protection pass FETs.
  • U2: LM46002-Q1 class buck for 3.3 V system rail.
  • U3/U4: LM46002 placeholders for Modem A/B 4.0 V rails.
  • L1-L3: 4.7 µH high-current buck inductors.
  • C1-C4: 100 µF bulk capacitors for input and output rails.
  • C11-C13: 100 nF bootstrap capacitors.
  • C14-C16: 100 nF VCC bypass capacitors.
  • C17-C19: 10 nF soft-start capacitors.
  • R1-R3: PGOOD pull-ups.
  • R4/R5/R20: RT timing resistor placeholders.
  • R9-R12: LTC4368 UV/OV threshold divider placeholders.
  • R13: LTC4368 fault pull-up.
  • R14-R19: regulator feedback divider placeholders.
Nets created/wired
  • VIN_RAW
  • PROTECT_FET_COMMON
  • PROTECT_FET_GATE
  • VIN_PROTECTED
  • 3V3_SYS
  • 4V0_MODEM_A
  • 4V0_MODEM_B
  • SW_3V3
  • SW_MODEM_A
  • SW_MODEM_B
  • FB_3V3
  • FB_MODEM_A
  • FB_MODEM_B
  • PGOOD_3V3
  • PGOOD_MODEM_A
  • PGOOD_MODEM_B
  • PWR_PROTECT_FAULT_N
  • GND
Verification status
A focused ERC/component check was run after wiring and removing unused placeholders. No matching ERROR/WARNING/OPEN checks were returned for the selected ERC/component review categories at that point.
Important caveats
  • U3/U4 are still placeholders: LM63440-Q1 was not found in the current Flux library. Replace U3/U4 with LM63440-Q1 or another documented 4 A modem buck before final PCB design.
  • UV/OV divider, RT, soft-start, and feedback values are provisional and must be calculated against the exact selected IC datasheets.
  • LTC4368 MOSFET orientation and sense topology should be checked against the datasheet/reference schematic before layout.
  • The modem rails are schematic-planning complete, not final power-design complete.
Next schematic step
Proceed to the STM32H757 core block: MCU, decoupling, reset/boot, SWD, USB-C programming/service, oscillator/RTC, and initial power-good/fault monitoring inputs.
  • Completed in schematic

  • Nets created/wired

  • Verification status

  • Important caveats

  • Next schematic step