USB-C Thumb Drive Design

I’ll make SM2320 the primary architecture and create a concise vendor-request checklist you can send to Silicon Motion/NAND partners.
Done — I made SM2320 the primary architecture and created the exact Silicon Motion request checklist here: SM2320 Vendor Request Checklist.
In short, request:
  • Full SM2320 datasheet, ball map, footprint, and reference schematic.
  • USB-C implementation guidance, especially whether an external orientation mux is required.
  • NAND approved-vendor list with exact Kioxia/Micron part numbers and supported capacities.
  • Firmware / mass-production tool access and VID/PID/product-string configuration flow.
  • Power, thermal, high-speed layout, reflow, and production-test guidance.
  • NDA, MOQ, lead time, lifecycle, and approved partner information.
Do not design the final SM2320 schematic from the public product brief alone; we need the full engineering package or partner support first.
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SM2320 Vendor Request Checklist
Decision
Primary architecture is now Silicon Motion SM2320 + matched NAND for a fast own-PCB USB-C storage product.
Goal to communicate
We are designing a compact custom PCB USB-C storage product using the SM2320 portable SSD controller. We need Silicon Motion or an approved module/NAND partner to provide the engineering package required to design, prototype, program, and manufacture a 256 GB-class or similar capacity device.
Exact items to request from Silicon Motion
1. Controller documentation
  • Full SM2320 datasheet, not just the public product brief.
  • Complete pinout and ball map for the exact package.
  • Package mechanical drawing and recommended PCB footprint.
  • Pin electrical characteristics and unused-pin handling.
  • Boot/configuration strap pin definitions.
  • Reset, power-good, sleep, suspend, and activity LED behavior.
2. Reference design package
  • Complete SM2320 reference schematic.
  • Reference PCB layout files or layout screenshots.
  • BOM for the reference design.
  • Recommended USB-C front-end implementation.
  • Confirmation whether external USB-C orientation muxing is required or whether SM2320 handles CC/orientation internally.
  • Recommended ESD protection part specs for USB2 and SuperSpeed/Gen2x2 lanes.
  • Common-mode choke guidance, if any.
3. NAND compatibility
  • Approved NAND vendor list / AVL.
  • Exact supported NAND part numbers for 256 GB, 512 GB, and any other recommended capacity points.
  • Supported NAND package types and ball maps.
  • Required number of NAND channels, CEs, dies, and packages for each capacity/performance target.
  • Supported Kioxia BiCS and Micron TLC/QLC options.
  • NAND speed grade requirements.
  • Whether the controller supports mixed NAND revisions or only validated lots.
4. Firmware and production tools
  • Mass-production tool / MPTool access for SM2320.
  • Firmware image generation/configuration process.
  • NAND parameter table configuration process.
  • VID/PID, product string, serial number, and capacity configuration process.
  • Factory test flow and pass/fail criteria.
  • Whether tools require a license, dongle, NDA, or approved manufacturing partner.
  • Recommended Windows version/test fixture requirements for programming.
5. Power and thermal design
  • Required input rails and tolerances.
  • Peak/inrush current, active read/write current, idle current, suspend current.
  • Power sequencing requirements.
  • Required decoupling capacitor values and placement rules.
  • Thermal design guidance for sustained writes.
  • Expected controller and NAND temperature rise at target speeds.
  • Any throttling behavior and thermal limits.
6. High-speed PCB layout rules
  • USB 3.2 Gen2x2 differential impedance targets.
  • Intra-pair and pair-to-pair skew limits.
  • Maximum USB trace length and via count.
  • AC-coupling capacitor requirements and placement.
  • NAND bus routing constraints, length matching, impedance, and via rules.
  • Recommended stackup for a compact 4-layer or 6-layer PCB.
  • Ground stitching / return path requirements.
7. Compliance and manufacturing
  • USB-IF compliance status or test guidance.
  • EMI/ESD test recommendations.
  • Reflow profile and MSL rating.
  • Assembly handling requirements for SM2320 and NAND packages.
  • Boundary scan/test-point recommendations.
  • Reliability/endurance qualification data.
8. Commercial / support questions
  • Minimum order quantity for SM2320.
  • Whether Silicon Motion sells directly or through approved module/NAND partners.
  • Recommended partners who can supply matched NAND + firmware support.
  • Lead time and lifecycle status.
  • Whether Serene Industries can access the docs/tools under NDA.
  • Whether they can support a small prototype run before production.
Email template
Subject: SM2320 engineering package request for compact USB-C storage product
Hello Silicon Motion team,
Serene Industries is developing a compact custom PCB USB-C storage product using a native USB controller and NAND flash. We are evaluating SM2320 as the primary controller architecture.
Could you please provide the engineering package or connect us with an approved partner for SM2320-based product development? We need the full datasheet, ball map, reference schematic, layout guide, recommended PCB footprint, NAND approved-vendor list, firmware/mass-production tool access, and production programming workflow.
Our target is a compact USB-C storage PCB, initially around 256 GB-class capacity, with potential variants depending on supported NAND and sourcing. Please confirm recommended NAND part numbers, required NAND topology, USB-C orientation handling, power requirements, and whether external USB-C muxing is required.
We would also like to understand NDA requirements, MOQ, lifecycle status, lead time, and whether Silicon Motion or an approved partner can support a small prototype run before production.
Best, Serene Industries
Design note
Do not start final schematic capture around SM2320 until the full pinout, reference design, NAND AVL, and production-tool path are confirmed. The public product brief is not enough to safely design the board.
  • Decision

  • Goal to communicate

  • Exact items to request from Silicon Motion

  • 1. Controller documentation

  • 2. Reference design package

  • 3. NAND compatibility

  • 4. Firmware and production tools

  • 5. Power and thermal design

  • 6. High-speed PCB layout rules

  • 7. Compliance and manufacturing

  • 8. Commercial / support questions

  • Email template

  • Design note

Fast USB-C Soldered Flash Drive

Fast USB-C Soldered Flash Drive thumbnail
Fast USB-C thumb-drive carrier for a managed solder-down USB 3.x flash module, targeting permanently attached 128 GB, 256 GB, or 512 GB storage.

Properties

Properties describe core aspects of the project.

Pricing & Availability

Distributor

Qty 1

Arrow

$1.12–$35.86

Digi-Key

$1.40–$87.72

HQonline

$1.47–$1.51

LCSC

$4.23–$4.33

Mouser

$4.51–$6.25

TME

$0.12–$0.24

Verical

$2.58–$18.35

Controls