DOGS Placement Eval Run


The placement pass is complete: all 130 parts are inside the board with no reported overlaps, bounds, keepout, edge, or switching-stage findings. I’m independently checking the result and final design-review status before closing.
Thought for 5 mins 3 sec
Thought for 20 sec
Awaiting 1 task
"PCB Placement Review" completed.
Independent review found three local bypass/bootstrap refinements: C28 at U2 and C22/C38 at U6. The edge connectors are correctly aligned to the board edge and intentionally overhang mechanically; I’m applying those three fixes and re-running explicit placement checks.
Thought for 9 mins 7 sec
Thought for 9 sec
Thought for 7 sec
Awaiting 1 background task
"PCB Placement Complete" completed.
All 130 components are placed on the 100 × 100 mm board. U2/U3/U5/U6 power stages are compact, including corrected placement of bootstrap/bypass capacitors C28, C22, and C38.
Open items
  • 182 airwires remain, as expected before routing.
  • Edge connectors intentionally overhang the outline while their edge rules remain aligned.
Suggested next steps
  1. Configure power-net widths and copper zones.
  2. Route the switching stages first.
  3. Route remaining signals and run full DRC.
  4. Clean up silkscreen and test-point labels.

Routing Preflight Handoff
Disposition
Do not start auto-route yet. Bounded preparation reduced live preflight anomalies 63 → 45 → 30 over three checks / two corrective passes. Every check retained 110 components / 71 nets. All remaining preflight findings are engine Warnings, not engine Errors, but the engine says the affected pins will be excluded from routing: they are routing-readiness blockers, not waived advisories.
No auto-route or surgical routing was started. No component position, rotation, side, board dimensions, silkscreen, schematic wiring, MPN, package property or footprint geometry was changed. Only eleven new width rulesets and deterministic neckdown copper were authored. Manufacturing profile and physical stackup were preserved.
Assigned-scope status

Table


ItemStatusEvidence / blocker
Live rules, stackup, power budget/spec reviewCompletedLow Density Profile (SMD) v3; Standard 4 Layer v1; 35 µm copper on all four copper layers; 50 × 60 mm, existing 1 mm corners
Individual power widths and GND defaultCompleted, screening assumptions belowTen rulesets in first batch, one residual control-width ruleset in second bounded pass; no current-required power width reduced to suppress a warning
Neckdown generationCompletedEach of two generate calls reported 46; final inventory is 46 routeSegment nodes, not 92, plus two existing vias
USB data-pair determinationCompletedJ1 DN1, DN2, DP1, DP2 explicitly no-connect; SBU1/SBU2 also no-connect
Protected USB data breakoutUnattempted intentionally / not applicableNo connected USB data pair exists; no breakout authored
U6 overlap investigationCompleted diagnostic investigation; correction blockedCustom-pad/clearance representation conflict described below; datasheet numerical land-pattern extraction insufficient for safe geometry replacement
U6 footprint correctionUnattempted intentionallyNo verified replacement geometry; do not shrink or replace its thermal pad to make a warning disappear
L3/L4/L5/L6 live footprint inspectionCompletedPackage names and numerical live geometry recorded below; no speculative replacements
Recheck after correctionsCompletedThree total checks, ending at 30 anomalies; stopped within requested bound
Clear all routing prerequisitesFailed / blockedExact residual pin list below; manufacturing-clearance/profile and custom-pad questions remain in addition to placement advisories
Whole-board regeneration / placement edits / auto-routeUnattempted intentionallyProhibited scope
Width/current assumptions
Source requirements are from existing power-budget-design-notes and project-specification, not freshly certified protection tolerances. The former has stale L5/L6 entries; live BOM takes precedence for inductors. The specification's old 70-net count is stale; live preflight is 71.
Width screening used IPC-2221 external-conductor relation I = 0.048 × ΔT^0.44 × A^0.725, with A in mil², 35 µm copper and 10 °C rise. These are conservative planning widths, not IPC-2152 thermal validation, guaranteed fault-current ratings, or voltage-drop signoff. Apply these widths to outer-layer power conductors; inner-layer power routing needs fresh sizing. Short fine-pitch neckdowns require local copper spreading, RMS/temperature and via-current review after routing. Wide traces do not validate the converter's loop geometry.

Table


Exact netsWidthCurrent basis
GND0.20 mmApplied manufacturing minimum for stitching only. It is not a sufficient sole return conductor for system current; continuous GND planes/local return copper must be checked before routing signoff.
USB_VBUS_RAW, USB_5V_PROT1.00 mm1.5 A guaranteed source; documented U10 2.25 A high corner used as screening envelope; calculated 0.919 mm
SOLAR_PROT0.85 mm1.67 A × 1.25 = 2.0875 A; calculated 0.829 mm
MUX_OUT0.75 mmCharger input high corner 1.50 A × 1.25 = 1.875 A; calculated 0.715 mm
BATTERY, SYS_PRE_UVLO, SYS_BAT, CHARGER_SW1.40 mm3 A planning envelope; max normal battery-only load about 1.63 A, 25% margin about 2.04 A. Charger/system charging headroom included. CHARGER_SW 3 A RMS envelope is an assumption, not a peak-current/fault guarantee; calculated 1.367 mm
3V3_RAW, 3V3_OUT0.25 mm500 mA required; 0.64 A nominal protection × 1.25 = 0.8 A screening; calculated 0.221 mm
AUX5_RAW, AUX12_RAW, AUX_OUT0.45 mmAUX5 500 mA / AUX12 100 mA normal; approximately 1 A isolation target × 1.25 = 1.25 A screening; calculated 0.409 mm. Not the guaranteed eFuse worst-case corner.
3V3_SW1, 3V3_SW2, AUX12_SW0.60 mmBudget 3V3 input 0.647 A and AUX12 input 0.50 A at 3 V battery. Conservative 1.5 A RMS envelope with ripple headroom; calculated 0.526 mm. Final waveform check remains required.
AUX5_SW1, AUX5_SW20.85 mmBudget 0.98 A input at 3 V; conservative 2.1 A RMS envelope with ripple headroom; final waveform check remains required.
Low-current widths set to 0.20 mm, without reducing the 0.20 mm manufacturing floor:
  • First batch: USB_EFUSE_DVDT, USB_EFUSE_UVLO, USB_EFUSE_ILIM, USB_EFUSE_OVLO, AUX5_DVDT, EN_AUX5, AUX5_EFUSE_ILIM, AUX5_OV_SENSE, AUX12_DVDT, EN_AUX12, AUX12_EFUSE_ILIM, AUX12_OV_SENSE, USB_CC1, USB_CC2.
  • Second residual batch: INPUT_VALID_N, CHARGE_STATUS_N, CHARGER_BOOT, CHARGER_ILIM, CHARGER_ISET, CHARGER_VCC, NTC, CHARGER_TMR, CHARGER_VLIM, U3_SUPPLY_LOGIC, 3V3_FB, 3V3_VAUX, 3V3_EFUSE_DVDT, 3V3_EFUSE_ILIM, AUX5_FB, U5_PS_SYNC, AUX5_VAUX, AUX12_BOOT, SYS_UVLO_DVDT, SYS_UVLO_SENSE, SYS_UVLO_ILIM.
All other nets retain existing effective defaults. No schematic Current properties were changed. Bootstrap/bias widths above apply to short local connections, not external load supply rails.
Exact new rulesets
All rules only set traceWidth; none changes clearances or geometry.

Table


NameUID
Preflight ground stitching widthb5b07702-2165-4e95-acef-e9f3b2b08013
Preflight low current control widthscc66af29-8315-4635-aae3-25c6174b960d
Preflight USB power 2.25 Acdb631ae-4755-48d0-aa00-1d0fb28e6532
Preflight solar power 2.09 A4d39c17e-3a8b-4175-939b-9ddc75955fc3
Preflight charger input 1.875 Aadb2431a-3e08-4312-bd11-4c17dc7b1690
Preflight system battery charger switch 3 Ac09db744-a992-4356-9f4b-8e8df29f8783
Preflight 3V3 output 0.8 Ab06a9706-b54b-4d85-8a30-5a2acc04fa6d
Preflight AUX power 1.25 A305eba42-f188-48c9-8908-3e1393379da4
Preflight 3V3 and 12V switch 1.5 A7b1f89d3-ade2-4ca3-b49b-18ffd734f1e8
Preflight 5V switch 2.1 A2027d3ee-a042-45bd-a3fc-a18a758ee4a7
Preflight residual low-current IC escapesa3c95361-423e-42bc-ad7a-29bed3f376da
U6 overlap diagnosis
U6 is TPS61088RHLR, source part b6114485-fe8d-4e20-b639-69efba540c98, placed at (0, −14) mm. Its electrical mapping agrees with datasheet pin assignments: VCC 1, SS 10, NC 11/12, AGND 20 and PGND 21.
Do not diagnose from the 2D rectangle alone. Current layout_2d renders PGND as 1.6 × 1.6 mm, but published source scene_tree exposes a custom SVG path:
  • Main PGND body approximately x = ±1.03 mm, y = ±1.53 mm.
  • Narrow fingers extend to y = ±2.455 mm, restricted to x within ±0.38 mm (with central notches).
  • VCC/AGND and SS/NC1 pad centers are x = ±0.75 mm, y = ±2.15 mm; each pad is 0.24 × 0.60 mm.
  • These peripheral pad edges reach x = ±0.63 mm. Finger-to-peripheral copper gap from the source coordinates is therefore about 0.25 mm, rather than a physical intersection. The PGND overall bounding rectangle, however, overlaps those peripheral pads.
The evidence favors a custom-pad bounding-box / clearance-rule artifact, not a proven physical pad short. This is not yet a definitive router-conversion diagnosis: the exact contour passed to the routing engine is not exposed here, and published-source geometry alone does not certify the consumed pad conversion. Broad pad clearance rules are also incompatible with the observed gaps: Pad clearance (NPTH proxy) matches every pad with keepOut 0.40 mm/minKeepOut 0.30 mm; Pad-to-pad spacing sets pad(0.50 mm); Hole-to-trace spacing also matches every pad/via. Those rules were preserved, not silently relaxed below the applied manufacturing profile.
The cited datasheet identifies its land-pattern drawing as RHL0020A. The initial extraction supplied numerical thermal-pad and center-spacing claims but failed support validation; those numbers were rejected. A narrowed query did not establish the custom fingers' dimensions. Thus a rectangle replacement, enlargement, shrink, or custom-path rewrite would be an unsupported package correction. No pad edit was made. A source/CAM contour review and a manufacturing-profile/clearance decision are required before declaring U6 safe. Internal diagnostic feedback was attempted but submission failed; no ticket was filed.
Live inductors — discrepancy report, no replacements

Table


PartLive MPN / packageLive local pad geometryCurrent board-space footprint bounds
L374438356015 / SMD_MAPI-4020Two 0.98 × 3.70 mm pads, local centers ±1.185 mm3.35 × 4.20 mm at (7,18.2)
L474438356015 / SMD_MAPI-4020Same as L33.35 × 4.20 mm at (8,4.2)
L5744311150 / SMD_6.8x7.3mmTwo 2.45 × 3.50 mm pads, local centers ±3.025 mm8.50 × 6.60 mm at (−6.8,−12.7)
L674438356010 / SMD_MAPI-4020Same local geometry as L3; existing 270° rotation4.20 × 3.35 mm at (−17.25,−0.2)
The active footprint names match live Package metadata and the prior BOM lockdown report; no fallback chip-package substitution was observed. Nevertheless, the 3.35 × 4.20 mm MAPI drawing envelope and L5 8.50 × 6.60 mm envelope are not proof of actual body-size correctness. L3 datasheet extraction verifies one body-width dimension as 4.1 ±0.2 mm, but did not resolve the orthogonal body length or numeric pad recommendations. This is enough to flag the small-looking envelope for review, not to certify or replace the land pattern. L5 numeric body/pad callouts also remained untranscribed. No reliable prior screenshot/version dimensional baseline was provided, so an actual historical shrink is unverified.
L3's datasheet also explicitly calls for no vias or traces underneath the inductor. This manufacturer layout constraint needs review before final routing; no new body keepout was guessed without complete dimensional evidence. Do not assume the generic footprint implements it automatically.
Exact final 30 preflight anomalies
There are 1 grouped overlap warning + 7 width-exceeds-pad warnings + 22 inaccessible-pin warnings. All remain engine Warning severity.
Grouped overlap (1)
U6 AGND, NC_1, PGND, SS, VCC across GND / AUX12_SS / AUX12_VCC. See custom-pad diagnosis above; do not move U6 as a supposed solution to an intra-footprint representation issue.
Track width exceeds pin size (7)

Table


PinNetRetained width
J1.VBUS_AUSB_VBUS_RAW1.00 mm
R4.P1USB_5V_PROT1.00 mm
U10.VIN_1USB_VBUS_RAW1.00 mm
U10.VIN_2USB_VBUS_RAW1.00 mm
U10.VOUT_1USB_5V_PROT1.00 mm
U10.VOUT_2USB_5V_PROT1.00 mm
U2.SW (engine suffix 71e374a5c9b12aaef2f99cb78602b4bf)CHARGER_SW1.40 mm
These require effective local pad transitions / escape copper after rule and footprint validation. The global power widths must not be reduced merely to clear these warnings. Existing R4 pad minTraceWidth 0.15 mm override was preserved; it did not make this pin routable, and it is not blanket authorization to route below the manufacturing floor.
Inaccessible pins (22)

Table


PartPins and nets
J1CC1 → USB_CC1; CC2 → USB_CC2
U10DVDT → USB_EFUSE_DVDT; ILM → USB_EFUSE_ILIM
U2ISET → CHARGER_ISET
U3EN → U3_SUPPLY_LOGIC
U4DVDT → 3V3_EFUSE_DVDT; EN/UVLO, IN_1, IN_2 → 3V3_RAW; ILM → 3V3_EFUSE_ILIM
U5EN → EN_AUX5
U6BOOT → AUX12_BOOT
U7DVDT → AUX5_DVDT; VIN_2 → AUX5_RAW; VOUT_1, VOUT_2 → AUX_OUT
U8VIN_2 → AUX12_RAW; VOUT_1 → AUX_OUT
U9DVDT → SYS_UVLO_DVDT; EN/UVLO → SYS_UVLO_SENSE; ILM → SYS_UVLO_ILIM
These survive concrete width/neckdown correction. The preflight does not identify an exact obstructing neighbor for each pin, so they are fixed-placement escape blockers, not proven placement-only defects. Manufacturing pad/clearance rules and intra-package escape geometry must be resolved before proposing any component move. No speculative direction/distance is claimed.
Independent read-only checks and actual placement advisories
Fresh selected get_checks review at 2026-09-15T23:01:10.383Z reports six Switching Power Stage warnings and no returned findings for selected overlapping-copper, pad-access, stackup, missing-footprint and neckdown reviews. This narrower review does not overrule the live preflight's 30 pin exclusions.
The six explicit placement-dependent advisories are:
  1. U2.IN → C5.P1 / MUX_OUT: trial path 2.5 mm, air 2.1 mm, detour ×1.21; U2.PGND in corridor. Tool suggests C5 toward IN side or rotating U2.
  2. U2.SW → L6.P1 / CHARGER_SW: 9.1 mm versus 7.2 mm, ×1.27; U2.BST in corridor. Tool suggests L6 toward SW side or rotating U2.
  3. U3.L1 → L3.P1 / 3V3_SW1: 4.4 mm versus 3.3 mm, ×1.36; U3.PGND in corridor.
  4. U3.L2 → L3.P2 / 3V3_SW2: same measurements/corridor.
  5. U5.L1 → L4.P1 / AUX5_SW1: 4.4 mm versus 3.3 mm, ×1.36; U5.PGND in corridor.
  6. U5.L2 → L4.P2 / AUX5_SW2: same measurements/corridor. For 3–6 the tool suggests facing the inductor toward switch pins or rotating the regulator. These remain advisories, not permission to move anything. All component coordinates remained unchanged in readback; all 110 remain Top. Final inventory: 354 pads, 110 footprints, 46 route segments and two vias.
Lead handoff
Bounded preflight preparation is finished, overall routing readiness is not. Preserve the 46 generated neckdowns and justified widths. Resolve the U6 custom-contour conversion/clearance conflict, manufacturing-profile suitability for fine-pitch escape, inductor dimensional/under-body constraints, and the exact residual local transitions before starting auto-route. A different manufacturing profile requires explicit confirmation because it can replace existing rulesets. No additional routing or placement mutation was attempted after the third preflight check.
  • Disposition

  • Assigned-scope status

  • Width/current assumptions

  • Exact new rulesets

  • U6 overlap diagnosis

  • Live inductors — discrepancy report, no replacements

  • Exact final 30 preflight anomalies

  • Grouped overlap (1)

  • Track width exceeds pin size (7)

  • Inaccessible pins (22)

  • Independent read-only checks and actual placement advisories

  • Lead handoff