Rev A Locked Architecture Details

Run AD5940 datasheet limits review only.
Do not modify schematic wiring. Do not add components. Do not change nets.
Review the AD5940 placeholder against datasheet/application-circuit requirements and identify what must be locked before PCB layout.
Check:
  1. Rail requirements:
  • AVDD valid voltage range
  • DVDD valid voltage range
  • IOVDD / digital I/O rail requirement
  • REG_1V8 role
  • whether DVDD_AD5940 may remain tied to MCU_3V3: yes/no/uncertain
  • whether separate 1.8 V rail placeholder is required: yes/no/uncertain
  1. SPI/logic compatibility:
  • whether STM32L552 3.3 V SPI can directly connect to AD5940: yes/no/uncertain
  • whether level shifting may be required: yes/no/uncertain
  1. BioZ/EIS pins:
  • map placeholder nets to likely AD5940 pins/functions: AD5940_I_PLUS_PATH AD5940_I_MINUS_PATH AD5940_V_PLUS_PATH AD5940_V_MINUS_PATH AD5940_CURRENT_SENSE_P AD5940_CURRENT_SENSE_N AD5940_EXC_MON AD5940_AIN_MON
  1. Application-circuit blockers:
  • required external references
  • required RTIA/RLOAD/RCAL components
  • required clock/crystal if any
  • required decoupling not already represented
  • required reset/interrupt/control pins
  1. Pre-layout decision: Choose one: A. Keep AD5940 as placeholder only B. Add separate 1.8 V LDO placeholder C. Add level-shifter placeholder only D. Split DVDD_AD5940 from MCU_3V3 E. Need human datasheet review before schematic changes
Report only:
  • AD5940 rail blockers
  • SPI/logic blockers
  • missing application-circuit components
  • recommended next schematic action
  • whether current AD5940 section is safe for PCB layout: yes/no
I’ll run a read-only AD5940 datasheet-limits review against the current placeholder section, check rails, SPI logic, pin-role mapping, and application-circuit gaps, then report only the blockers and next action.
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Layout and Shielding Rules
EchoS Bank Rev A layout rules:
Analog region:
  • Keep AD5940, HSTIA-related nets, mux COM paths, calibration bank, and electrode input paths compact.
  • Keep mux COM-to-AD5940 paths short, symmetric, and guarded where practical.
  • Keep calibration standards close to the mux/calibration region.
  • Preserve path symmetry between live electrode measurements and internal calibration measurements.
Digital/USB region:
  • Keep USB-C, ESD, CC resistors, MCU USB pins, and MCU digital switching away from AD5940 HSTIA/sense paths.
  • Route USB_DP/USB_DM as controlled differential pair after final stackup review.
  • Keep SPI and mux GPIO away from sensitive analog nodes where practical.
Ground/shield:
  • AGND is analog/mux/calibration reference region.
  • DGND is MCU/USB digital reference region.
  • Do not create a bad split-plane return-current trap under analog paths.
  • Final AGND/DGND connection strategy requires analog PCB engineer review.
  • USB shield/chassis strategy requires enclosure/front-panel review.
Electrode dock:
  • Keep E1-E8 signal paths symmetric.
  • Keep guard/shield strategy consistent across all eight channels.
  • Use premium keyed connector and shielded cable harness.
  • Avoid cheap screw terminals for primary electrode connection.
Rules:
  • Do not modify schematic wiring.
  • Do not add components.
  • Do not modify USB, AD5940, MCU, muxes, electrode dock, or calibration bank.