I renamed the project Retro 5.1 Mini Amplifier and captured the product architecture, features, power assumptions, manufacturing plan, and key risks in the Project Specification.

The next priority is selecting the six-channel amplifier/DSP architecture and producing a detailed power and thermal budget before schematic capture.

I’ll start with the core electrical architecture: calculate the power budget, select production-suitable DSP/audio and six-channel Class-D parts, then build and verify the first schematic stage.

For a $350, 50 W/channel product, 5-way binding posts that accept banana plugs and bare wire are better: stronger contact, thicker wire support, better durability, and a more premium feel. Spring clips are cheaper and smaller, but I’d only use them if compact size and BOM cost are more important than perceived quality; I’ll plan around binding posts unless rear-panel space later forces a change.

The architecture and power budget are defined, with 25 primary components placed—including DSP, codec, MCU, Bluetooth, regulators, and three Class-D amplifiers—and the Project Specification updated. The schematic is not yet wired: optical receiver sourcing, binding-post implementation, support passives, connectivity, and ERC remediation remain; execution stopped because no ACUs are currently available.