The first fixed-placement routing pass completed 29 connections without disturbing the neckdowns or components, but 149 airwires remain in congested U1/U4 regions. I’m verifying the applied copper, then I’ll run one focused cleanup pass on the remaining routes rather than discarding valid work.
The cleanup pass reduced the board to 135 airwires while keeping all valid copper, all neckdowns, and every component position unchanged. I’m running the final independent DRC/geometry check now; any remaining items will be reported as fixed-placement blockers rather than forced into invalid copper.
Created 25 verified 0.10 mm U4 neckdowns first, then added 77 ordinary trace segments across four layers; all 91 components remained exactly fixed, with no routing-created shorts, dangling traces, or invalid-layer copper.
Open: 135 airwires remain due to U1/U4 via-field congestion and blocked header fanout; the board is not fabrication-ready.
Next: Permit targeted component adjustments, increase board/layer capacity, or use HDI microvias to complete routing.
Wirelessly connects nets on schematic. Used to organize schematics and separate functional blocks. To wirelessly connect net portals, give them same designator. #portal
General Purpose Thick Film Standard Power
and High-Power Chip Resistor
47 kOhms ±5% 0.125W, 1/8W Chip Resistor 0805 (2012 Metric) Automotive AEC-Q200 Thick Film
Features:
- RMCF – standard power ratings
- RMCP – high power ratings
- Nickel barrier terminations standard
- Power derating from 100% at 70ºC to zero at +155ºC
- RoHS compliant, REACH compliant, and halogen free
- AEC-Q200 compliant