MIPI CSI-2 Camera Board Design

Thought for 12 sec
Analyzing in depth.
B

bkummert

Yes, please continue with PCB placement and auto-layout.
Place the M12 lens hole (12.5mm) centered 10mm from the top edge.
Place CN1 at the bottom edge, centered.
Place the IMX335 sensor directly under the lens hole.
Then run auto-layout for the remaining components.
B

bkummert

Yes, please continue with PCB placement and auto-layout.
Place the M12 lens hole (12.5mm) centered 10mm from the top edge.
Place CN1 at the bottom edge, centered.
Place the IMX335 sensor directly under the lens hole.
Then run auto-layout for the remaining components.
B

bkummert

Yes, please continue with PCB placement and auto-layout.
Place the M12 lens hole (12.5mm) centered 10mm from the top edge.
Place CN1 at the bottom edge, centered.
Place the IMX335 sensor directly under the lens hole.
Then run auto-layout for the remaining components.
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Project Specification
Overview
Complete MIPI CSI-2 camera daughter board centered on the Sony IMX335LQN-C image sensor. The board accepts 3.3 V input from a 20-pin Hirose DF40C-20DP-0.4V(51) board-to-board connector and generates AVDD 2.9 V, DVDD 1.2 V, and OVDD 1.8 V locally. The sensor outputs a 2-lane MIPI CSI-2 interface plus differential clock, is controlled over I2C at address 0x1A, and uses a 24 MHz external input clock.
Architecture
Diagram



  
    
  
  
    
  
























20 pin board connector
MIPI ESD array 1
MIPI ESD array 2
IMX335 image sensor
I2C reset and enable
24 MHz oscillator
3.3V input
2.9V AVDD regulator
1.2V DVDD regulator
1.8V OVDD regulator
Electrical requirements
  • Sensor: Sony IMX335LQN-C
  • Video interface: 2-lane MIPI CSI-2 with one differential clock pair
  • Control bus: I2C target address 0x1A
  • Input clock: 24 MHz
  • Input supply: 3.3 V
  • Local rails: 2.9 V analog, 1.2 V digital core, 1.8 V I/O
  • MIPI protection: 2 x ST ECMF2-40A100N6 placed at the external connector side
  • Debug access: test points for I2C and key power rails
Mechanical requirements
  • Layout size: 20 mm x 32 mm
  • Stackup: 4 layers
  • Board thickness: 1.0 mm
  • MIPI target impedance: 100 ohm differential
  • Lens opening: 12.5 mm diameter M12 mount hole aligned over the image sensor
Design defaults
  • Use a solid ground plane; do not split analog and digital grounds.
  • Use low-capacitance ESD protection on external high-speed lines and place it close to the connector.
  • Provide local 100 nF decoupling at each sensor supply group plus bulk capacitance per regulator output.
  • Use 1.8 V pull-ups for the sensor control bus unless host-side level requirements later force translation.
Design Summary
Status: Draft / Review / Approved
Manufacturing target: Prototype / EVT / DVT / PVT / Production
Software / firmware: repository link
Scope
Purpose
In scope
Out of scope
System context
Requirements
Functional
Electrical
Mechanical / environmental
Key constraints
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Dependencies
Key risks
Validation
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Release-facing notes
Expected deliverables
Special release notes
Change notes / open questions
Changes in this revision
Open questions

  • Overview

  • Architecture

  • Electrical requirements

  • Mechanical requirements

  • Design defaults

  • Design Summary

  • Scope

  • System context

  • Requirements

  • Functional

  • Electrical

  • Mechanical / environmental

  • Key constraints

  • Dependencies and risks

  • Validation

  • Release-facing notes

  • Change notes / open questions