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Zero-Airwire Completion Campaign
Objective
Finish the validation board from the verified 16-airwire checkpoint using regional reconstruction and explicit prototype wire links.
Authoritative starting state — 2026-09-21
  • 16 airwires
  • 0 redundant traces / 0 redundant groups
  • Retain GND_B14, GND_M2, rebuilt TCK/TMS, R25, the four schematic-only Host-SPI links, eight custom endpoint lands, completed MISO endpoint routing, and the MOSI FPGA escape.
  • The previous 20-, 23-, 24-, 26-, and 27-airwire campaign checkpoints are historical.
Final architecture
PCB copper only
Use real PCB copper and appropriately sized vias for:
  • 2V5 VCCAUX closure
  • Both 3V3 closures
  • Ground
  • CCLK
  • PROGRAMN
  • DONE
  • Any clock, high-current, USB differential, or regulator switching path
Fitted insulated-wire ECOs
Low-speed signals may use intentional 30-AWG insulated assembly wires:
  • Host SPI MISO/MOSI/SCK/CS_N/IRQ
  • SWDIO
  • USB VBUS sense
  • DBG_GATE_ALL
  • CFG1 and CFG_CS_N
  • Reset branches when local copper closure is disproportionately disruptive
Construction standard:
  1. Two separate top-side SMD lands near accessible copper islands.
  2. Short local PCB stubs only, preferably under 5 mm.
  3. Intentional schematic link between separately named net segments.
  4. Insulated wire above the PCB; the cross-board wire is not PCB copper.
  5. Silkscreen/assembly ID, BOM note, cut length, and continuity-test row.
Current Host-SPI implementation already uses R26/R34/R35/R38 as schematic-only links and TP5/TP9/TP11/TP14/TP25/TP26/TP27/TP28 as local custom lands.
FPGA GPIO remapping
Remap ordinary GPIO only when all of the following are proven before mutation:
  • Compatible I/O bank voltage and function
  • Unused ball
  • Clear local escape geometry
  • Reachable destination island
  • Matching FPGA constraints and MCU/firmware documentation update
Never remap power, ground, or dedicated configuration pins.
Region 1 — Complete Host SPI
Retained
  • MISO FPGA side: U1:PT54A -> TP5
  • MISO MCU side: existing MISO copper -> TP9
  • MOSI FPGA side: U1:PT56B -> TP11
  • MOSI MCU side: U2:PA7 -> TP14; TP14 was relocated beside U2 and locally routed.
  • IRQ MCU-side fanout was rebuilt on a new two-layer path to preserve IRQ while freeing the MOSI escape cell.
  • SCK MCU/J5 branches are closed through R65/R66 and lands TP29/TP30.
  • CS_N MCU/J5 branches are closed through R67/R68 and lands TP31/TP32.
  • MISO MCU is remapped from PA6 to PB4 and connected through R69/TP33.
  • CS_N MCU is remapped from PA4 to PA15. PA4 and PA6 are intentional NC and firmware must match.
  • SCK MCU partial: TP13 -> TP26
  • CS_N MCU partial: R22 -> TP28, TP16 -> TP28
Remaining
  • SCK FPGA: TP25 -> U1:PT56A
  • CS_N FPGA: TP27 -> U1:PT58A
  • IRQ: existing copper -> U1:PT20B
Execution order
  1. Preserve the accepted MCU/J5 fitted-wire ECO and STM32 pin remaps.
  2. Verify and retain that reduction.
  3. Preserve MOSI on PT56B.
  4. Resolve SCK FPGA side by a proven GPIO remap or a materially different U1 fanout reconstruction; do not recreate the failed shared PT56A/PT56B corridor.
  5. Resolve CS_N FPGA side by rebuilding the exact PT58A blocking fanout or a proven legal remap.
  6. Resolve IRQ by a local fitted-wire endpoint or changed fanout, not an unchanged direct retry.
Region exit gate: all Host-SPI endpoints have continuity through PCB copper plus documented fitted links; no unexplained Host-SPI airwires remain.
Region 2 — Mandatory power and configuration
Scope:
  • 2V5: VCCAUX_P15 -> VCCAUX_F15
  • Two 3V3 closures, including VCCIO8_P9
  • CCLK
  • PROGRAMN
  • DONE
  • CFG1 and CFG_CS_N
Execution:
  1. Reserve escape cells around mandatory balls.
  2. Move ordinary passives/test points/vias outward as needed.
  3. Delete complete blocking signal branches, not isolated fragments.
  4. Rebuild GND/power first.
  5. Rebuild CCLK/PROGRAMN/DONE.
  6. Restore displaced ordinary signals.
  7. Use fitted links for CFG1/CFG_CS_N only after safe FPGA-side escape lands exist.
BGA rules:
  • 0.10 mm neckdown only for the shortest ball escape.
  • Transition promptly to the required width.
  • Keep ordinary through-vias outside BGA pad-clearance cells.
  • If mandatory power cannot escape safely with the existing through-via stackup, make an explicit HDI/via-in-pad stackup decision instead of forcing violating geometry.
Region exit gate: all mandatory copper paths closed with no shorts, invalid layers, under-connected vias, or inappropriate long neckdowns.
Region 3 — MCU/debug/reset
Scope:
  • U2:PB1 -> R25:P1
  • D3:A -> FPGA_RST_N existing copper
  • SWDIO
  • USB VBUS sense
  • DBG_GATE_ALL
Execution:
  1. Move low-priority passives/test points where needed.
  2. Rebuild the R25 MCU branch as a single non-looping branch.
  3. Attach local wire lands to accessible traces/vias away from dense U2 pads.
  4. Batch remaining fitted links and assembly documentation.
Region exit gate: reset, SWD, VBUS sense, and debug continuity verified with no unexplained airwires.
Hard execution controls
  • One writer modifies the board at a time.
  • No global autorouter.
  • No unchanged retry after a documented failure.
  • Inspect geometry once per region, then execute the whole region.
  • Temporary local conflicts are allowed during reconstruction; judge the completed region.
  • Revert only a completed region that remains electrically unsafe.
  • After each accepted region, update current-pcb-recovery-status, current-routing-handoff, and this campaign together.
Forbidden geometries and methods
  • The old dual PT56A/PT56B corridor; retain MOSI and redesign/remap SCK.
  • Rejected MISO Top/Mid-Layer-5 and via-in-pad/Bottom paths.
  • Board-spanning distributed component footprints.
  • Centralized jumper banks with long routed legs.
  • Jumper lands overlapping endpoint pads.
  • Through-hole jumper placement based only on visible top-side emptiness.
  • Blind Host-SPI pin selection without proven escape geometry.
  • Restoring stale copper removed during reconstruction.
Quantitative release gates
  • Airwires = 0
  • Redundant trace groups = 0
  • Overlapping copper/traces = 0
  • Invalid-layer traces = 0
  • Under-connected vias = 0
  • Protected USB intrusions = 0
  • Introduced component-body overlaps = 0
  • Missing footprints = 0
  • FPGA GND, 2V5, and 3V3 continuity/isolation verified
  • PROGRAMN, DONE, and CCLK verified
  • Host SPI, JTAG, SWD, reset, and USB bridge tested
  • FPGA constraints and STM32 firmware pin map synchronized
  • BOM and assembly drawing include every fitted wire
  • Gerbers and drill files visually inspected
  • IPC-D-356 netlist generated and reviewed
Immediate next milestone
Resolve the two remaining Host-SPI FPGA-side branches (TP25 -> PT56A, TP27 -> PT58A) plus IRQ using proven FPGA pin remaps or changed U1 fanout geometry. Then proceed to mandatory power/configuration reconstruction.
  • Objective

  • Authoritative starting state — 2026-09-21

  • Final architecture

  • PCB copper only

  • Fitted insulated-wire ECOs

  • FPGA GPIO remapping

  • Region 1 — Complete Host SPI

  • Retained

  • Remaining

  • Execution order

  • Region 2 — Mandatory power and configuration

  • Region 3 — MCU/debug/reset

  • Hard execution controls

  • Forbidden geometries and methods

  • Quantitative release gates

  • Immediate next milestone